Patents Assigned to Intel Corporations
  • Patent number: 11942334
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the second thickness is different from the first thickness. In some embodiments, the first conductive trace and the second conductive trace have rectangular cross-sections.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Kristof Kuwawi Darmawikarta, Vahidreza Parichehreh, Veronica Aleman Strong, Xiaoying Guo
  • Patent number: 11943701
    Abstract: An access point (AP) station (STA) (AP STA) that is part of an AP multi-link device (MLD) may be configured as a reporting AP may encode a BSS Transition Management (BTM) request frame for transmission to one or more associated non-AP stations (STAs). The BTM request frame may include a neighbor report element encoded to include information about one or more neighbor APs. The neighbor report element may indicate whether the one or more neighbor APs identified in the neighbor report element are part of an AP MLD and, when a neighbor AP is indicated to be part of an AP MLD whether the reporting AP is part of the indicated AP MLD. The AP STA may decode a reassociation frame from one of the non-AP STAs for transition from one of the AP STAs of the AP MLD to one of the neighbor APs.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Laurent Cariou, Po-Kai Huang, Necati Canpolat, Carlos Cordeiro, Daniel F. Bravo, Arik Klein, Danny Ben-Ari, Robert J. Stacey
  • Patent number: 11941409
    Abstract: Systems, methods, and apparatuses relating to circuitry to implement a multiprocessor boot flow for a faster boot process are described. In one embodiment, a system includes a hardware processor comprising a processor core, a cache coupled to the hardware processor, storage for hardware initialization code, and a controller circuit to initialize a portion of the cache as memory for usage by the hardware initialization code before beginning execution of the hardware initialization code after a power on of the system.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Subrata Banik, Asad Azam, Jenny M. Pelner, Vincent Zimmer, Rajaram Regupathy
  • Patent number: 11940944
    Abstract: A computer platform is disclosed. The computer platform comprises a non-volatile memory to store fuse override data; and a system on chip (SOC), coupled to the non-volatile memory, including a fuse memory to store fuse data and security micro-controller to receive the fuse override data and perform a fuse override to overwrite the fuse data stored in the fuse memory with the fuse override data.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Bharat Pillilli, Saravana Priya Ramanathan, Reshma Lal
  • Patent number: 11943207
    Abstract: Methods, systems, and use cases for one-touch inline cryptographic data security are discussed, including an edge computing device with a network communications circuitry (NCC), an enhanced DMA engine coupled to a memory device and including a cryptographic engine, and processing circuitry configured to perform a secure exchange with a second edge computing device to negotiate a shared symmetric encryption key, based on a request for data. An inline encryption command for communication to the enhanced DMA engine is generated. The inline encryption command includes a first address associated with a storage location storing the data, a second address associated with a memory location in the memory device, and the shared symmetric encryption key. The data is retrieved from the storage location using the first address, the data is encrypted using the shared symmetric encryption key, and the encrypted data is stored in the memory location using the second address.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Kshitij Arun Doshi, Uzair Qureshi, Lokpraveen Mosur, Patrick Fleming, Stephen Doyle, Brian Andrew Keating, Ned M. Smith
  • Patent number: 11941391
    Abstract: A microcode (uCode) hot-upgrade method for bare metal cloud deployment and associated apparatus. The uCode hot-upgrade method applies a uCode patch to a firmware storage device (e.g., BIOS SPI flash) through an out-of-band controller (e.g., baseboard management controller (BMC)). In conjunction with receiving a uCode patch, a uCode upgrade interrupt service is triggered to upgrade uCode for one or more CPUs in a bare-metal cloud platform during runtime of a tenant host operating system (OS) using an out-of-bound process. This innovation enables cloud service providers to deploy uCode hot-patches to bare metal servers for persistent storage and live-patch without touching the tenant operating system environment.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Mohan J. Kumar, Sarathy Jayakumar, Chuan Song, Ruixia Li, Xiaojin Yuan, Haiyue Wang, Chong Han
  • Patent number: 11942516
    Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack; a first gate above the quantum well stack, wherein the first gate includes a first gate metal and a first gate dielectric; and a second gate above the quantum well stack, wherein the second gate includes a second gate metal and a second gate dielectric, and the first gate is at least partially between a portion of the second gate and the quantum well stack.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Nicole K. Thomas, Ravi Pillarisetty, Kanwaljit Singh, Hubert C. George, David J. Michalak, Lester Lampert, Zachary R. Yoscovits, Roman Caudillo, Jeanette M. Roberts, James S. Clarke
  • Patent number: 11943280
    Abstract: Various systems and methods for implementing a multi-access edge computing (MEC) based system to realize 5G Network Edge and Core Service Dimensioning using Machine Learning and other Artificial Intelligence Techniques, for improved operations and usage of computing and networking resources, and are disclosed herein. In an example, processing circuitry of a compute node on a network is used to analyze execution of an application to obtain operational data. The compute node then may modularize functions of the application based on the operational data to construct modularized functions. A phase transition graph is constructed using a machine-learning based analysis, the phase transition graph representing state transitions from one modularized function to another modularized function, where the phase transition graph is used to dimension the application by distributing the modularized functions across the network.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Mrittika Ganguli, Stephen T. Palermo, Valerie J. Parker
  • Patent number: 11941437
    Abstract: Systems, apparatuses and methods provide technology for batch-level parallelism, including partitioning a graph into a plurality of clusters comprising batched clusters that support batched data and non-batched clusters that fail to support batched data, establishing an execution queue for execution of the plurality of clusters based on cluster dependencies, and scheduling inference execution of the plurality of clusters in the execution queue based on batch size. The technology can include identifying nodes of the graph as batched or non-batched, generating a batched cluster comprising a plurality of batched nodes based on a relationship between two or more of the batched nodes, and generating a non-batched cluster comprising a plurality of non-batched nodes based on a relationship between two or more of the non-batched nodes. The technology can also include generating a set of cluster dependencies, where the cluster dependencies are used to determine an execution order for the clusters.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Mustafa Cavus, Yamini Nimmagadda
  • Patent number: 11940678
    Abstract: An optical modulator includes a substrate, a first dielectric layer over the substrate, a rib waveguide including a PN junction on the first dielectric, a second dielectric layer over the rib waveguide and a stressor layer including a metal, where the first or the second dielectric is between the stressor layer and the PN junction.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Mengyuan Huang, David Patel, Kejia Li, Wei Qian, Ansheng Liu
  • Patent number: 11942378
    Abstract: Techniques related to III-N transistors having improved performance, systems incorporating such transistors, and methods for forming them are discussed. Such transistors include first and second crystalline III-N material layers separated by an intervening layer other than a III-N material such that the first crystalline III-N material layer has a first crystal orientation that is inverted with respect to a second crystal orientation of the second crystalline III-N material layer.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Han Wui Then, Marko Radosavljevic, Sansaptak Dasgupta
  • Patent number: 11942406
    Abstract: A semiconductor package may include a semiconductor package first side, an embedded bridge interconnect, a first via, and a second via. The bridge interconnect may include a bridge interconnect first side with a conductive pad and a bridge interconnect second side. The distance between the bridge interconnect first side and the semiconductor package first side may be less than a distance between the bridge interconnect second side and the semiconductor package first side. The first and second vias may each include a first end that is narrower than s second end. The semiconductor package first side may be closer to the first end of the first via than the second end of the first via, and closer to the second end of the second via than the first end of the second via. The first side of the semiconductor package may be configured to electrically couple to a die.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Kyu Oh Lee, Dilan Seneviratne, Ravindranadh T Eluri
  • Patent number: 11940633
    Abstract: An illuminator has phase scrambling particles to reduce speckle.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Liana Ilkova
  • Patent number: 11942416
    Abstract: Embodiments disclosed herein include electronic systems with vias that include a horizontal and vertical portion in order to provide interconnects to stacked components, and methods of forming such systems. In an embodiment, an electronic system comprises a board, a package substrate electrically coupled to the board, and a die electrically coupled to the package substrate. In an embodiment the die comprises a stack of components, and a via adjacent to the stack of components, wherein the via comprises a vertical portion and a horizontal portion.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Ehren Mannebach, Aaron Lilak, Hui Jae Yoo, Patrick Morrow, Anh Phan, Willy Rachmady, Cheng-Ying Huang, Gilbert Dewey, Rishabh Mehandru
  • Patent number: 11941534
    Abstract: A system is provided that includes a bit vector-based distance counter circuitry configured to generate one or more bit vectors encoded with information about potential matches and edits between a read and a reference genome, wherein the read comprises an encoding of a fragment of deoxyribonucleic acid (DNA) encoded via bases G, A, T, C. The system further includes a bit vector-based traceback circuitry configured to divide the reference genome into one or more windows and to use the plurality of bit vectors to generate a traceback output for each of the one or more windows, wherein the traceback output comprises a match, a substitution, an insert, a delete, or a combination thereof, between the read and the one or more windows.
    Type: Grant
    Filed: December 28, 2019
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Gurpreet Singh Kalsi, Anant V. Nori, Christopher Justin Hughes, Sreenivas Subramoney, Damla Senol
  • Patent number: 11943340
    Abstract: In some examples, for process-to-process communication, such as in function linking, a virtual channel can be provisioned to provide virtual machine to virtual machine communications. In response to a transmit request from a source virtual machine, the virtual channel can cause a data copy from a source buffer associated with the source virtual machine without decryption or encryption. The virtual channel provisions a key identifier for the copied data. The destination virtual machine can receive an indication data is available and can cause the data to be decrypted using a key accessed using the key identifier and source address of the copied data. In addition, the data can be encrypted using a second, different key for storage in a destination buffer associated with the destination virtual machine. In some examples, the key identifier and source address is managed by the virtual channel and is not visible to virtual machine or hypervisor.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Bo Cui, Cunming Liang, Jr-Shian Tsai, Ping Yu, Xiaobing Qian, Xuekun Hu, Lin Luo, Shravan Nagraj, Xiaowen Zhang, Mesut A. Ergin, Tsung-Yuan C. Tai, Andrew J. Herdrich
  • Patent number: 11943754
    Abstract: This disclosure describes systems, methods, and devices related to extremely high throughput (EHT) resource unit (RU) allocation. A device may utilize a tone plan to generate an EHT frame to be sent using an 80 MHz frequency band, wherein the tone plan comprises a plurality of null tones. The device may encode one or more resource units (RUs) for the EHT frame, wherein the one or more RUs comprise at least one of a 26-tone RU, a 52-tone RU, a 106-tone RU, a 242-tone RU, a 484-tone RU, or a 996-tone RU, wherein the 106-tone RU, the 242-tone RU, and the 484-tone RU comprise null tones located at least at subcarriers ±258, ±257, ±256, ±255, and ±254. The device may cause to send the EHT frame to a first station device using the 80 MHz frequency band.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Xiaogang Chen, Qinghua Li, Thomas J. Kenney
  • Patent number: 11943122
    Abstract: Disclosed embodiments are related to Management Data Analytics (MDA) relation with Self-Organizing Network (SON) functions and coverage issues analysis use case. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Yizhi Yao, Joey Chou
  • Patent number: 11940287
    Abstract: Provided is a device and a method for route planning. The route planning device (100) may include a data interface (128) coupled to a road and traffic data source (160); a user interface (170) configured to display a map and receive a route planning request from a user, the route planning request including a line of interest on the map; a processor (110) coupled to the data interface (128) and the user interface (170). The processor (110) may be configured to identify the line of interest in response to the route planning request; acquire, via the data interface (128), road and traffic information associated with the line of interest from the road and traffic data source (160); and calculate, based on the acquired road and traffic information, a navigation route that matches or corresponds to the line of interest and meets or satisfies predefined road and traffic constraints.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 26, 2024
    Assignee: INTEL CORPORATION
    Inventors: Yuqing Hou, Xiaolong Liu, Ignacio J. Alvarez, Xiangbin Wu
  • Patent number: 11941394
    Abstract: A processor includes a decode unit to decode an instruction indicating a source packed data operand having source data elements and indicating a destination storage location. Each of the source data elements has a source data element value and a source data element position. An execution unit, in response to the instruction, stores a result packed data operand having result data elements each having a result data element value and a result data element position. Each result data element value is one of: (1) equal to a source data element position of a source data element, closest to one end of the source operand, having a source data element value equal to the result data element position of the result data element; and (2) a replacement value, when no source data element has a source data element value equal to the result data element position of the result data element.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Christopher J. Hughes, Jong Soo Park