Abstract: A computer that includes a processor and memory storing instructions executable by the processor. The computer may be programmed to: determine feature-selection data; determine that a mobile device is within a proximity threshold of a vehicle; and in response to the determinations, control a vehicle display in accordance with the feature-selection data.
Type:
Grant
Filed:
February 3, 2017
Date of Patent:
September 20, 2022
Assignee:
Ford Global Technologies, LLC
Inventors:
Stuart C. Salter, Annette Lynn Huebner, Paul Kenneth Dellock, James J. Surman
Abstract: According to the invention, there is provided seed and plants of the hybrid corn variety designated CH011138. The invention thus relates to the plants, seeds and tissue cultures of the variety CH011138, and to methods for producing a corn plant produced by crossing a corn plant of variety CH011138 with itself or with another corn plant, such as a plant of another variety. The invention further relates to genetic complements of plants of variety CH011138.
Type:
Grant
Filed:
September 14, 2020
Date of Patent:
September 20, 2022
Assignee:
MONSANTO TECHNOLOGY, LLC
Inventors:
Sandeep Bhatnagar, Gregory J. Holland, Gary R. Stangland
Abstract: The present disclosure provides a multilayer film containing at least three layers, including (A) a core layer containing a high density polyethylene (HDPE) having a density from 0.940 g/cc to 0.980 g/cc; and (B) skin layers on opposite sides of the core layer. Each skin layer includes (i) a propylene/ethylene copolymer with from greater than 0 wt % to 5 wt % units derived from ethylene comonomer; (ii) from 3,000 to 3,500 ppm of a slip agent; and (iii) from 4,000 to 10,000 ppm of an antiblock agent.
Type:
Grant
Filed:
April 9, 2018
Date of Patent:
September 20, 2022
Assignees:
Dow Global Technologies LLC, PBBPolisur S.R.L.
Abstract: An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. Memory openings and support openings are formed through the alternating stack, and memory opening fill structures and support pillar structures are formed in the memory openings and in the support openings, respectively. Via cavities extending to each of the sacrificial material layers are formed through the alternating stack without forming any stepped surfaces in the alternating stack. The via cavities may be formed in areas that do not overlap with the support pillar structures, or in areas that include at least one support pillar structure. Sacrificial via fill structures are formed in the via cavies, and the sacrificial material layers are replaced with electrically conductive layers. The sacrificial via fill structures are removed, and a combination of a tubular dielectric spacer and a contact via structure can be formed in the via cavities.
Abstract: The present invention concerns virtual reality viewers for use with touchscreen enabled mobile devices. The virtual reality viewer comprises: a housing configured to receive a mobile electronic device within an interior of the housing; and an input mechanism that is accessible from an exterior of the housing and that is movable within the interior between a first position and an extended position, wherein a surface of the input mechanism is configured to contact the touch-screen of the mobile electronic device when in the extended position. The disclosed systems and methods facilitate receiving user inputs on the exterior of the housing and providing the user inputs to the touchscreen within the housing using the electro-mechanical input mechanism. Accordingly, the viewer can be used with a variety of smartphones without requiring magnetic switches or a wireless/cable connection between the input device and the smartphone.
Abstract: A method of treating water in a water treatment system after a replacement of an ion exchange bed includes introducing water to be treated into the ion exchange bed of the water treatment system to produce treated water, calculating a current exchange daily average flow rate of water through the water treatment system, calculating a cumulative daily average flow rate of water through the water treatment system, and determining an estimated number of days remaining to exhaustion of the ion exchange bed based on the current exchange daily average flow rate and the cumulative daily average flow rate.
Type:
Grant
Filed:
March 17, 2020
Date of Patent:
September 20, 2022
Assignee:
Evoqua Water Technologies LLC
Inventors:
Erich G. Hoefferle, Isabel Rozario, Stephen Mildner
Abstract: A two-component adhesive composition is disclosed. The adhesive composition comprises an isocyanate component comprising an isocyanate-terminated prepolymer that is the reaction product of a polyisocyanate and an isocyanate reactive component having an average molecular weight greater than 1,000 that comprises a polyester polyol that is the reaction product of a polyhydric alcohol and a polybasic acid. The NCO content of the isocyanate component is, optionally, between 3 and 9%. The isocyanate reactive component comprises a polyester polyol that accounts for 50 wt % or more of the isocyanate reactive component. The composition further comprises a polyol component comprising polyether polyols having an average molecular weight less than 1,500. The composition still further comprises an adhesion promoter. The average functionality of the adhesive composition is from 2 to 2.4. The adhesive composition provides for improved performance and processability. A method for forming a laminate is also disclosed.
Type:
Grant
Filed:
May 22, 2017
Date of Patent:
September 20, 2022
Assignee:
Dow Global Technologies LLC
Inventors:
Rui Xie, Mikhail Y. Gelfer, Jonathan Barrus
Abstract: In various embodiments, a resin composition includes a urethane (meth)acrylate, a reactive diluent, and a urethane (meth)acrylate toughener. The urethane (meth)acrylate toughener includes at least one additional polyol having a number average molecular weight Mn of greater than 1,000 g/mol. Cured articles made from the resin composition have an average fracture toughness (KIc) value from 1 MPa*m1/2 to 3 MPa*m1/2 when measured in accordance with ASTM D5045. Processes for making the resin composition as well as processes using the resin composition are also provided.
Type:
Grant
Filed:
September 7, 2017
Date of Patent:
September 20, 2022
Assignee:
Dow Global Technologies LLC
Inventors:
Huifeng Qian, Rajat Duggal, Muhammad A. Shafi, Luigi Pellacani, Harshad M. Shah
Abstract: The invention relates to the soybean variety designated 01077870. Provided by the invention are the seeds, plants and derivatives of the soybean variety 01077870. Also provided by the invention are tissue cultures of the soybean variety 01077870 and the plants regenerated therefrom. Still further provided by the invention are methods for producing soybean plants by crossing the soybean variety 01077870 with itself or another soybean variety and plants produced by such methods.
Abstract: According to the invention, there is provided seed and plants of the hybrid corn variety designated CH011043. The invention thus relates to the plants, seeds and tissue cultures of the variety CH011043, and to methods for producing a corn plant produced by crossing a corn plant of variety CH011043 with itself or with another corn plant, such as a plant of another variety. The invention further relates to genetic complements of plants of variety CH011043.
Type:
Grant
Filed:
September 14, 2020
Date of Patent:
September 20, 2022
Assignee:
MONSANTO TECHNOLOGY, LLC
Inventors:
Gregory J. Holland, Jeffrey M. Sernett, Gary R. Stangland
Abstract: The invention relates to the soybean variety designated 01078100. Provided by the invention are the seeds, plants and derivatives of the soybean variety 01078100. Also provided by the invention are tissue cultures of the soybean variety 01078100 and the plants regenerated therefrom. Still further provided by the invention are methods for producing soybean plants by crossing the soybean variety 01078100 with itself or another soybean variety and plants produced by such methods.
Abstract: According to the invention, there is provided seed and plants of the hybrid corn variety designated CH011032. The invention thus relates to the plants, seeds and tissue cultures of the variety CH011032, and to methods for producing a corn plant produced by crossing a corn plant of variety CH011032 with itself or with another corn plant, such as a plant of another variety. The invention further relates to genetic complements of plants of variety CH011032.
Type:
Grant
Filed:
September 21, 2020
Date of Patent:
September 20, 2022
Assignee:
Monsanto Technology LLC
Inventors:
Fufa H. Birru, Christian J. Buffard, Jeffrey M. Sernett
Abstract: According to the invention, there is provided seed and plants of the hybrid corn variety designated CH011034. The invention thus relates to the plants, seeds and tissue cultures of the variety CH011034, and to methods for producing a corn plant produced by crossing a corn plant of variety CH011034 with itself or with another corn plant, such as a plant of another variety. The invention further relates to genetic complements of plants of variety CH011034.
Abstract: Systems on a chip (SoCs) include security logic configured to increase resistance to fault injection attacks (FIAs). The security logic includes a monitoring circuit and a cascaded series of substitution-boxes (S-Boxes) having a circuit delay that is designed to match (or most closely match) the computing device critical path length. The monitoring circuit monitors the number of iterations required for the cascaded series of S-Boxes to return to an initial value and generates an error signal if the monitored loop length is different from the expected loop length. In some examples, the error signal is received by a mitigation processor that executes one or more processes aimed at mitigating the attack.
Type:
Grant
Filed:
January 19, 2021
Date of Patent:
September 20, 2022
Assignee:
FACEBOOK TECHNOLOGIES, LLC
Inventors:
Sudhir Satpathy, Wojciech Stefan Powiertowski, Nagendra Gupta Modadugu, Neeraj Upasani
Abstract: The present invention provides aqueous compositions for making damage tolerant coatings comprising a blend of (i) from 2 to 30 wt. %, based on the total weight of solids in the composition, of an acid or anhydride functionalized polyolefin dispersion having an average particle size of from 0.2 to 5 microns, and (ii) a film forming dispersion of one or more epoxy resins chosen from epoxy resins having an epoxy equivalent weight (EEW) of from 150 to 4,000 having an average particle size of from 0.2 to 1.0 microns, wherein the polyolefin dispersion is stabilized with from 2 to 8 wt. %, based on the total weight of solids in the composition, one or more anionic surfactants, such as a sulfate containing surfactant, and, further wherein, the compositions have a pH of from 3 to 8.
Type:
Grant
Filed:
May 1, 2017
Date of Patent:
September 20, 2022
Assignee:
Dow Global Technologies LLC
Inventors:
Robert R. Bills, Liang Chen, David L. Malotky, Jay D. Romick
Abstract: Semiconductor devices can be formed over a semiconductor substrate, and interconnect-level dielectric material layers embedding metal interconnect structures can be formed thereupon. In one embodiment, a pad-connection-via-level dielectric material layer, a proximal dielectric diffusion barrier layer, and a pad-level dielectric material layer can be formed. Bonding pads surrounded by dielectric diffusion barrier portions can be formed in the pad-level dielectric material layer. In another embodiment, a layer stack of a proximal dielectric diffusion barrier layer and a pad-and-via-level dielectric material layer can be formed. Integrated pad and via cavities can be formed through the pad-and-via-level dielectric material layer, and can be filled with bonding pads containing dielectric diffusion barrier portions and integrated pad and via structures.
Abstract: Methods and systems are provided for mitigating hydrocarbon breakthrough from an onboard fuel vapor canister during an engine-off condition. In one example, a method may include actively routing ambient air to an exhaust catalyst to reducing a temperature of the exhaust catalyst.