Abstract: A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.

Abstract: Methods and apparatus for Enhanced IO Interface for PLC program and program-suspend-resume operations. A NAND memory device includes blocks of single-level cell (SLC) memory and multi-level cell (MLC) memory storing n-bits per cell such as quad-level cell (QLC) or penta-level cell (PLC) memory. The NAND memory device further includes a plurality of page buffer latches and logic to copy data from a set of n SLC pages in a block of SLC memory into n respective page buffer latches and copy data from the respective page buffer latches to an MLC page (e.g., QLC or PLC page) in a block of MLC memory. These operations can be extended for NAND memory devices having multiple planes with blocks of SLC and QLC/PLC memory. QLC/PLC program and program-resume operations are supported with optional ECC correction operations.

Abstract: An example of a memory device may comprise NAND media with a plurality of decks, and circuitry coupled to the NAND media to control access to a superblock of memory cells aligned along a pillar of the NAND media, wherein the superblock includes at least a first block that corresponds to memory cells aligned along the pillar in a first deck of the plurality of decks and a second block that corresponds to memory cells aligned along the pillar in a second deck of the plurality of decks, configure the NAND media in a first program mode for the first block of the superblock, and configure the NAND media in a second program mode for the second block of the superblock. Other examples are disclosed and claimed.

Abstract: An embodiment of an apparatus may include NAND memory organized as two or more memory planes and a controller communicatively coupled to the NAND memory, the controller including circuitry to provide synchronous independent plane read operations for the two or more memory planes of the NAND memory. Other embodiments are disclosed and claimed.

Abstract: An embodiment of an apparatus may include a memory package with one or more memory die on an internal input/output (IO) path of the memory package, and an interface module communicatively coupled to the one or more memory die through the internal IO path, the interface module including circuitry to perform IO external to the memory package at a first IO width and a first IO speed, and perform IO internal to the memory package at a second IO width and a second IO speed, wherein one or more of the second IO width is different from the first IO width and the second IO speed is different from the first IO speed. Other embodiments are disclosed and claimed.

Abstract: An embodiment of a memory device may comprise a super-pillar formed through a plurality of sub-decks, a string of memory cells formed along the super-pillar, and respective regions of transition material disposed between respective sub-decks of the plurality of sub-decks, wherein the super-pillar comprises at least a first pillar formed through a first sub-deck of the plurality of sub-decks substantially aligned with a second pillar formed through a second sub-deck of the plurality of sub-decks. Other embodiments are disclosed and claimed.

Abstract: An example of an apparatus may include NAND memory and circuitry coupled to the NAND memory to monitor a sense voltage for an operation associated with a wordline of the NAND memory, and adjust a negative charge pump for the wordline prior to completion of the operation based on the monitored sense voltage. Other examples are disclosed and claimed.

Abstract: A semiconductor circuit includes multiple decks of semiconductor devices, each deck having multiple three-dimensional (3D) stacks. The semiconductor circuit has a nitride layer between the first deck and the second deck. The nitride layer has a self-aligned pillar through the nitride layer to electrically connect the first deck to the second deck. The nitride layer can have multiple sublayers, with a mirrored gradient doping, with lower doping toward the middle of the nitride layer and higher doping toward the outsides of the nitride layer that interfaces with the decks.

Abstract: An example of an apparatus may include NAND memory and circuitry coupled to the NAND memory to control access to the NAND memory as two or more groups of memory cells, provide independent operations for the two or more groups of memory cells, share a voltage regulator among at least two of the two or more groups of memory cells, and provide a target constant voltage from the shared voltage regulator to a target group of the two or more groups of memory cells in an independent operation for the target group. Other examples are disclosed and claimed.

Abstract: An example of an apparatus may include NAND memory and circuitry coupled to the NAND memory to provide duty cycle correction (DCC) for one or more write paths of the NAND memory. Other examples are disclosed and claimed.

Abstract: Systems, apparatuses, and methods may provide for technology for forming a gate polysilicon for 3D-NAND complementary metal-oxide semiconductor under array (CuA) on a substrate with a barrier and spacer structure. For example, the technology includes forming a titanium nitride (TiN) barrier adjacent the gate polysilicon and forming a silicon nitride (SiN) spacer around the polysilicon gate and the titanium nitride barrier.