Patents Assigned to Intel Corporation
  • Patent number: 10263663
    Abstract: Some embodiments include apparatus and methods using an input node, an analog to digital converter (ADC) including an input coupled to the input node, a first feedforward equalizer (FFE) including an input coupled to an output of the ADC, a second FFE including an input coupled to the output of the ADC, and a decision feedback equalizer (DFE) including a first input, a second input, and an output, the first input coupled to an output of the first FFE, and the second input coupled to an output of the second FFE.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Shiva Kiran, Tzu-Chien Hsueh, James E. Jaussi
  • Patent number: 10261814
    Abstract: Methods, software, and apparatus for implementing local service chaining (LSC) with virtual machines (VMs) or virtualized containers in Software Defined Networking (SDN). In one aspect a method is implemented on a compute platform including a plurality of VMs or containers, each including a virtual network interface controller (vNIC) communicatively coupled to a virtual switch in an SDN. LSCs are implemented via a plurality of virtual network appliances hosted by the plurality of VMs or containers. Each LCS comprises a sequence (chain) of services performed by virtual network appliances defined for the LSC. In connection with performing the chain of services, packet data is forwarded between VMs or containers using a cut-through mechanisms under which packet data is directly written to receive (Rx) buffers on the vNICs in a manner that bypasses the virtual switch. LSC indicia (e.g.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Trevor Cooper, Brian J. Skerry
  • Patent number: 10261879
    Abstract: Novel instructions, logic, methods and apparatus are disclosed to test transactional execution status. Embodiments include decoding a first instruction to start a transactional region. Responsive to the first instruction, a checkpoint for a set of architecture state registers is generated and memory accesses from a processing element in the transactional region associated with the first instruction are tracked. A second instruction to detect transactional execution of the transactional region is then decoded. An operation is executed, responsive to decoding the second instruction, to determine if an execution context of the second instruction is within the transactional region. Then responsive to the second instruction, a first flag is updated. In some embodiments, a register may optionally be updated and/or a second flag may optionally be updated responsive to the second instruction.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Ravi Rajwar, Bret L. Toll, Konrad K. Lai, Matthew C. Merten, Martin G. Dixon
  • Patent number: 10264590
    Abstract: Methods, systems, and storage media for dynamic allocation of communication channels among multiple wireless networks are disclosed. The example embodiments may provide interference mitigation and control among a plurality of wireless protocols operating in an environment. Other embodiments may be disclosed and/or claimed.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Alvin Abraham, Raghavendra Ramesh Rao, Balachandar Santhanam
  • Patent number: 10264397
    Abstract: An apparatus, computer-readable medium, and method to determine a user equipment (UE) location in a wireless network using signals from a wireless local-area network are disclosed wireless communication network entity may be configured to send WLAN assistance data to a UE. The WLAN assistance data may include a list of one or more WLAN access points (APs). The wireless communication network entity may receive location information from the UE. The location information may be based on measurements of signals from one or more of the WLAN APs. The wireless communication network entity may determine an estimate of the location of the UE based on the location information and stored information at the wireless communication network. The wireless communication network entity may determine the estimate of the location of the UE based on the measurements of the signals of the WLAN APs and a geographic position of the WLAN APs.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Alexei Davydov, Jong-Kae Fwu, Gregory Morozov
  • Patent number: 10261859
    Abstract: Methods and apparatus relating to techniques for avoiding cache lookup for cold cache. In an example, an apparatus comprises logic, at least partially comprising hardware logic, to receive metadata from an application, wherein the meta data indicates one or more processing operations which can accommodate a predetermined level of bit errors in read operations from memory, determine, from the metadata, pixel data for which error correction code bypass is acceptable, and generate one or more error correction code bypass hints for subsequent cache access to the pixel data for which error correction code bypass is acceptable, and transmit the one or more error correction code bypass hints to a graphics processing pipeline. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: April 16, 2019
    Assignee: INTEL CORPORATION
    Inventors: Altug Koker, Abhishek R. Appu, Kiran C. Veernapu, Joydeep Ray
  • Patent number: 10263036
    Abstract: Described is an apparatus which comprises: a magnetic tunneling junction (MTJ) having a free magnetic layer; a piezoelectric layer; and a conducting strain transfer layer coupled to the free magnetic layer and the piezoelectric layer. Described is a method, which comprises: exciting a piezoelectric layer with a voltage driven capacitive stimulus; and writing to a MTJ coupled to the piezoelectric layer via a strain assist layer. Described is also an apparatus which comprises: a transistor; a conductive strain transfer layer coupled to the transistor; and a MTJ device having a free magnetic layer coupled to the conductive strain transfer layer.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Sasikanth Manipatruni, Dmitri E. Nikonov, Asif Khan, Raseong Kim, Tahir Ghani, Ian A. Young
  • Patent number: 10261923
    Abstract: Described is an apparatus which comprises: a first electrical path comprising at least one driver and receiver; and a second electrical path comprising at least one driver and receiver, wherein the first and second electrical paths are to receive a same input signal, wherein the first electrical path and the second electrical path are parallel to one another and have substantially the same propagation delays, and wherein the second electrical path is enabled during a first operation mode and disabled during a second operation mode.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Kaushik Vaidyanathan, Daniel H. Morris, Uygar E. Avci, Ian A. Young, Tanay Karnik, Huichu Liu
  • Patent number: 10262456
    Abstract: An apparatus and method for extracting and using path shading coherence in a ray tracing architecture. For example, one embodiment of a graphics processing apparatus comprises: ray generation logic to generate a ray stream from one or more image tiles; ray sorting logic to sort the rays within the ray stream based on a material identifier (ID) associated with each of the rays to generate a sorted ray stream; and one or more shaders to perform shading operations on rays within the sorted ray stream in an order in which the rays are sorted within the sorted ray stream.
    Type: Grant
    Filed: December 19, 2015
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Attila T. Afra, Carl J. Munkberg
  • Patent number: 10263079
    Abstract: Embodiments of an apparatus and methods for providing three-dimensional complementary metal oxide semiconductor devices comprising modulation doped transistors are generally described herein. Other embodiments may be described and claimed, which may include forming a modulation doped heterostructure, comprising forming an active portion having a first bandgap and forming a delta doped portion having a second bandgap.
    Type: Grant
    Filed: December 17, 2016
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Ravi Pillarisetty, Mantu Hudait, Marko Radosavljevic, Willy Rachmady, Gilbert Dewey, Jack Kavalieros
  • Patent number: 10262162
    Abstract: In an embodiment, the present invention includes a processor having an execution logic to execute instructions and a control transfer termination (CTT) logic coupled to the execution logic. This logic is to cause a CTT fault to be raised if a target instruction of a control transfer instruction is not a CTT instruction. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Vedvyas Shanbhogue, Jason W. Brandt, Uday Savagaonkar, Ravi L. Sahita
  • Patent number: 10263312
    Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Sasha N. Oster, Aleksandar Aleksov, Georgios C. Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Brandon M. Rawlings, Richard J. Dischler
  • Patent number: 10263346
    Abstract: Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: April 16, 2019
    Assignee: INTEL CORPORATION
    Inventors: Telesphor Kamgaing, Adel A. Elsherbini
  • Patent number: 10262464
    Abstract: In some embodiments, the disclosed subject matter involves a system and method relating to dynamically sending local visual landmark information from multiple end user devices to a central server that is controlling an augmented reality (AR) experience. The local landmarks enable better alignment of the AR representations across devices. Multiple players may dynamically synchronize on shared landmarks that “anchor” the AR experience. The landmarks may be dynamic, transitory, and do not require pre-modelling of a location. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventor: Glen J. Anderson
  • Patent number: 10264671
    Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers, a cavity formed in at least one organic dielectric layer of the plurality of organic dielectric layers and a modular structure having first and second ports and a conductive member that is formed within the cavity. The conductive member provides modularity by being capable of connecting the first and second ports and also disconnecting the first and second ports.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventor: Feras Eid
  • Patent number: 10261795
    Abstract: Method, apparatus, and program means for performing a string comparison operation. In one embodiment, an apparatus includes execution resources to execute a first instruction. In response to the first instruction, said execution resources store a result of a comparison between each data element of a first and second operand corresponding to a first and second text string, respectively.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Michael A. Julier, Jeffrey D. Gray, Srinivas Chennupaty, Sean P. Mirkes, Mark P. Seconi
  • Patent number: 10262077
    Abstract: Methods and systems for pattern matching and relationship discovery in graphs. The graph may be adapted as an actor graph, where vertices may include processing functionality and executable logic. The vertices of an actor graph may send messages to other vertices to which they are connected. A first vertex may receive an initial regular expression. The first vertex may evaluate which of its edges and/or respective vertices connected to these edges satisfy a first condition in the initial regular expression. If the first condition is met by an edge and or its connected vertex, the initial regular expression may be modified, if necessary, to reflect that the first condition has been met. The modified expression is then communicated to the connected vertex. The identity of the edge and/or the connected vertex may be recorded. A subsequent vertex may then proceed in a similar manner as the first vertex.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventor: Gabriel G. Infante-Lopez
  • Patent number: 10261790
    Abstract: A processor includes a decode unit to decode a memory copy instruction that indicates a start of a source memory operand, a start of a destination memory operand, and an initial amount of data to be copied from the source memory operand to the destination memory operand. An execution unit, in response to the memory copy instruction, is to copy a first portion of data from the source memory operand to the destination memory operand before an interruption. A descending copy direction is to be used when the source and destination memory operands overlap. In response to the interruption, when the descending copy direction is used, the execution unit is to store a remaining amount of data to be copied, but is not to indicate a different start of the source memory operand, and is not to indicate a different start of the destination memory operand.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventor: Michael Mishaeli
  • Patent number: 10262754
    Abstract: An error in a physical memory realization at a physical memory address is detected. A first physical memory line corresponding to the physical memory address is determined. It is ensured that a duplicate of data content associated with the first physical memory line is associated with a second physical memory line. The physical memory address is remapped to use the second physical memory line for data content.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventor: David R. Cheriton
  • Patent number: 10261121
    Abstract: Embodiments of the present disclosure describe semiconductor equipment devices having a metal workpiece and a diamond-like carbon (DLC) coating disposed on a surface of the metal workpiece, thermal semiconductor test pedestals having a metal plate and a DLC coating disposed on a surface of the metal plate, techniques for fabricating thermal semiconductor test pedestals with DLC coatings, and associated configurations. A thermal semiconductor test pedestal may include a metal plate and a DLC coating disposed on a surface of the metal plate. The metal plate may include a metal block formed of a first metal and a metal coating layer formed of a second metal between the metal block and the DLC coating. An adhesion strength promoter layer may be disposed between the metal coating layer and the DLC coating. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Jelena Culic-Viskota, Nader N. Abazarnia