Abstract: A dummy dual in-line memory module (DIMM) testing system based on boundary scan interconnect and a method thereof. A dummy dual in-line memory module functioning normally is used as a test fixture, a dummy dual in-line memory module under test is served as an unit under test (UUT), and the test fixture and the unit under test are inserted into a test device to electrically connect to each other, so that the test access port (TAP) device can perform boundary scan to control the test fixture to test the unit under test through signal pins, and check a test result based on a data signal collected from at least one boundary scan register. Therefore, the effect of improving testing convenience of the dummy DIMM can be achieved.

Abstract: A fan control system for use in a server system is disclosed. The fan control system includes a first monitoring and protection chip, a second monitoring and protection chip, a switch, a plurality of fans and a complex programmable logic device (CPLD). In a shutdown state of the server system, the switch is switched under control of the CPLD so that the fans are connected to the second monitoring and protection chip, receive standby power therefrom and run at a standby power level. When the server system is switched to a working state, the switch is switched under control of the CPLD so that the fans are connected to the first monitoring and protection chip, receive operating power therefrom and run at a higher working power level. This design can address different heat dissipation needs of various applications.

Abstract: A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is removably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

Abstract: A condenser includes a casing and pipes. The casing includes an inlet chamber, an outlet chamber, a first inlet, a first outlet, an accommodation space, a second inlet, and a second outlet. The first inlet and the first outlet are respectively in fluid communication with the inlet chamber and the outlet chamber. The accommodation space accommodates a coolant, and the second inlet and the second outlet are in fluid communication with the accommodation space not in fluid communication with the inlet chamber and the outlet chamber. The pipes are in the accommodation space and connect the inlet chamber with the outlet chamber, and a working fluid flows from the inlet chamber to the outlet chamber via the pipes. The first inlet is located closer to the second outlet than the first outlet, and the first outlet is located closer to the second inlet than the first inlet.

Abstract: A cooling system of server includes a tank and a pressure control device. The tank is configured to accommodate a dielectric fluid. The pressure control device is configured to regulate the pressure of the tank. The pressure control device includes a condenser, a dehumidifier, a gas storage chamber, and a valve. The condenser is connected to the tank. The dehumidifier is connected to the condenser. The gas storage chamber is connected to the dehumidifier. The valve is connected between the dehumidifier and the gas storage chamber. The valve is configured to communicate and not to communicate the dehumidifier and the gas storage chamber.

Abstract: A detection system for a SlimSAS slot and a method thereof are disclosed. In the detection system, a detecting device generates and transmits a detection signal to a TAP controller; the TAP controller converts the received detection signal into a detection signal in JTAG format, and transmits the detection signal in JTAG format to a CPLD chip and a controllable power module chip of a detection card and/or a boundary scan chip of a circuit board; a detection can be performed on the SMBus pins, the differential signal receiving pins, the differential signal transmitting pins, the clock pins, the sideband pins and the ground pins of the SlimSAS connection interface through the boundary scan chip, the HCSL to LVDS module chip, the IIC chip and the CPLD chip. Therefore, the technical effect of improving slot stability and detection coverage of a SlimSAS slot detection can be achieved.

Abstract: An antenna device includes a first insulation layer, a defected metal layer, a second insulation layer, and a plurality of radiators. The defected metal layer is disposed on the first insulation layer, and the defected metal layer has a plurality of recess features which are arranged with uniform pitches. The second insulation layer is disposed on the first insulation layer and the defected metal layer. The radiators are disposed on the second insulation layer, and each radiator has a feeding portion and a grounding portion.

Abstract: A system of performing boundary scan test on pin through test point and a method thereof are disclosed. When an under-test pin of a target connector is determined to be unable to perform a boundary scan test, a test point connected to and closest to the under-test pin is searched, a test signal is transmitted to a target connector, a result signal from the target connector in response to the test signal is received, an expected result and the result signal are compared to generate a test result, so that a boundary scan function can be applied to test a connector of a computer product, to achieve the technical effect of providing a better test range and a better test coverage to improve test efficiency and reduce test cost, compared to conventional boundary scan test.

Abstract: A method for automatically classifying transition motion includes following steps performed by a computing device: obtaining a plurality of transition motions, with each transition motion being associated with a source motion, a destination motion, and a transition mechanism converting the source motion into the destination motion; extracting a property vector from each transition motion and thereby generating a plurality of property vectors, wherein each property vector includes a plurality of transition properties; and performing a clustering algorithm according to the property vectors to generate a plurality of transition types.

Abstract: An electronic fuse based-protection circuit system, including a plurality of electronic fuse based-protection circuits, where each electronic fuse based-protection circuit is electrically connected to a power supply and a load through an input terminal and an output terminal respectively and includes a sampling resistor, a MOSFET switch, and a logic control branch circuit. The sampling resistor is electrically connected to the input terminal and has a sampling terminal. The MOSFET switch is electrically connected to the sampling terminal and the output terminal. The logic control branch circuit obtains a sampling voltage of the sampling resistor between the input terminal and the sampling terminal and an on-off judging voltage by amplifying the sampling voltage. When the on-off judging voltage is greater than a reverse-bias voltage of the logic control branch circuit, an off signal is then transmitted to the MOSFET switch, to turn off the MOSFET switch.

Abstract: A DIMM slot test system without series connection of test board through JTAG and a method thereof are disclosed. A DIMM connector interface of a test board is inserted to a DIMM slot of a circuit board under test, a CPU generates test data or a test signal based on a test signal with JTAG signal format, the CPU transmits test data to a specified CPLD chip through differential pins or IO pins, the specified CPLD chip records the received data as a test result; the CPU transmits the generated test signal to the specified CPLD chip, which then tests power pins or ground pins, reads and records values of the power pins or the ground pins as the test result; the CPU generates and transmits a test result read signal to the specified CPLD chip through the control pins, obtains the test result through data transmission pins.

Abstract: An auxiliary positioning system includes an ultra-wideband (UWB) element, and a service management and orchestration (SMO) apparatus and a near-real time ran intelligent controller (Near-RT RIC) connected with each other, wherein the SMO apparatus includes a non-real time ran intelligent controller (Non-RT RIC). The UWB element is connected to a second application disposed at at least one of the SMO apparatus, the Near-RT RIC and the Non-RT RIC through a first application. The UWB element is configured to output positioning information of a user device to the second application through the first application.

Abstract: A one-to-many communication circuit includes a recommended standard 232 signal transceiver, a main controller area network transceiver, and a plurality of subordinate controller area network transceivers. The recommended standard 232 signal transceiver is used to receive a control signal from a main controller and convert the control signal into a first signal conforming to the recommended standard 232 communication protocol. The main controller area network transceiver is used to convert the first signal into a second signal conforming to the controller area network communication protocol. And each of the plurality of subordinate controller area network transceivers is used to convert the second signal into a third signal conforming to the recommended standard 232 communication protocol.

Abstract: A system for expansion of open radio access network includes a service management and orchestration (SMO) apparatus and a near-real time ran intelligent controller (Near-RT RIC) connected with each other, wherein the SMO apparatus includes a non-real-time ran intelligent controller (Non-RT RIC). Each of the SMO apparatus, the Near-RT RIC and the Non-RT RIC includes a first decoder, and at least one of the SMO apparatus, the Near-RT RIC and the Non-RT RIC includes a second decoder. The first decoder is configured to decode a first packet of a first communication protocol, the second decoder is configured to decode a second packet of a second communication protocol, and the first communication protocol is different from the second communication protocol.

Abstract: A fixing device includes a circuit board, a first cover, a reinforcing piece, and a double-layer chip. The circuit board has a first surface and a second surface opposite to each other. The first cover is disposed adjacent to the first surface and has a first bump which has a first abutting surface facing the first surface. The reinforcing piece is located on the first surface and adjacent to the first bump. The double-layer chip has an upper layer and a lower layer which are electrically connected. An upper surface of the upper layer and a lower surface of the lower layer are respectively located on opposite sides of the double-layer chip, and an area of the upper surface is smaller than an area of the lower surface. The lower layer of the double-layer chip and the second surface of the circuit board are electrically connected.

Abstract: A fixing device includes a circuit board, an insertion slot, and a fixing bracket. The circuit board has a peripheral recess, and the insertion slot is disposed on the circuit board. The fixing bracket is fixed in the peripheral recess, and the fixing bracket has a board, two lateral arms, and two guiding rails. The two lateral arms are connected to two corresponding sides of the board, and the two lateral arms are integrally formed from the board. In addition, the two guiding rails are respectively disposed at the two lateral arms, in which the two guiding rails extend towards the insertion slot.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to rotate based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A heat dissipating system for electronic devices includes a first heat dissipation device, a second heat dissipation device, and a thermal conduction component. The thermal conduction component is disposed around the first heat dissipation device and configured to thermally contact a heat source. The second heat dissipation device is disposed adjacent to the thermal conduction component. The first heat dissipation device is configured to generate a first working fluid toward the thermal conduction component, such that the heat transferred from the heat source to the thermal conduction component is dispersed in a plurality of directions directing away from the first heat dissipation device. The second heat dissipation device is configured to generate a second working fluid, such that the heat distributed adjacent to the second heat dissipation device is dissipated in at least one direction directing away from the second heat dissipation device.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A wireless charging device includes a casing, a circuit board and at least one wireless charging module. The casing includes a bottom plate and a plurality of mounting pillars protruding from the bottom plate. The circuit board includes a substrate and at least one support assembly, and the substrate is stacked on the plurality of mounting pillars. The support assembly includes a plurality of support pillars protruding from the substrate. The wireless charging module includes a mounting frame and a charging coil. The mounting frame has a plurality of first assembling parts. The plurality of first assembling parts are respectively mounted on the plurality of support pillars. The charging coil is disposed on the mounting frame. Projections of the plurality of mounting pillars on the bottom plate at least partially overlap projections of the plurality of support pillars on the bottom plate.