Abstract: An embodiment of an integrated circuit comprises circuitry to store memory protection information for a non-host memory in a memory protection cache, and perform one or more memory protection checks on a translated access request for the non-host memory based on the stored memory protection information. Other embodiments are disclosed and claimed.

Abstract: Gate-all-around integrated circuit structures having an insulator substrate, and methods of fabricating gate-all-around integrated circuit structures having an insulator substrate, are described. For example, an integrated circuit structure includes a semiconductor fin on an insulator substrate. A vertical arrangement of horizontal nanowires is over the semiconductor fin. A gate stack surrounds a channel region of the vertical arrangement of horizontal nanowires, and the gate stack is overlying a channel region of the semiconductor fin. A pair of epitaxial source or drain structures is at first and second ends of the vertical arrangement of horizontal nanowires and the semiconductor fin.

Abstract: A memory accessed by rows and/or by columns in which an array of bits can be physically stored physical one-bit wide columns with each bit of the multi-bit wide logical column stored in a one-bit physical column in a different physical die. The multi-bit column is read by reading a one-bit physical column in each of the different physical die in parallel. The multi-bit wide logical column is arranged diagonally across M physical rows and M one-bit physical columns with each bit of the multi-bit wide logical column in the logical row stored in a different physical row and physical one-bit wide column in one of plurality of dies.

Abstract: Gate-all-around integrated circuit structures having additive metal gates and gate dielectrics with a dipole layer are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires, and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, the first gate stack having a P-type conductive layer over a first gate dielectric including a high-k dielectric layer on a first dipole material layer. A second gate stack is over the second vertical arrangement of horizontal nanowires, the second gate stack having an N-type conductive layer over a second gate dielectric including the high-k dielectric layer on a second dipole material layer.

Abstract: The present disclosure is directed to 3-D stacked architecture for Programmable Fabrics and Central Processing Units (CPUs). The 3-D stacked orientation enables reconfigurability of the fabric, and allows the fabric to function using coarse-grained and fine-grained acceleration for offloading CPU processing. Additionally, the programmable fabric may be able to function to interface with multiple other compute chiplet components in the 3-D stacked orientation. This enables multiple compute components to communicate without the need for offloading the data communications between the compute chiplets.

Abstract: A connector includes connector pins that have a loop of conductor. The connector connects a first printed circuit board (PCB) to a second PCB with compression of the connector pins between the two boards. In response to compression of the connector, the connector pins make electrical contact with themselves through the loop, while also connecting pads of the first PCB to pads of the second PCB.

Abstract: An embodiment of a semiconductor package apparatus may include technology to determine version information for a new firmware component, read dependency information corresponding to the firmware component, and determine if dependency is satisfied between the new firmware component and one or more other firmware components based on the version information and the dependency information of the new firmware component. Other embodiments are disclosed and claimed.

Abstract: Apparatus, systems, and/or methods may involve reporting a road hazard. Road hazard data may be collected for an object on a road, which may include automatically generated data from a device associated with the object causing a hazard. The road hazard data may be provided to a service, an application, a device, a client, and so on. For example, the road hazard data may be merged with a map and provided to a map services client, a navigation client, and so on. An alert may be generated based on the road hazard data to warn of the hazard caused by the object. The alert may include a visual and/or audio representation of the hazard data. The alert may be used to automatically and/or manually avoid the hazard.

Abstract: Embodiments of the present invention describe a epitaxial region on a semiconductor device. In one embodiment, the epitaxial region is deposited onto a substrate via cyclical deposition-etch process. Cavities created underneath the spacer during the cyclical deposition-etch process are backfilled by an epitaxial cap layer. The epitaxial region and epitaxial cap layer improves electron mobility at the channel region, reduces short channel effects and decreases parasitic resistance.

Abstract: Acknowledgment management techniques for UL MU transmissions are described. In various embodiments, an AP may observe a limit with respect to a number of TIDs for which corresponding A-MPDUs are to be acknowledged in a given immediate/compressed multi-user (MU) block ACK (BA). In some embodiments, the AP may indicate such a TID limit in a broadcast transmission, such as a beacon or management frame. In various other embodiments, the AP may indicate such a TID limit in a response for a capability request, such as a Probe Response, or in a specific allocation frame, such as a trigger frame, for all STAs participating in UL MU transmissions. In various embodiments, a single TID limit may be indicated that is understood to apply to each STA. In some other embodiments, the AP may indicate a respective TID limit for each of multiple STAs. Other embodiments are described and claimed.

Abstract: Examples described herein relate to network layer 7 (L7) offload to an infrastructure processing unit (IPU) for a service mesh. An apparatus described herein includes an IPU comprising an IPU memory to store a routing table for a service mesh, the routing table to map shared memory address spaces of the IPU and a host device executing one or more microservices, wherein the service mesh provides an infrastructure layer for the one or more microservices executing on the host device; and one or more IPU cores communicably coupled to the IPU memory, the one or more IPU cores to: host a network L7 proxy endpoint for the service mesh, and communicate messages between the network L7 proxy endpoint and an L7 interface device of the one or more microservices by copying data between the shared memory address spaces of the IPU and the host device based on the routing table.

Abstract: Disclosed herein are integrated circuit (IC) structures including backside vias, as well as related methods and devices. In some embodiments, an IC structure may include: a device layer, wherein the device layer includes a plurality of active devices; a first metallization layer over the device layer, wherein the first metallization layer includes a first conductive pathway in conductive contact with at least one of the active devices in the device layer; a second metallization layer under the device layer, wherein the second metallization layer includes a second conductive pathway; and a conductive via in the device layer, wherein the conductive via is in conductive contact with at least one of the active devices in the device layer and also in conductive contact with the second conductive pathway.

Abstract: An apparatus to facilitate graphics rendering is disclosed. The apparatus comprises sequencer hardware to operate in a tile mode to render objects, including performing batch formation to generate one or more batches of received objects, performing tile sequencing for each of the objects to compute tile fill intersects for each of the objects and performing a play sequencing of each of the objects.

Abstract: Embodiments described herein include, software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. Embodiment described herein provided techniques to detect zero value elements within a vector or a set of packed data elements output by a processing resource and generate metadata to indicate a location of the zero value elements within the plurality of data elements.

Abstract: Techniques are provided for generation of secure video and tamper detection of the secure video. A methodology implementing the techniques according to an embodiment includes selecting a subset of macroblocks from a video frame to be transmitted and calculating a low frequency metric on each of the selected macroblocks. The method also includes performing a hash calculation on the low frequency metrics to generate a frame signature, encrypting the frame signature (using a private key) to generate an encrypted watermark, and modifying pixels of each of the selected macroblocks to generate the secured video frame, the modifications based on bits of the encrypted watermark that are associated with the selected macroblock. The method further includes authenticating a received video frame by comparing a calculated frame signature to an authenticated frame signature, the authenticated frame signature decrypted (using a public key) from an extracted watermark of the received video frame.

Abstract: Embodiments detailed herein relate to systems and methods to store a tile register pair to memory. In one example, a processor includes: decode circuitry to decode a store matrix pair instruction having fields for an opcode and source and destination identifiers to identify source and destination matrices, respectively, each matrix having a PAIR parameter equal to TRUE; and execution circuitry to execute the decoded store matrix pair instruction to store every element of left and right tiles of the identified source matrix to corresponding element positions of left and right tiles of the identified destination matrix, respectively, wherein the executing stores a chunk of C elements of one row of the identified source matrix at a time.

Abstract: Systems, methods, and devices for isolating a misbehaving accelerator circuit, such as an accelerator function unit or an accelerated function context, are provided. An integrated circuit may include a region that includes an accelerator circuit. When the accelerator circuit issues a request, another region of the integrated circuit or a processor connected to the integrated circuit may determine whether there is a misbehavior associated with the request and, in response to determining that there is a misbehavior associated with the request, may perform a misbehavior response to mitigate a negative impact of the misbehavior of the accelerator circuit.

Abstract: Described herein are IC devices include tight-pitched patterned metal layers, such as metal gratings, and processes for forming such patterned metal layers. The processes include subtractive metal patterning, where portions of a metal layer are etched and replaced with an insulator to form the metal grating. Masks for etching portions of the metal layer are generated using directed self-assembly (DSA). In some examples, multiple etching steps are performed, e.g., to generate metal lines at a first pitch, and to add additional lines at half of the first pitch. In some examples, additive metal patterning is performed in addition to subtractive metal patterning.

Abstract: An apparatus includes a host interface; a network interface; hardware storage to store a flow table; and programmable circuitry comprising processors to implement network interface functionality and to: implement a hash table and an age context table, wherein the hash table and the age context table are to reference flow rules maintained in the flow table; process a synchronization packet for a flow by adding a flow rule for the flow to the flow table, adding a hash entry corresponding to the flow rule to the hash table, and adding an age context entry for the flow to the age context table; and process subsequent packets for the flow by performing a first lookup at the hash table to access the flow rule at the flow table and by performing a second lookup at the age context table to apply aging rules to the flow rule in the flow table.

Abstract: An IC device with one or more transistors may also include one or more vias and jumpers for delivering power to the transistors. For instance, a via may be coupled to a power plane. A jumper may be connected to the via and an electrode of a transistor. With the via and jumper, an electrical connection is built between the power plane and the electrode. The via may be self-aligned. The IC device may include a dielectric structure at a first side of the via. A portion of the jumper may be at a second side of the via. The second side opposes the first side. The dielectric structure and the portion of the jumper may be over another dielectric structure that has a different dielectric material from the dielectric structure. The via may be insulated from another electrode of the transistor, which may be coupled to a ground plane.