Patents Assigned to INVENSENSE
  • Patent number: 11888455
    Abstract: Disclosed embodiments provide glitch prediction based on machine learning algorithms in mixed analog and digital systems, particularly directed to digital microelectromechanical (MEMS) multipath acoustic sensors or microphones, which allow seamless, low latency gain changes without audible artifacts or interruptions in the audio output signal.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: January 30, 2024
    Assignee: INVENSENSE, INC.
    Inventors: Stefano Valle, Alessandro Magnani, Pascal Trotta
  • Patent number: 11881874
    Abstract: A motion sensor with sigma-delta analog-to-digital converter (ADC) having improved bias instability is presented herein. Differential outputs of a differential amplifier of the sigma-delta ADC are electrically coupled, via respective capacitances, to differential inputs of the differential amplifier. To minimize bias instability corresponding to flicker noise that has been injected into the differential inputs, the differential inputs are electrically coupled, via respective pairs of electronic switches, to feedback resistances based on a pair of switch control signals. In this regard, a first feedback resistance of the feedback resistances is electrically coupled to a first defined voltage, and a second feedback resistance of the feedback resistances is electrically coupled to a second defined reference voltage.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: January 23, 2024
    Assignee: INVENSENSE, INC.
    Inventor: Gabriele Pelli
  • Patent number: 11846648
    Abstract: A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: December 19, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Matthew Julian Thompson, Robert Walmsley
  • Patent number: 11847851
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: December 19, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 11841228
    Abstract: The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to the two inner frame gyroscopes or outer frame gyroscope, and four GZ proof masses coupled to the inner frame gyroscopes for GZ sense mode. Components can be removed from an exemplary overall architecture to fabricate a single axis or two axis gyroscope and/or can be configured such that a number of proof-masses can be reduced in half from an exemplary overall architecture to fabricate a half-gyroscope. Other embodiments can employ a stress isolation frame to reduce package induced stress.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: December 12, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Doruk Senkal, Robert Hennessy, Houri Johari-Galle, Joe Seeger
  • Patent number: 11835538
    Abstract: Reducing a sensitivity of an electromechanical sensor is presented herein. The electromechanical sensor comprises a sensitivity with respect to a variation of a mechanical-to-electrical gain of a sense element of the electromechanical sensor; and a voltage-to-voltage converter component that minimizes the sensitivity by coupling, via a defined feedback capacitance, a positive feedback voltage to a sense electrode of the sense element—the sense element electrically coupled to an input of the voltage-to-voltage converter component. In one example, the voltage-to-voltage converter component minimizes the sensitivity by maintaining, via the defined feedback capacitance, a constant charge at the sense electrode. In another example, the electromechanical sensor comprises a capacitive sense element comprising a first node comprising the sense electrode. Further, a bias voltage component can apply a bias voltage to a second node of the electromechanical sensor.
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: December 5, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Joseph Seeger, Pradeep Shettigar
  • Patent number: 11821731
    Abstract: Facilitating minimization of non-linearity effects of a delay of a capacitance-to-voltage (C2V) converter on an output of a gyroscope is presented herein. A sense output signal of a sense mass of the gyroscope and a drive output signal of a drive mass of the gyroscope are electronically coupled to respective analog-to-digital converter (ADC) inputs of bandpass sigma-delta ADCs of the gyroscope. The bandpass sigma-delta ADCs include respective C2V converters that are electronically coupled, via respective feedback loops, to the respective ADC inputs to facilitate reductions of respective propagation delays of the bandpass sigma-delta ADCs. Respective ADC outputs of the bandpass sigma-delta ADCs are electronically coupled to demodulator inputs of a demodulator of the gyroscope that transforms the sense output into an output of the MEMS gyroscope representing an external stimulus that has been applied to the sense mass.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: November 21, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Carlo Pinna, Sriraman Dakshinamurthy
  • Patent number: 11815354
    Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: November 14, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Doruk Senkal, Robert Hennessy, Houri Johari-Galle, Joseph Seeger
  • Patent number: 11811904
    Abstract: Technologies are provided for adaptive control of bias settings in a digital microphone. In some embodiments, a device includes a first component that provides data indicative of a clock frequency of operation in a functional mode of a digital microphone. The clock frequency clocks one or more microphone components having switching activity. The device also can include a second component that determines, using the clock frequency, an amount of bias current to supply to at least a first microphone component of the one or more microphone components. The device can further include a memory device that retains control parameters that include at least one of a first subset of parameters defining a relationship between current and frequency and a second subset of parameters defining a quantization of the relationship. The quantization including multiple bias current levels for respective frequency intervals.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: November 7, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Miroslav Svajda, Dusan Vecera, Igor Mucha
  • Patent number: 11754397
    Abstract: Microelectromechanical systems (MEMS) gyroscopes and related sense frequency tracking techniques are described. Various embodiments facilitate sense frequency tracking and offset and/or sensitivity change compensation. Exemplary embodiments can comprise receiving a sense signal at an output of a MEMS gyroscope and determining a sense resonant frequency of the sense signal. In addition, exemplary methods can comprise generating an input sine wave with a frequency of the sense resonant frequency of the sense signal injecting the input sine wave into the MEMS gyroscope, to facilitate sense frequency tracking.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: September 12, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Sriraman Dakshinamurthy, Carlo Pinna, Ronak Chetan Desai
  • Patent number: 11637537
    Abstract: Exemplary multipath digital microphones described herein can comprise exemplary embodiments of automatic gain control and multipath digital audio signal digital signal processing chains, which allow low power and die size to be achieved as described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can facilitate switching between multipath digital audio signal digital signal processing chains while minimizing audible artifacts associated with either the change in the gain automatic gain control amplifiers switching between multipath digital audio signal digital signal processing chains.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: April 25, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Igor Mucha, Michael Perrott
  • Patent number: 11623246
    Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: April 11, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Emad Mehdizadeh, Bongsang Kim, Chienliu Chang, Leonardo Baldasarre, Nikhil Apte, Xiaoyue Jiang, Mei-Lin Chan
  • Patent number: 11584638
    Abstract: A sensor can comprise a sensor die with a first sensor surface and a second sensor surface opposite to the first sensor surface. The sensor can further comprise a die pad component with a first pad surface and a second pad surface opposite to the first pad surface, wherein the sensor die is vertically stacked with the die pad component, with the second sensor surface oriented toward the first pad surface. The sensor can further comprise a lead frame component with a first frame surface and a second frame surface opposite to the first frame surface, the die pad component is vertically stacked with the lead frame component, wherein the second pad surface is oriented toward the first frame surface, the second pad surface is isolated from the second frame surface, and the lead frame component is electrically connected to the sensor die.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: February 21, 2023
    Assignee: INVENSENSE, INC.
    Inventor: Efren Lacap
  • Patent number: 11577276
    Abstract: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a layer of piezoelectric material that is activated and sensed by an electrode and a conductive plane layer. The conductive plane layer may be electrically connected to processing circuitry by a via that extends through the piezoelectric layer. One or more isolation trenches extend through the conductive plane layer to isolate the conductive plane layer from other conductive plane layers of adjacent PMUT devices of a PMUT array.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: February 14, 2023
    Assignee: INVENSENSE, INC.
    Inventor: Chienliu Chang
  • Patent number: 11563166
    Abstract: An array of piezoelectric micromachined ultrasound transducers (PMUTs) has a layer of piezoelectric material that requires poling during fabrication in order to properly align the piezoelectric dipoles to create a desired ultrasonic signal. The PMUT may have an interconnected set of lower electrodes that are fabricated between a processing layer of the PMUT and the piezoelectric layer. An upper electrode is fabricated overlaying the piezoelectric layer, and a poling voltage is applied between the upper electrode and the interconnected set of lower electrodes. After poling is complete, portions of the interconnected set of lower electrodes are removed to permanently isolate permanent lower electrodes from each other.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: January 24, 2023
    Assignee: INVENSENSE, INC.
    Inventor: Chienliu Chang
  • Patent number: 11543229
    Abstract: The present disclosure relates to measuring misalignment between layers of a semiconductor device. In one embodiment, a device includes a first conductive layer; a second conductive layer; one or more first electrodes embedded in the first conductive layer; one or more second electrodes embedded in the second conductive layer; a sensing circuit connected to the one or more first electrodes; and a plurality of time-varying signal sources connected to the one or more second electrodes, wherein the one or more first electrodes and the one or more second electrodes form at least a portion of a bridge structure that exhibits an electrical property that varies as a function of misalignment of the first conductive layer and the second conductive layer in an in-plane direction.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: January 3, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Ilya Gurin, Leonardo Baldasarre
  • Patent number: 11517252
    Abstract: A hearable comprises at least one microphone coupled with a wearable structure and a sensor processing unit disposed within the wearable structure and coupled with the microphone. A portion of the wearable structure is configured to be disposed within a user's ear. The sensor processing unit acquires audio data from the at least one microphone and head motion data from at least one motion sensor of the sensor processing unit. The head motion data describes motions of the user's head and comprises cranium motion data and mandible motion data. The sensor processing unit separates the mandible motion data from the head motion data, synchronizes the mandible motion data and the audio data into a synchronized data stream; classifies an activity of the head during a portion of the synchronized data stream; and generates a health indicator for the user based on the activity and the synchronized data stream.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: December 6, 2022
    Assignee: INVENSENSE, INC.
    Inventors: Jibran Ahmed, Karthik Katingari, Nicolas Sauvage
  • Patent number: 11515465
    Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) array may comprise PMUT devices with respective piezoelectric layers and electrode layers. Parasitic capacitance can be reduced when an electrode layer is not shared across PMUT devices but may expose the devices to electromagnetic interference (EMI). A conductive layer located within the structural layer or on a shared plane with the electrode layers may reduce EMI affecting the PMUT array operation.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: November 29, 2022
    Assignee: INVENSENSE, INC.
    Inventors: Nikhil Apte, Chienliu Chang, Shreyas Thakar, Mei-Lin Chan
  • Patent number: 11507163
    Abstract: Facilitating powering up/down respective analog circuits of mixed-signal devices utilizing a reconfigurable power sequencer component and corresponding reconfigurable sequencer processing unit(s) is presented herein. A system can comprise a mixed-signal component comprising a group of analog circuits comprising respective inputs to facilitate a power-up and a power-down of respective portions of the analog circuits; and a reconfigurable power sequencer component that obtains, from a reconfigurable memory of the system, reprogrammable information representing respective timed sequences of digital outputs electronically coupled to the respective inputs of the group of analog circuits, and based on the reprogrammable information, generates the respective timed sequences of the digital outputs to facilitate the power-up and the power-down of the respective portions of the analog circuits.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: November 22, 2022
    Assignee: INVENSENSE, INC.
    Inventors: Giuseppe Santillo, Biswajit Datta
  • Patent number: 11490186
    Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: November 1, 2022
    Assignees: INVENSENSE, INC., TDK ELECTRONICS AG
    Inventors: Tsung Lin Tang, Chia-Yu Wu, Chung-Hsien Lin, Dennis Mortensen, Pirmin Rombach