Patents Assigned to IT Corporation
  • Patent number: 10299710
    Abstract: An organism optical measurement device having a light transmitter/receiver control unit for obtaining measurement data concerning brain activities and a measurement data display control unit for displaying the measurement data. The organism optical measurement device is further provided with a head surface appearance image acquiring unit for acquiring a head surface appearance image of a subject, a head surface appearance image display control unit for displaying the head surface appearance image, and a measurement-related position calculating unit for calculating the measurement-related position in the head surface appearance image from which the measurement data is obtained when an input device specifies the positions in the head surface appearance image corresponding to the positions of a light transmitting probe and a light receiving probe disposed on the head surface of the subject.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: May 28, 2019
    Assignee: SHIMADZU CORPORATION
    Inventor: Akihiro Ishikawa
  • Patent number: 10302409
    Abstract: An apparatus includes a number of photonic integrated circuit (PIC) imaging detector arrays, and multiple electronic integrated circuits (ICs) coupled to the PIC imaging detector arrays. Each PIC imaging detector array of includes a number of lenslets and a number of waveguides. At least some of the lenslets are coupled to multiple waveguides, and sets of two lenslets are configured to form interferometer channels.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: May 28, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: Alan Lee Duncan, Richard Lee Kendrick
  • Patent number: 10304940
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, a method includes forming a plurality of fins and forming a plurality of gate structures over the plurality of fins. A dielectric material structure is formed between adjacent ones of the plurality of gate structures. A portion of a first of the plurality of gate structures is removed to expose a first portion of each of the plurality of fins, and a portion of a second of the plurality of gate structures is removed to expose a second portion of each of the plurality of fins. The exposed first portion of each of the plurality of fins is removed, but the exposed second portion of each of the plurality of fins is not removed.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: May 28, 2019
    Assignee: Intel Corporation
    Inventors: Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth
  • Patent number: 10305628
    Abstract: A transmission frame generating device generates a transmission frame. The generating device includes a control information signal generator which generates a modulation method control signal indicating a modulation method used for a data signal and an error correction method control signal indicating an error correction method used for the data signal and a frame former which forms the transmission frame by arranging a training signal, the data signal, the modulation method control signal and the error correction method control signal on a plurality of subcarriers on a frequency axis. The modulation method control signal being repeatedly and discretely arranged on a first multiple of the plurality of subcarriers on the frequency axis and the error correction method control signal being repeatedly and discretely arranged on a second multiple of the plurality of the subcarriers on the frequency axis.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: May 28, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Yutaka Murakami, Katsuaki Abe, Masayuki Orihashi, Akihiko Matsuoka
  • Patent number: 10305267
    Abstract: An electrical connection box includes a box main body having an opening portion in an upper end portion at a time of installation, and an upper cover that blocks the opening portion at the time of installation. The box main body has an insertion wall portion continuously formed along an outer circumference of the box main body in the upper end portion at the outer circumference of the box main body. The upper cover has a groove portion continuously formed along an outer circumference of the upper cover in a lower end portion at the outer circumference of the upper cover. Here, the insertion wall portion is inserted into the groove portion from lower side when the opening portion of the box main body is blocked. At least one rib protruding downward from a bottom portion of the groove portion is formed in the groove portion.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: May 28, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Daisuke Kawada, Yuki Komiya
  • Patent number: 10300085
    Abstract: A nutrient composition, a lipid metabolism-improving agent, and prophylactic and/or therapeutic agents typically for inflammatory bowel diseases, immune disorders, cancers, non-alcoholic steatohepatitis, obesity, diabetes, and hypercholesterolemia each contain a cellulose acetate having a total degree of acetyl substitution of 0.4 to 1.1. The cellulose acetate may be one having a compositional distribution index (CDI) of 2.0 or less, where the CDI is defined by the formula: CDI=(Measured value of half height width of chemical composition)/(Theoretical value of half height width of chemical composition) where the measured value of half height width of chemical composition represents a half height width of chemical composition determined by HPLC analysis of a cellulose acetate propionate prepared by propionylating all residual hydroxy groups of the cellulose acetate (sample), and the theoretical value of half height width of chemical composition =2.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: May 28, 2019
    Assignee: DAICEL CORPORATION
    Inventors: Shu Shimamoto, Toshikazu Nakamura, Shizuka Ukita, Tsuyoshi Nakamura, Ryoko Yamauchi, Hiroshi Kobayashi, Tatsuya Morita, Tomomi Genda
  • Patent number: 10300690
    Abstract: An ink film construction including: (a) a first printing substrate selected from the group consisting of an uncoated fibrous printing substrate, a commodity coated fibrous printing substrate, and a plastic printing substrate; and (b) an ink dot set contained within a square geometric projection projecting on the first printing substrate, the ink dot set containing at least 10 distinct ink dots, fixedly adhered to a surface of the first printing substrate, all the ink dots within the square geometric projection being counted as individual members of the set, each of the ink dots containing at least one colorant dispersed in an organic polymeric resin, each of the dots having an average thickness of less than 2,000 nm, and a diameter of 5 to 300 micrometers; each ink dot of the ink dots having a generally convex shape in which a deviation from convexity, (DCdot), is defined by: DCdot=1?AA/CSA, AA being a calculated projected area of the dot, the area disposed generally parallel to the first fibrous printing sub
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: May 28, 2019
    Assignee: LANDA CORPORATION LTD.
    Inventors: Benzion Landa, Sagi Abramovich, Galia Golodetz, Gregory Nakhmanovich, Alon Asher, Mattetyahu Litvak
  • Patent number: 10304814
    Abstract: An apparatus is described. The apparatus includes a package on package structure. The package on package structure includes an upper package and a lower package. One of the packages contain memory devices of a first type and the other of the packages contain memory devices of a second type. I/O connections on the underside of the upper package's substrate are vertically aligned with their corresponding, first I/O connections on the underside of the lower package's substrate. The first I/O connections are located outside second I/O connections on the underside of the lower package's substrate for the lower package.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: May 28, 2019
    Assignee: Intel Corporation
    Inventors: Konika Ganguly, Robert J. Royer, Jr., Rebecca Z. Loop, Anthony M. Constantine, Bilal Khalaf
  • Patent number: 10304850
    Abstract: A semiconductor memory device according to an embodiment includes a substrate, a stacked body provided on the substrate, a plurality of electrode films being stacked to be separated from each other in the stacked body, a semiconductor pillar piercing the plurality of electrode films, a first insulating film provided between the semiconductor pillar and the electrode films, a second insulating film provided between the semiconductor pillar and the first insulating film; and a third insulating film provided between the first insulating film and the electrode films. The first insulating film includes silicon, nitrogen, oxygen, and carbon.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: May 28, 2019
    Assignee: Toshiba Memory Corporation
    Inventors: Kazuhiro Matsuo, Masayuki Tanaka, Shinji Mori, Kenichiro Toratani
  • Patent number: 10300502
    Abstract: [Object] To provide a pump dispenser which allows accurate determination of a direction of spraying of liquid without a nozzle part moving toward a higher or lower position and, furthermore, whose trigger is excellent in operability.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: May 28, 2019
    Assignee: CANYON CORPORATION
    Inventors: Tetsuya Tada, Mitsuaki Shaduki
  • Patent number: 10303335
    Abstract: Aspects of the disclosure relate to multicomputer processing of client device request data with centralized event orchestration. A computing platform may receive, from a client computing device, event definition information defining an event. Subsequently, the computing platform may receive, from a recipient computing device associated with the event, a request for a delivery selection user interface. The computing platform may send the delivery selection user interface to the recipient computing device and may receive, from the recipient computing device, delivery selection information identifying a destination for the event selected by a user of the recipient computing device. Subsequently, the computing platform may generate one or more event orchestration commands directing an external event processor to execute one or more actions associated with the event, and may send the one or more event orchestration commands to the external event processor via an external event processing interface.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: May 28, 2019
    Assignee: Bank of America Corporation
    Inventors: Dean L. Henry, Matthew R. Leavenworth, Ather Williams, III, Eileen M. Holcomb
  • Patent number: 10301509
    Abstract: A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23° C. to 400° C. in the air at a heating rate of 10° C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: May 28, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuki Sugo, Nao Kamakura, Tsuyoshi Ishizaka, Mitsuaki Fusumada
  • Patent number: 10300496
    Abstract: The present invention relates to core-shell-particles, wherein the core comprises at least one metal, or a compound thereof, or a mixture of at least one metal or a compound thereof and at least one semimetal or a compound thereof, and the shell comprises at least one silicon comprising polymer, to a process for the preparation of these core-shell-particles, to the use of these core-shell-particles in an agglomeration-deagglomeration process, in particular in chemical, physical or biological test methods or separation processes, decontamination processes, water purification, recycling of electrical/electronic scrap or gravity separation, and to a process for separating at least one first material from a mixture comprising this at least one first material and at least one second material.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: May 28, 2019
    Assignees: BASF SE, BASF Corporation
    Inventors: Florian Blasberg, Andreas Luz, Igor Shishkov, David J. Gilbert, Wolfgang Rohde
  • Patent number: 10300703
    Abstract: Provided is a printer wherein ink can be easily injected and filled into a tank. A printer including: a printing head; a housing; a body cover shiftable between a closed state of closing an opening of the housing and an open state of exposing the opening; a tank including an ink container and an ink inlet port receiving the ink injection into the ink container; and a tank cover shiftable between a closed state of closing the ink inlet port and an open state of exposing the ink inlet port. The body cover in the closed state covers a portion of the tank cover, and the ink inlet port is located outside a region of the body cover. The tank cover changes from the closed state to the open state, triggered by the body cover changing from the closed state to the open state.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: May 28, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Hideki Okumura, Naomi Kimura, Shoma Kudo, Motoyoshi Shirotori
  • Patent number: 10304693
    Abstract: Various embodiments herein relate to methods, apparatus and systems for forming a recessed feature in dielectric material on a semiconductor substrate. Separate etching and deposition operations are employed in a cyclic manner. Each etching operation partially etches the feature. Each deposition operation forms a protective coating on the sidewalls of the feature to prevent lateral etch of the dielectric material during the etching operations. The protective coating may be deposited using methods that result in formation of the protective coating along substantially the entire length of the sidewalls. The protective coating may be deposited using particular reactants and/or reaction mechanisms that result in substantially complete sidewall coating at relatively low temperatures without the use of plasma. In some cases the protective coating is deposited using molecular layer deposition techniques. In certain implementations the protective coating is fluorinated.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: May 28, 2019
    Assignee: Lam Research Corporation
    Inventor: Eric A. Hudson
  • Patent number: 10304984
    Abstract: A photovoltaic device and method include a doped germanium-containing substrate, an emitter contact coupled to the substrate on a first side and a back contact coupled to the substrate on a side opposite the first side. The emitter includes at least one doped layer of an opposite conductivity type as that of the substrate and the back contact includes at least one doped layer of the same conductivity type as that of the substrate. The at least one doped layer of the emitter contact or the at least one doped layer of the back contact is in direct contact with the substrate, and the at least one doped layer of the emitter contact or the back contact includes an n-type material having an electron affinity smaller than that of the substrate, or a p-type material having a hole affinity larger than that of the substrate.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: May 28, 2019
    Assignee: International Business Machines Corporation
    Inventors: Stephen W. Bedell, Keith E. Fogel, Bahman Hekmatshoar-Tabari, Devendra K. Sadana, Ghavam G. Shahidi, Davood Shahrjerdi
  • Patent number: 10305970
    Abstract: A mechanism is provided for automatically recovering one or more distributed cluster nodes on a host system. Responsive to the host system recovering, restoring, or restarting, a set of distributed clustered systems affected due to the reboot of the host system and details associated with each of the set of distributed clustered systems are identified. Using the details, a set of nodes that operate on the host system are identified. For each node: respective components and configurations are prepared; a heartbeat is initiated thereby causing the node to register with a cluster network and identify peers within their associated distributed clustered system; a determination is made as to whether the node has reestablished connection with its associated distributed clustered system; and, responsive to the node reestablishing connection with its associated distributed clustered system, service components are started on the node.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: May 28, 2019
    Assignee: International Business Machines Corporation
    Inventors: Anjali Agarwal, Rachit Arora, Rakhi S. Arora, Dharmesh K. Jain, Shrinivas S. Kulkarni
  • Patent number: 10306753
    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: May 28, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kathleen Ann Fadden, James A. Busby, David C. Long, John R. Dangler, Alexandra Echegaray, Michael J. Fisher, William Santiago-Fernandez
  • Patent number: 10299762
    Abstract: An object of the present invention is to provide an ultrasound diagnostic apparatus, a signal processing method, and a recording medium which are capable of eliminating a ghost signal with a small number of data when correcting element data by superimposing a plurality of element data, obtaining a high quality ultrasound image while preventing a decrease in the frame rate, and reducing the capacity of a memory. Information on a transmission frequency of an ultrasonic beam is acquired, and second element data is generated using a plurality of first element data on the basis of the acquired information on a transmission frequency.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: May 28, 2019
    Assignee: FUJIFILM Corporation
    Inventor: Hiroaki Yamamoto
  • Patent number: 10300423
    Abstract: A sealed honeycomb structure may include porous walls dividedly forming inlet cells and outlet cells extending from an end surface of an inlet side to an end surface of an outlet side, an outlet side sealing portion, and an inlet side sealing portion, wherein at least one outlet cell is a reinforced cell, where a reinforced part for reinforcing the outlet cell is formed at at least one corner portion at which the walls on a cross-section vertical to an extending direction of the cell cross each other, and wherein the inlet cell is a non-reinforced cell where the reinforced part is not formed at all the corner portions at which the walls on the cross-section vertical to the extending direction of the cell cross each other.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 28, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corporation, NGK Insulators, Ltd.
    Inventors: Tetsuo Toyoshima, Akira Takahashi, Yuichi Hamazaki, Jung Min Seo, Won Soon Park