Patents Assigned to Inventec Corporation
-
Publication number: 20230292009Abstract: A display device includes a display module and a camera module. The camera module includes a first housing, a second housing and a camera unit. The first housing is movably disposed on the display module. The second housing is separably connected to the first housing. The camera unit is disposed on the second housing. The second housing is able to move with the first housing in relative to the display module, such that the camera unit is exposed from the display module or hidden in the display module. When the second housing is separated from the first housing, the second housing is able to rotate in relative to the first housing, so as to adjust an orientation of the camera unit.Type: ApplicationFiled: June 15, 2022Publication date: September 14, 2023Applicants: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Chien-Chang Chen, Chin-Yi Lin, Chia-Chen Chen, Chi-Zen Peng
-
Publication number: 20230274593Abstract: An anchor point assembly, a vehicle entry system and a vehicle are provided. The anchor point assembly includes a control module, a power management module and a positioning module. The control module is connected to a vehicle end module, and is used to obtain position information of the vehicle end module according to a position identification signal of the vehicle end module. The power management module is connected to the control module and is used to supply electric power to the control module in conjunction with a power supply of a vehicle; the positioning module is connected to the control module, and is used to obtain position information of a control terminal and transmit the position information of the control terminal to the control module.Type: ApplicationFiled: June 22, 2022Publication date: August 31, 2023Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATIONInventor: Zhien WANG
-
Patent number: 11683914Abstract: An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel.Type: GrantFiled: June 16, 2021Date of Patent: June 20, 2023Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Kai-Yang Tung, Hung-Ju Chen
-
Patent number: 11656828Abstract: An electronic system is provided, which includes a host device and a display device. The host device includes a first signal conversion circuit and a first signal transmission circuit. The first signal conversion circuit is utilized for converting signals associated with the host device into a first universal serial bus signal. The display device includes a display panel, a second signal conversion circuit and a second signal transmission circuit. The second signal transmission circuit is utilized for receiving the first universal serial bus signal. The second signal conversion circuit is coupled to the second signal transmission circuit for converting the first universal serial bus signal into the signals associated with the host device. The first universal serial bus signal conforms to universal serial bus 4.0 or above version standard specification.Type: GrantFiled: June 15, 2021Date of Patent: May 23, 2023Assignees: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Cheng-Yu Wu, Ming-Yuan Liu
-
Patent number: 11654743Abstract: The present disclosure provides a liquid cooling seal box, a box cover thereof, and an in-vehicle cooling system. The liquid cooling seal box includes a sealed heat conduction box body, an inner cavity of the heat conduction box body includes a heating device and an insulating liquid in which the heating device is immersed, the insulating liquid absorbs heat of the heating device and vaporizes, vaporized steam rises to the top of the inner cavity of the heat conduction box body to be cooled and liquefied, and a liquefied insulating liquid falls back into the insulating liquid at the bottom of the inner cavity. The liquid cooling seal box of the present disclosure resolves problems of reliability, harsh environment, balance of volume and computation power, etc., is suitable for an in-vehicle system, and may implement stable and reliable running of a server in an in-vehicle environment.Type: GrantFiled: September 23, 2020Date of Patent: May 23, 2023Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATIONInventors: Dong-rui Xue, Raijin Li, Xuefeng Chen, Pinyi Xiang
-
Patent number: 11659691Abstract: A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is slidably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.Type: GrantFiled: September 14, 2021Date of Patent: May 23, 2023Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Chun-Ming Chang, Tai-Jung Sung
-
Publication number: 20230136407Abstract: A liquid cooling module includes a heat dissipating base, a replaceable fin structure and a cover. The heat dissipating base includes a substrate and the substrate has a fin accommodating region. The replaceable fin structure includes a plurality of fins. The replaceable fin structure is detachably disposed on the fin accommodating region. The cover is disposed on the substrate and covers the replaceable fin structure.Type: ApplicationFiled: November 15, 2021Publication date: May 4, 2023Applicants: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Po-An Chen, Jie-Wei Chang
-
Patent number: 11632872Abstract: A server assembly including a mounting frame, a battery box and a battery. The mounting frame includes an accommodation space configured to accommodate a disk drive. The battery box is disposed in the accommodation space of the mounting frame. The battery is installed in the battery box.Type: GrantFiled: June 14, 2021Date of Patent: April 18, 2023Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventor: Chi-Cheng Hsiao
-
Patent number: 11630023Abstract: The invention relates to detection technology field and provides a tool-less tray that is detachably mounted on a casing inner wall. The tray has a plate body and a side wall; at least 3 shaped holes are disposed on the side wall; at least one screw pillar is fixed to the plate body and is configured to be firmly connected to an additional function board. The technical solution provided by the invention is tool-less, realizes fast installation and detachment of tray, realizes fast addition and removal of additional function board in limited space and is convenient to be used.Type: GrantFiled: February 20, 2020Date of Patent: April 18, 2023Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Zhao Geng, Zhifa Chen
-
Patent number: 11625077Abstract: The present invention provides a solid-state hard disk lug-in device, including: a main body; a solid-state hard disk installation slot arranged on one side of the main body; and plug-in components. The plug-in components include an operating switch and an operating handle. When the operating switch is closed, the operating handle is restricted to a closed position, and when the operating switch is open, the operating handle is released to an extended position; when the operating handle in the closed position is pushed by an external force, the solid-state hard disk can be inserted into the hard disk slot of the solid-state hard disk system; when the operating handle in the extended position is pulled by an external force, the solid-state hard disk can be pulled out of the hard disk slot.Type: GrantFiled: June 24, 2021Date of Patent: April 11, 2023Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATIONInventors: Hui Zhu, Jiaqi Yuan
-
Patent number: 11625354Abstract: A circuit structure with automatic PCIe lane configuration adjustment and a method thereof are disclosed. The circuit structure includes a plurality of PCIe riser cards and a motherboard. The PCIe riser cards are of at least two lane sizes each associated with a PCIe size identifier. The motherboard includes a plurality of PCIe ports, a CPLD module, a storage unit, a BMC module and a BIOS unit. The PCIe ports are electrically connected to the respective PCIe riser cards via a plurality of PCIe cables. The CPLD module is electrically connected to the PCIe ports so as to be able to read the PCIe size identifiers thereof and determine current configuration information from a comparison between the PCIe size identifiers and present signals.Type: GrantFiled: June 23, 2021Date of Patent: April 11, 2023Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventor: Ye Liu
-
Patent number: 11622034Abstract: An electronic apparatus includes a display module and a plurality of metallic elements. The metallic elements at least partially surround at least three sides of the display module to form a metallic frame. The metallic frame is configured to receive a fifth generation (5G) mobile signal, in which adjacent two of the metallic elements have a gap therebetween.Type: GrantFiled: August 14, 2020Date of Patent: April 4, 2023Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATIONInventors: Pei-Ling Teng, Chih-Cheng Li
-
Patent number: 11622459Abstract: A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.Type: GrantFiled: May 31, 2021Date of Patent: April 4, 2023Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATIONInventors: Kai-Yang Tung, Hung-Ju Chen
-
Patent number: 11615518Abstract: A method for generating reconstruction a reconstructed image is adapted to an input image having a target object. The method comprises converting the input image into a feature map with vectors by an encoder; performing a training procedure according to training images of reference objects to generate feature prototypes associated with the training images and store the feature prototypes to a memory; selecting a part of feature prototypes from the feature prototypes stored in the memory according to similarities between the feature prototypes and the feature vectors; generating a similar feature map according the part of feature prototypes and weights, wherein the weights represents similarities between the part of feature prototypes and the feature vectors; and converting the similar feature map into the reconstructed image by a decoder; wherein the encoder, the decoder and the memory form an auto-encoder.Type: GrantFiled: February 9, 2021Date of Patent: March 28, 2023Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Daniel Stanley Young Tan, Yi-Chun Chen, Trista Pei-Chun Chen, Wei-Chao Chen
-
Patent number: 11611127Abstract: A supporting base and a relief valve. Relief valve includes valve body, restoring component and plug. Valve body includes first cover plate and first side wall. First cover plate and first side wall together form opening. First side wall includes pressure releasing hole. Vent of casing is connected to opening. Pressure releasing hole is connected to opening. Plug includes second cover plate and second side wall. Second side wall and second cover plate together form recession. Recession is connected to accommodation space via vent. Second cover plate is movably disposed in opening via restoring component. When plug is in initial position, pressure releasing hole is disconnected from accommodation space. When plug is in releasing position, pressure releasing hole is connected to accommodation space via vent.Type: GrantFiled: December 10, 2020Date of Patent: March 21, 2023Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventor: Chi-Cheng Hsiao
-
Publication number: 20230085501Abstract: A radiation susceptibility testing method includes transmitting radiation waves to a device under test, measuring the device under test to obtain a first voltage according to the radiation waves, outputting a reference voltage to a coupling device so that the coupling device generates a second voltage according to the reference voltage, adjusting the reference voltage to approximate the second voltage to the first voltage, storing the adjusted reference voltage, and outputting the second voltage to the device under test according to the adjusted reference voltage to simulate the impact of the radiation waves to the device under test.Type: ApplicationFiled: June 16, 2022Publication date: March 16, 2023Applicants: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Yung-Sen LEE, Yuan-Ho CHEN
-
Publication number: 20230085497Abstract: A cooling system includes a tank, a heat exchanger, a separation tank, a first tube, a second tube, a third tube, a gas storage device, a fourth tube, a first valve, a second valve and a third valve. A heating element is immersed in a dielectric liquid in the tank. The heat exchanger condenses dielectric vapor of the dielectric liquid. The separation tank is used for a separation operation. The first tube is connected to the tank and the heat exchanger. The second tube is connected to the heat exchanger and the separation tank. The third tube is connected to the separation tank and the tank. The gas storage device stores the dielectric vapor. The fourth tube is connected to the gas storage device and the separation tank.Type: ApplicationFiled: June 13, 2022Publication date: March 16, 2023Applicants: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Kai-Yang Tung, Hung-Ju Chen
-
Publication number: 20230072341Abstract: A hard disk supporting structure is provided. The hard disk supporting structure includes a hard disk rack, a crawler mechanism, and a motor. The hard disk rack is for disposing at least one hard disk. A crawler of the crawler mechanism is fixedly connected with the hard disk rack. The motor is connected to a driving gear of the crawler mechanism. The motor drives the rotation of the driving gear, to enable the crawler to drive the hard disk rack to move back and forth. The hard disk supporting structure can automatically move the hard disk rack back and forth through a structure with automatic telescopic function, which greatly saves labor, and improves efficiency.Type: ApplicationFiled: March 25, 2022Publication date: March 9, 2023Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATIONInventors: Yang YING, Xuefeng CHEN, Yanhua SHI, Lisheng WANG
-
Publication number: 20230066801Abstract: An electronic device includes a base, a circuit board and a heat dissipating module. The base includes a bottom cover and a frame. The frame is disposed on the bottom cover. An accommodating space is between the bottom cover and the frame. The bottom cover has an air inlet. The circuit board is disposed in the accommodating space. The circuit board has a through hole. The through hole corresponds to the air inlet. The heat dissipating module is disposed in the accommodating space and located above the circuit board. The heat dissipating module includes a fan. The fan corresponds to the through hole. The fan drives airflow to flow into the accommodating space from the air inlet and the through hole along an axial direction of the fan and then flow out of the base from the accommodating space along the axial direction of the fan.Type: ApplicationFiled: September 1, 2022Publication date: March 2, 2023Applicants: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Chun-Chi Lin, Szu-Yu Huang, I-Fang Chen, Ya-lan Kuo
-
Patent number: 11592475Abstract: Abstract of Disclosure A method for testing radiation susceptibility includes transmitting radiation wave to a device under test, measuring the device under test to generate a first voltage according to the radiation wave, outputting a reference voltage to a coupling device so that the coupling device generates a second voltage according to the reference voltage, adjusting the reference voltage so that the second voltage approximates the first voltage, storing the adjusted reference voltage, outputting the second voltage to the device under test according to the adjusted reference voltage to simulate an impact of the radiation wave to the device under test, the device under test accordingly transmitting a control signal to the coupling device after receiving the second voltage, and determining a status of the device under test according to the control signal.Type: GrantFiled: December 12, 2021Date of Patent: February 28, 2023Assignees: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Yung-Sen Lee, I-Lin Tsai