Patents Assigned to Interconnection Technology, Inc.
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Patent number: 7084501Abstract: The wide usable interconnecting component of the present invention is capable of reducing number of components or electric elements and reducing number of interconnecting sections without limiting circuit design. The interconnecting component electrically interconnects electric components, and the interconnecting component acts as an electric element. Namely, the interconnecting component acts as a passive element or an active element.Type: GrantFiled: April 21, 2004Date of Patent: August 1, 2006Assignee: Interconnection Technologies Inc.Inventor: Hisanobu Utsunomiya
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Patent number: 5378857Abstract: An apparatus and method for wire termination in wire scribed circuit boards is provided. The system includes a plurality of wires having termination areas, scribed on an insulating substrate. The top portion of the termination areas is then removed by a router to expose the wire with a flat surface. The exposed portion of the wire is then covered by a metal suitable for electrical connection bonding.Type: GrantFiled: January 15, 1993Date of Patent: January 3, 1995Assignee: Advanced Interconnection Technology, Inc.Inventor: John T. Swailes
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Patent number: 5340946Abstract: A non-tacky, solid, adhesive composition comprising: (a) at least one film forming polymeric resin of number average molecular weight (Mn) of at least about 10,000 and having a hydroxyl, epoxide or unsaturated functionality greater than about 7, the polymeric resin being selected from the group of polyols consisting of polyesters, polyurethanes, phenoxies, epoxies and mixtures thereof; a plasticizer present in an amount which permits the activation without C-staging of the polymeric resin; (b) a curing agent which is capable of crosslinking and curing the polymeric resin to a C-stage, the curing agent being present in an amount sufficient to C-stage the polymeric resin. The adhesive composition can be activated without C-staging the polymeric resin, upon application of sufficient heat or ultrasonic energy for a time period less than one second.Type: GrantFiled: April 14, 1992Date of Patent: August 23, 1994Assignee: Advanced Interconnection Technology, Inc.Inventors: Marju L. Friedrich, John G. Branigan, Maurice E. Fitzgibbon
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Patent number: 5083087Abstract: An apparatus for detecting breaks in wire while the wire is being scribed wherein the apparatus measures changes, in real time, in the scribing system's electrical characteristics. These characteristics can be changes in phase shift and capacitance variations caused by breaks in the wire as the wire is scribed onto a workpiece.Type: GrantFiled: July 17, 1990Date of Patent: January 21, 1992Assignee: Advanced Interconnection Technology, Inc.Inventors: James M. Fox, Howard F. Malone
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Patent number: 4394711Abstract: A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.Type: GrantFiled: May 27, 1980Date of Patent: July 19, 1983Assignee: Interconnection Technology, Inc.Inventor: Larry R. Conley
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Patent number: 4242719Abstract: A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.Type: GrantFiled: June 1, 1979Date of Patent: December 30, 1980Assignee: Interconnection Technology, Inc.Inventor: Larry R. Conley