Abstract: Techniques for low power indoor/outdoor detection are disclosed. In the illustrative embodiment, an integrated sensor hub receives data from an accelerometer. The sensor hub processes the accelerometer data to determine an activity of the user. Depending on the activity of the user, the sensor hub may determine whether the compute device is indoors or outdoors or may receive data from additional sensors, such as a magnetometer, a gyroscope, or an ambient light sensor. The additional sensor data may be used to determine whether the compute device is inside or outside.

Abstract: A fabrication method and associated integrated circuit (IC) structures and devices that include one or more conductive vias is described herein. In one example, a conductive via is formed from one side of the integrated circuit, and then a portion of the conductive via is widened from a second side of the IC structure opposite the first side. In one example, a resulting IC structure includes a first portion having a first width, a second portion having a second width, and a third portion having a third width, wherein the third portion is between the first portion and the second portion, and the third width is smaller than the first width and the second width. In one such example, the conductive via tapers from both ends towards the third portion between the ends.

Abstract: An IC device may include a semiconductor structure and a backside semiconductor structure over the semiconductor structure. The semiconductor structure and backside semiconductor structure may constitute the source or drain region of a transistor. The backside semiconductor structure may be closer to the backside of a substrate of the IC device than the semiconductor structure. The backside semiconductor structure may be formed at a lower temperature than the semiconductor structure. The backside semiconductor structure may have one or more different materials from the semiconductor structure. For instance, a semiconductor material in the backside semiconductor structure may have a different crystal direction from a semiconductor material in the semiconductor structure. As another example, the backside semiconductor structure may have one or more different chemical compounds from the semiconductor structure.

Abstract: Embodiments of a microelectronic assembly comprise: a first set comprising one or more of first integrated circuit (IC) dies; a second set comprising another one or more of the first IC dies; a plate between, and in direct contact with, the first set and the second set; and a second IC die coupled to the first set, the second set, and the plate. Each IC die comprises a substrate of semiconductor material and an interconnect region including metallization in interlayer dielectric (ILD), the substrate and the interconnect region share a planar interface, and the first IC dies and the second IC die are arranged with the planar interfaces of the first IC dies parallel to each other and orthogonal to the planar interface of the second IC die.

Abstract: Methods, systems and apparatuses may provide for technology that determines that a state of a plurality of primitives is associated with out-of-order execution. The plurality of primitives is associated with a raster order. The technology reorders the plurality of primitives from a raster order, and distributes one or more of pixel processing operations or rasterization operations associated with the plurality of primitives to load balance across one or more of a plurality of execution units of a graphics processor or a graphics pipeline of the graphics processor.

Abstract: Various systems and methods for implementing an assessment and response mechanism for autonomous systems are described herein. An assessment and response system for an autonomous system is configured to access a realm classification of an event; determine a hazard score based on the realm classification, a severity metric, a likelihood metric, an urgency metric, and a confidence level metric; identify, based on the hazard score, a responsive action; and record details of the hazard score determination and the responsive action in a decision ledger.

Abstract: A semiconductor device having tipless epitaxial source/drain regions and a method for its formation are described. In an embodiment, the semiconductor device comprises a gate stack on a substrate. The gate stack is comprised of a gate electrode above a gate dielectric layer and is above a channel region in the substrate. The semiconductor device also comprises a pair of source/drain regions in the substrate on either side of the channel region. The pair of source/drain regions is in direct contact with the gate dielectric layer and the lattice constant of the pair of source/drain regions is different than the lattice constant of the channel region. In one embodiment, the semiconductor device is formed by using a dielectric gate stack placeholder.

Abstract: In one embodiment, a new frame is to be presented on a display. A frame time is predicted for the new frame along with a current balance for a set of previously presented frames. A frame pattern for the new frame is determined based on the predicted frame time and the current balance.

Abstract: Techniques for clock manager monitoring for time sensitive networks are described. An apparatus, comprises a clock circuitry to manage a clock for a device, a processing circuitry coupled to the clock circuitry, the processing circuitry to execute instructions to perform operations for a clock manager, the clock manager to receive messages with time information for a network and generate clock manager control information to adjust the clock to a network time for the network, and a detector coupled to the processing circuitry and the clock circuitry, the detector to receive the clock manager control information, generate model control information based on a clock model, compare the clock manager control information with the model control information to generate difference information, and determine whether to generate an alert based on the difference information. Other embodiments are described and claimed.

Abstract: Methods, systems, apparatus, and articles of manufacture to extend the life of embedded processors are disclosed herein. Disclosed example apparatus include a policy selector to select a policy, based on input information. The apparatus extends an operating lifespan of a microprocessor having a plurality of cores. The apparatus also includes a cores partitioner to divide, based on the selected policy, the plurality of cores into subsets of cores, including a first subset and a second subset. A sensor monitors, based on the selected policy, at least one operational parameter of the cores, and a cores switcher switches a first core of the first subset of cores from active to inactive and to switch a second core of the second subset of cores from inactive to active based on the at least one operational parameter. The switches reduce an amount of degradation experienced by the first core and the second core.

Abstract: An integrated circuit device may be formed including an electronic substrate and a metallization structure on the electronic substrate, wherein the metallization structure includes a first level comprising a first dielectric material layer, a second level on the first level, wherein the second level comprises a second dielectric material layer, a third level on the second level, wherein the third level comprises a third dielectric material layer, at least one power/ground structure in the second level, and at least one skip level via extending at least partially through the first dielectric material layer of the first level, through the second dielectric layer of the second level, and at least partially through the third dielectric material layer of the third level, wherein the at least one skip level via comprises a continuous conductive material.

Abstract: According to various examples, a device is described. The device may include a first package substrate. The device may also include a first mold layer with a first thickness. The device may also include a second mold layer with a second thickness proximal to the first mold layer. The second thickness may be larger than the first thickness. The first mold layer may include a plurality of first interconnects coupled to the first package substrate. The second mold layer may include a plurality of second interconnects configured to couple the first package substrate to a printed circuit board.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for dynamic load balancing for multi-core computing environments. An example apparatus includes a first and a plurality of second cores of a processor, and circuitry in a die of the processor separate from the first and the second cores, the circuitry to enqueue identifiers in one or more queues in the circuitry associated with respective ones of data packets of a packet flow, allocate one or more of the second cores to dequeue first ones of the identifiers in response to a throughput parameter of the first core not satisfying a throughput threshold to cause the one or more of the second cores to execute one or more operations on first ones of the data packets, and provide the first ones to one or more data consumers to distribute the first data packets.

Abstract: A device is disclosed. The device includes a channel, a first source-drain region adjacent a first portion of the channel, the first source-drain region including a first crystalline portion that includes a first region of metastable dopants, a second source-drain region adjacent a second portion of the channel, the second source-drain region including a second crystalline portion that includes a second region of metastable dopants. A gate conductor is on the channel.

Abstract: A multi-tenant dynamic secure data region in which encryption keys can be shared by services running in nodes reduces the need for decrypting data as encrypted data is transferred between nodes in the data center. Instead of using a key per process/service, that is created by a memory controller when the service is instantiated (for example, MKTME), a software stack can specify that a set of processes or compute entities (for example, bit-streams) share a private key that is created and provided by the data center.

Abstract: Disclosed embodiments relate to accelerating multiplication of sparse matrices. In one example, a processor is to fetch and decode an instruction having fields to specify locations of first, second, and third matrices, and an opcode indicating the processor is to multiply and accumulate matching non-zero (NZ) elements of the first and second matrices with corresponding elements of the third matrix, and executing the decoded instruction as per the opcode to generate NZ bitmasks for the first and second matrices, broadcast up to two NZ elements at a time from each row of the first matrix and each column of the second matrix to a processing engine (PE) grid, each PE to multiply and accumulate matching NZ elements of the first and second matrices with corresponding elements of the third matrix. Each PE further to store an NZ element for use in a subsequent multiplications.

Abstract: Systems, apparatuses and methods provide technology for model generation with intermediate stage caching and re-use, including generating, via a model pipeline, a multi-level set of intermediate stages for a model, caching each of the set of intermediate stages, and responsive to a change in the model pipeline, regenerating an executable for the model using a first one of the cached intermediate stages to bypass regeneration of at least one of the intermediate stages. The multi-level set of intermediate stages can correspond to a hierarchy of processing stages in the model pipeline, where using the first one of the cached intermediate stages results in bypassing regeneration of a corresponding intermediate stage and of all intermediate stages preceding the corresponding intermediate stage in the hierarchy. Further, regenerating an executable for the model can include regenerating one or more intermediate stages following the corresponding intermediate stage in the hierarchy.

Abstract: Technologies for adaptively embedding visual advertising content into media content include a computing device for receiving visual advertisements, an advertisement map, and media content from a remote content provider. Such technologies may also include determining a location of an advertising enabled area within an image of the media content, selecting a visual advertisement to embed within the image of the media content at the determined location of the advertising enabled area as a function of the advertisement map, and embedding the selected visual advertisement into the image of the media content at the determined location of the advertising enabled area to generate augmented media content for subsequent display to the user. In some embodiments, the advertisement map includes display conditions for each of the visual advertisements.

Abstract: An apparatus including a circuit structure including a device stratum including a plurality of devices including a first side and an opposite second side; and a metal interconnect coupled to at least one of the plurality of devices from the second side of the device stratum. A method including forming a transistor device including a channel between a source region and a drain region and a gate electrode on the channel defining a first side of the device; and forming an interconnect to one of the source region and the drain region from a second side of the device.

Abstract: An apparatus to facilitate enabling secure communication via attestation of multi-tenant configuration on accelerator devices is disclosed. The apparatus includes a processor to: verify a base bitstream of an accelerator device, the base bitstream published by a cloud service provider (CSP); generate a partial reconfiguration (PR) bitstream based on the base bitstream, the PR bitstream to fit within at least one PR region of PR boundary setups of the accelerator device; inspect accelerator device attestation received from a secure device manager (SDM) of the accelerator device; and responsive to successful inspection of the accelerator device attestation, provide the PR bitstream to the CSP for PR reconfiguration of the accelerator device.