Patents Assigned to Intel Corporations
  • Patent number: 11770268
    Abstract: This disclosure describes systems, methods, and devices related to smart notifications for online collaboration applications. A method may include receiving, by at least one processor of a device, audio data from an audio stream presented using a video application of the device; identifying, by the at least one processor, a keyword for which to search in the audio data; determining, by the at least one processor, that the audio data includes a representation of the keyword; generating, by the at least one processor, based on the determination that the audio data includes the representation of the keyword, a notification indicating that the keyword was identified in the audio data; and causing presentation, by the at least one processor, of the notification using the device.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Kumar K M, Mukesh Arora
  • Patent number: 11769719
    Abstract: Embodiments include a package substrate, a method of forming the package substrate, and a semiconductor package. A package substrate includes a conductive layer in a dielectric, a first trace and a first via pad of the conductive layer having a first thickness, and a second trace and a second via pad of the conductive layer having a second thickness. The second thickness of second trace and second via pad may be greater than the first thickness of the first trace and first via pad. The dielectric may include a first dielectric thickness and a second dielectric thickness, where the second dielectric thickness may be less than the first dielectric thickness. The package substrate may include a third via having a third thickness on the first via pad, and a fourth via having a fourth thickness on the second via pad, wherein the third thickness is greater than the fourth thickness.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Jonathan Rosch, Wei-Lun Jen, Cheng Xu, Liwei Cheng, Andrew Brown, Yikang Deng
  • Patent number: 11769814
    Abstract: A device is disclosed. The device includes a gate conductor, a first source-drain region and a second source-drain region. The device includes a first air gap space between the first source-drain region and a first side of the gate conductor and a second air gap space between the second source-drain region and a second side of the gate conductor. A hard mask layer that includes holes is under the gate conductor, the first source-drain region, the second source-drain region and the air gap spaces. A planar dielectric layer is under the hard mask.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Ehren Mannebach, Aaron Lilak, Hui Jae Yoo, Patrick Morrow, Kevin L. Lin, Tristan Tronic
  • Patent number: 11770848
    Abstract: Various embodiments herein provide techniques to configure different time/frequency region (TFR) configuration schemes for physical uplink shared channel (PUSCH) cancellation indication (CI) signaling. Additionally, embodiments provide techniques to configure different payload construction method (PCM) schemes for PUSCH CI signaling. Other embodiments may be described and claimed.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventor: Honglei Miao
  • Patent number: 11769729
    Abstract: Provided herein are metal structures that may include a cobalt alloy, a nickel alloy, or nickel, as well as related devices and methods. The metal structures may be formed by chemical vapor deposition (CVD), and may include trace amounts of precursor materials used during the CVD process.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Daniel J. Zierath, Michael McSwiney, Jason Farmer, Akm Shaestagir Chowdhury
  • Patent number: 11768946
    Abstract: A method comprising responsive to a first instruction requesting a memory heap operation, identifying a data block of a memory heap; accessing a tag history for the data block, the tag history comprising a plurality of tags previously assigned to the data block; assigning a tag to the data block, wherein assigning the tag comprises verification that the tag does not match any of the plurality of tags of the tag history; and providing the assigned tag and a reference to a location of the data block.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: David M. Durham, Ramya Jayaram Masti
  • Patent number: 11768687
    Abstract: An apparatus to facilitate thread scheduling is disclosed. The apparatus includes logic to store barrier usage data based on a magnitude of barrier messages in an application kernel and a scheduler to schedule execution of threads across a plurality of multiprocessors based on the barrier usage data.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Balaji Vembu, Abhishek R. Appu, Joydeep Ray, Altug Koker
  • Patent number: 11769789
    Abstract: A capacitor is disclosed. The capacitor includes a first metal layer, a second metal layer on the first metal layer, a ferroelectric layer on the second metal layer, and a third metal layer on the ferroelectric layer. The second metal layer includes a first non-reactive barrier metal and the third metal layer includes a second non-reactive barrier metal. A fourth metal layer is on the third metal layer.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Nazila Haratipour, Chia-Ching Lin, Sou-Chi Chang, Ashish Verma Penumatcha, Owen Loh, Mengcheng Lu, Seung Hoon Sung, Ian A. Young, Uygar Avci, Jack T. Kavalieros
  • Patent number: 11770368
    Abstract: Techniques for sharing private data objects in a trusted execution environment using a distributed ledger are described. The techniques described herein may enable sharing of data objects, referred to herein as private data objects (PDOs), between individuals and organizations with access and update policies mediated by execution of code (referred to herein as a “smart contract”) carried with the PDO in a secure enclave. A distributed ledger may serve as a “public commit log” to ensure that there is a single, authoritative instance of the object and provide a means of guaranteeing atomicity of updates across interacting objects.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Mic Bowman, Andrea Miele, James P. Held, Anand Rajan
  • Patent number: 11770383
    Abstract: Various systems and methods of establishing and utilizing device management (DM) services in Internet of Things (IoT) networks and similar distributed network architectures, are described herein. In an example, a Cloud-To-OCF Device mediator service may be established from OCF services definition; this mediator service may be used to establish connectivity between a cloud-capable device and a cloud-based service. Further systems and methods to provide a proxy access service (PAS) hosted on a cloud service provider, that enable a PAS to coordinate and preserve device-to-device interactions from end-to-end, are also disclosed.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventor: Ned M. Smith
  • Patent number: 11769734
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate including a dielectric material having a first surface and an opposing second surface, a first photodefinable material on at least a portion of the second surface, and a second photodefinable material on at least a portion of the first photodefinable material, wherein the second photodefinable material has a different material composition than the first photodefinable material.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Johanna M. Swan
  • Patent number: 11770480
    Abstract: An apparatus for providing a connection to a wide area network for voice calls includes a wide area network circuit configured to transmit voice call data packets, a phone connection circuit configured to receive a voice call signal from a phone, a processor circuit configured to generate voice call data packets based on a voice call signal received by the phone connection circuit and a power management circuit configured to switch off at least a part of the apparatus to reach a power down mode of the apparatus, if a supply voltage drops below a supply voltage threshold.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventor: Dieter Foedlmeier
  • Patent number: 11769288
    Abstract: Apparatus and method for speculative execution of hit and intersection shaders on programmable ray tracing architectures. For example, one embodiment of an apparatus comprises: single-instruction multiple-data (SIMD) or single-instruction multiple-thread (SIMT) execution units (EUs) to execute shaders; and ray tracing circuitry to execute a ray traversal thread, the ray tracing engine comprising: traversal/intersection circuitry, responsive to the traversal thread, to traverse a ray through an acceleration data structure comprising a plurality of hierarchically arranged nodes and to intersect the ray with a primitive contained within at least one of the nodes; and shader deferral circuitry to defer and aggregate multiple shader invocations resulting from the traversal thread until a particular triggering event is detected, wherein the multiple shaders are to be dispatched on the EUs in a single shader batch upon detection of the triggering event.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Gabor Liktor, Karthik Vaidyanathan, Jefferson Amstutz, Atsuo Kuwahara, Michael Doyle, Travis Schluessler
  • Patent number: 11768705
    Abstract: Methods, apparatus, systems and machine-readable storage media of an edge computing device which is enabled to access and select the use of local or remote acceleration resources for edge computing processing is disclosed. In an example, an edge computing device obtains first telemetry information that indicates availability of local acceleration circuitry to execute a function, and obtains second telemetry that indicates availability of a remote acceleration function to execute the function. An estimated time (and cost or other identifiable or estimateable considerations) to execute the function at the respective location is identified. The use of the local acceleration circuitry or the remote acceleration resource is selected based on the estimated time and other appropriate factors in relation to a service level agreement.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Karthik Kumar, Ned M. Smith, Thomas Willhalm, Timothy Verrall
  • Patent number: 11769290
    Abstract: An apparatus and method are described for using tessellation hardware to generate bounding volume hierarchies (BVHs) and perform other ray tracing operations. For example, one embodiment of an apparatus comprises: a shader to output a plurality of tessellation factors and one or more input surfaces; and a tessellation circuit comprising first circuitry and/or logic to tessellate each input surface to generate a new set of primitives and second circuitry and/or logic to concurrently generate a bounding volume hierarchy (BVH) 1521 based on the new set of primitives.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Carsten Benthin, Gabor Liktor
  • Patent number: 11768748
    Abstract: Systems, apparatuses, and methods include technology that generates synthesized sensors that synthesize operations of a first plurality of sensors using independent variables, such as sensors, as first inputs, where the first plurality of sensors is to sense conditions of operations of a system as the system executes a process based on a first input, and further where the conditions are stored as a first output. The technology generates a second output based on the synthesized sensors and the first input and detects whether one or more of a degradation and an anomalous state exists based on a comparison of the first output to the second output.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Hoang Tran Van, Neethu Elizabeth Simon
  • Patent number: 11768931
    Abstract: Technologies for memory management with memory protection extension include a computing device having a processor with one or more protection extensions. The processor may load a logical address including a segment base, effective limit, and effective address and generate a linear address as a function of the logical address with the effective limit as a mask. The processor may switch to a new task described by a task state segment extension. The task state extension may specify a low-latency segmentation mode. The processor may prohibit access to a descriptor in a local descriptor table with a descriptor privilege level lower than the current privilege level of the processor. The computing device may load a secure enclave using secure enclave support of the processor. The secure enclave may load an unsandbox and a sandboxed application in a user privilege level of the processor. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: September 26, 2023
    Assignee: INTEL CORPORATION
    Inventors: Michael LeMay, Barry E. Huntley, Ravi Sahita
  • Patent number: 11769402
    Abstract: In embodiments, sensors from an environment in which a mobile device is moving may be used to provide extra input to allow for improved risk analysis and detection in the environment. To prevent unwanted surveillance, proximity to the environment's sensors may be required. It will be appreciated a coordinator in the environment may assist with handling multiple sensor data provided to the mobile device, and may also assist with identifying risk. The environment may also act as a data feed allowing the mobile device to simply receive additional sensor data and perform its analysis and operation.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventor: Lejun Zhu
  • Patent number: 11769753
    Abstract: Embodiments disclosed herein include an electronics package and methods of forming such electronics packages. In an embodiment, the electronics package comprises a package substrate, and a first die coupled to the package substrate. In an embodiment, a cavity is formed through the package substrate. In an embodiment, the cavity is within a footprint of the first die. In an embodiment, the electronics package further comprises a thermal stack in the cavity. In an embodiment, the thermal stack contacts the first die.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: George Vakanas, Aastha Uppal, Shereen Elhalawaty, Aaron McCann, Edvin Cetegen, Tannaz Harirchian, Saikumar Jayaraman
  • Patent number: 11769557
    Abstract: Techniques for preventing read disturb in NAND memory devices are described. In one example, reads are tracked for sub-groups. When the number of reads to a sub-group meets a threshold, the data at the wordline on which the threshold was met is moved along with the data at neighboring wordlines to an SLC block without moving the entire block. The performance impact and write amplification impact of read disturb mitigation can be significantly reduced while maintaining some data continuity.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: September 26, 2023
    Assignee: Intel Corporation
    Inventors: Arun Sitaram Athreya, Shankar Natarajan, Sriram Natarajan, Yihua Zhang, Suresh Nagarajan