Abstract: The present disclosure provides a liquid cooling seal box, a box cover thereof, and an in-vehicle cooling system. The liquid cooling seal box includes a sealed heat conduction box body, an inner cavity of the heat conduction box body includes a heating device and an insulating liquid in which the heating device is immersed, the insulating liquid absorbs heat of the heating device and vaporizes, vaporized steam rises to the top of the inner cavity of the heat conduction box body to be cooled and liquefied, and a liquefied insulating liquid falls back into the insulating liquid at the bottom of the inner cavity. The liquid cooling seal box of the present disclosure resolves problems of reliability, harsh environment, balance of volume and computation power, etc., is suitable for an in-vehicle system, and may implement stable and reliable running of a server in an in-vehicle environment.

Abstract: A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is slidably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

Abstract: The invention relates to detection technology field and provides a tool-less tray that is detachably mounted on a casing inner wall. The tray has a plate body and a side wall; at least 3 shaped holes are disposed on the side wall; at least one screw pillar is fixed to the plate body and is configured to be firmly connected to an additional function board. The technical solution provided by the invention is tool-less, realizes fast installation and detachment of tray, realizes fast addition and removal of additional function board in limited space and is convenient to be used.

Abstract: A server assembly including a mounting frame, a battery box and a battery. The mounting frame includes an accommodation space configured to accommodate a disk drive. The battery box is disposed in the accommodation space of the mounting frame. The battery is installed in the battery box.

Abstract: A circuit structure with automatic PCIe lane configuration adjustment and a method thereof are disclosed. The circuit structure includes a plurality of PCIe riser cards and a motherboard. The PCIe riser cards are of at least two lane sizes each associated with a PCIe size identifier. The motherboard includes a plurality of PCIe ports, a CPLD module, a storage unit, a BMC module and a BIOS unit. The PCIe ports are electrically connected to the respective PCIe riser cards via a plurality of PCIe cables. The CPLD module is electrically connected to the PCIe ports so as to be able to read the PCIe size identifiers thereof and determine current configuration information from a comparison between the PCIe size identifiers and present signals.

Abstract: The present invention provides a solid-state hard disk lug-in device, including: a main body; a solid-state hard disk installation slot arranged on one side of the main body; and plug-in components. The plug-in components include an operating switch and an operating handle. When the operating switch is closed, the operating handle is restricted to a closed position, and when the operating switch is open, the operating handle is released to an extended position; when the operating handle in the closed position is pushed by an external force, the solid-state hard disk can be inserted into the hard disk slot of the solid-state hard disk system; when the operating handle in the extended position is pulled by an external force, the solid-state hard disk can be pulled out of the hard disk slot.

Abstract: A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

Abstract: An electronic apparatus includes a display module and a plurality of metallic elements. The metallic elements at least partially surround at least three sides of the display module to form a metallic frame. The metallic frame is configured to receive a fifth generation (5G) mobile signal, in which adjacent two of the metallic elements have a gap therebetween.

Abstract: A method for generating reconstruction a reconstructed image is adapted to an input image having a target object. The method comprises converting the input image into a feature map with vectors by an encoder; performing a training procedure according to training images of reference objects to generate feature prototypes associated with the training images and store the feature prototypes to a memory; selecting a part of feature prototypes from the feature prototypes stored in the memory according to similarities between the feature prototypes and the feature vectors; generating a similar feature map according the part of feature prototypes and weights, wherein the weights represents similarities between the part of feature prototypes and the feature vectors; and converting the similar feature map into the reconstructed image by a decoder; wherein the encoder, the decoder and the memory form an auto-encoder.

Abstract: A supporting base and a relief valve. Relief valve includes valve body, restoring component and plug. Valve body includes first cover plate and first side wall. First cover plate and first side wall together form opening. First side wall includes pressure releasing hole. Vent of casing is connected to opening. Pressure releasing hole is connected to opening. Plug includes second cover plate and second side wall. Second side wall and second cover plate together form recession. Recession is connected to accommodation space via vent. Second cover plate is movably disposed in opening via restoring component. When plug is in initial position, pressure releasing hole is disconnected from accommodation space. When plug is in releasing position, pressure releasing hole is connected to accommodation space via vent.

Abstract: A hard disk supporting structure is provided. The hard disk supporting structure includes a hard disk rack, a crawler mechanism, and a motor. The hard disk rack is for disposing at least one hard disk. A crawler of the crawler mechanism is fixedly connected with the hard disk rack. The motor is connected to a driving gear of the crawler mechanism. The motor drives the rotation of the driving gear, to enable the crawler to drive the hard disk rack to move back and forth. The hard disk supporting structure can automatically move the hard disk rack back and forth through a structure with automatic telescopic function, which greatly saves labor, and improves efficiency.

Abstract: A fixing device includes a substrate, a slot, a fixing bracket. The slot is disposed on the substrate, and a first end of an expansion unit is inserted in the slot. The fixing bracket is disposed on the substrate, in which the fixing bracket includes a force receiving upper portion and a supporting lower portion. An accommodating space is defined between the force receiving upper portion and the supporting lower portion. When a force is applied to or released from the force receiving upper portion, the force receiving upper portion elastically deforms or elastically recovers. Therefore, the fixing bracket switches between an open state and a fixing state for enabling the accommodating space to selectively accommodate a second end of the expansion unit.

Abstract: A server casing assembly includes a casing, a first cage, a second cage, and a latch. The casing has two accommodation spaces spaced apart from each other. The first cage and the second cage are respectively accommodated in the accommodation spaces. The latch is slidably disposed on the casing. The latch is movable between a first unlocked position and a second unlocked position. When the latch is in the first unlocked position, the latch is engaged with the second cage, and the first cage is released from the latch. When the latch is in the second unlocked position, the latch is engaged with the first cage, and the second cage is released from the latch.

Abstract: An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

Abstract: A grid clustering-based system for locating abnormal area of solder paste printing and a method thereof are disclosed. In the system, an analysis device divides circuit board size information to generate divided grids based on grid size information, when a total number of at least one bad solder joint of one of the divided grids is determined to be higher than or equal to a density threshold value, the analysis device sets the one of divided grids as a high dense grid, the analysis device then integrates the divided grids, which are high dense grids and interconnected to each other, as a high-dense bad solder joint area. Therefore, the technical effect of integrating high dense areas of bad solder joint to locate the bad solder joint can be achieved.

Abstract: A server includes a casing, a frame, at least one movable carrier and at least one M.2 expansion card. The casing has a through hole. The frame has an opening and an accommodation space connected to the opening. The frame is fixed in the casing and the opening corresponds to the through hole, so that the accommodation space is exposed to exterior via the through hole. The at least one movable carrier is removably disposed in the accommodation space, and the at least one M.2 expansion card is disposed on the movable carrier.

Abstract: An assembling structure includes a working element, a housing and a limiting member. The working element includes first and second pins. The housing includes an opening. The working element is located in the opening. The first and second pins of the working element extend toward an interior of the housing. The limiting member is connected to the housing. The limiting member includes a supporting plate and a convex member. The convex member includes a first abutting portion and a second abutting portion. The first pin and the second pin respectively abut against the first abutting portion and the second abutting portion.

Abstract: A self-test system for PCIe and a method thereof are disclosed. In the system, a first circuit interconnect card and a second circuit interconnect card are inserted into CEM slots, respectively, and the first circuit interconnect card and the second circuit interconnect card are electrically connected to each other through a FFC, the central processing unit generates and provides differential signals to the first circuit interconnect card and the second circuit interconnect card; the first circuit interconnect card or the second circuit interconnect card provide differential signals to the second circuit interconnect card or the first circuit interconnect card through the first FFC interface and the second FFC interface, respectively, and the second circuit interconnect card or the first circuit interconnect card provides the differential signals to a central processing unit, so as to implement self-check for PCIe.

Abstract: An electronic assembly including first circuit board, second circuit board, and optical communication component. First circuit board includes first board and first connector. First connector is fixed on first board. Second circuit board includes second board and second connector. Second connector is fixed on second board. Optical communication component includes first communication card, first light-emitting component, second communication card, first photodetector and optical-fiber cable. First communication card is plugged into first connector. First light-emitting component is fixed on and electrically connected to first communication card. Second communication card is plugged into second connector. First photodetector is fixed on and electrically connected to second communication card. Two opposite ends of optical-fiber cable are respectively fixed to first communication card and second communication card to respectively be optically coupled to first light-emitting component and first photodetector.

Abstract: An electronic assembly including motherboard, first slide rail, second slide rail, expansion card and engagement component. Motherboard includes main circuit board and first connector. First and second slide rails are fixed on main circuit board. First slide rail has first engagement hole. Expansion card includes expansion circuit board and second connector. Expansion circuit board is disposed on first and second slide rails and has first positioning recess. Second connector is plugged into first connector. Engagement component includes connecting portion, first movable end portion, second movable end portion, first protruding portion, and second protruding portion. First and second movable end portions are respectively connected to two opposite sides of connecting portion. First protruding portion protrudes from first movable end portion and is removably engaged with first positioning recess.