Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.

Abstract: A display method is for a display apparatus to display an image, and includes: obtaining a captured display image and a decode target image by an image sensor capturing an image of a subject; obtaining a light ID by decoding the decode target image; transmitting the light ID to a server; obtaining, from the server, an AR image and recognition information which are associated with the light ID; recognizing a region according to the recognition information as a target region from the captured display image; and displaying the captured display image in which the AR image is superimposed on the target region.

Abstract: A system, method and program product for optimizing a team to solve a problem. The system includes: a team building system for building a fundamental analytic team from a database of analysts to solve an inputted problem, wherein the fundamental analytic team includes at least one cluster of analysts characterized with specificity and at least one cluster of analysts characterized with sensitivity; and a problem analysis system that collects sensor data from the fundamental analytic team operating within an immersive environment, wherein the problem analysis system includes a system for evaluating the sensor data to identify a bias condition from the fundamental analytic team, and includes a system for altering variables in the immersive environment in response to a detected bias condition.

Abstract: The present disclosure relates to an electronic device and a wireless communication method in a wireless communication system. The electronic device of the present disclosure comprises one or more processing circuits, configured to: acquire scenario identification information, comprising first link information that indicates the quality of a link between the electronic device and a user equipment, second link information that indicates the quality of a link between the electronic device and a base station, serving cell received power change rate information, and neighboring cell received power change rate information; and determine scenario information based on the scenario identification information, to inform the user equipment, so as to assist the user equipment to execute a relay reselection process, or to assist the electronic device to execute a relay selection process.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: A water-based inkjet ink composition for printing on nonabsorbent base material contains alkali-soluble resin-coated pigment, basic compound, water-soluble organic solvent, surface-active agent A, and surface-active agent B. Surface-active agent A is an acetylene diol compound represented by the following formula: Surface-active agent B is a compound with an HLB value of 4 to 9 obtained by adding an ethylene oxide to an acetylene diol compound. The content of surface-active agent A in the water-based inkjet ink composition is 0.1 to 1 percent by mass, and the content of surface-active agent B in the water-based inkjet ink composition is 0.4 to 2.5 percent by mass. The static surface tension of the ink composition is 27 to 32 mN/m.

Abstract: A mechanism is provided for automatically recovering one or more distributed cluster nodes on a host system. Responsive to the host system recovering, restoring, or restarting, a set of distributed clustered systems affected due to the reboot of the host system and details associated with each of the set of distributed clustered systems are identified. Using the details, a set of nodes that operate on the host system are identified. For each node: respective components and configurations are prepared; a heartbeat is initiated thereby causing the node to register with a cluster network and identify peers within their associated distributed clustered system; a determination is made as to whether the node has reestablished connection with its associated distributed clustered system; and, responsive to the node reestablishing connection with its associated distributed clustered system, service components are started on the node.

Abstract: The present disclosure relates to signal processing such as image processing, signal encoding, digital watermarking and data hiding. A sparse or dense digital watermark signal can be conveyed with a narrow-band absorption material corresponding to a center wavelength of a Point of Sale (POS) barcode scanner. The POS barcode scanner typically captures 2D imagery. Since the narrow-band absorption material absorbs over a narrow-band it is relatively imperceptible to the Human Visual System (HVS) but can be seen by the POS scanner.

Abstract: A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

Abstract: The disclosure is related to an advertisement service using mobile vehicles. Particularly, the disclosure relates to providing advertisement content selected based on statistical information on an advertisement target at an advertisement display location. Furthermore, the selected advertisement content may be provided to a corresponding mobile vehicle before the corresponding mobile vehicle arrives at the advertisement display location.

Abstract: In an ignition coil for an internal combustion engine, a spark plug is incorporated which has an insulator including an insulator head that has no corrugation. The ignition coil has a coil body part generating high voltage and a joint part, which holds therein a conducting member electrically connecting the coil body part and a spark plug. The joint part has a plug cap into which the insulator head of the spark plug is inserted and which is formed of an elastic member having a cylindrical shape. The plug cap has a close-contact part whose inner peripheral surface is closely brought into contact with an outer peripheral surface of the insulator. The close-contact part has a tip end-side close-contact part positioned at a tip end side with respect to a middle position in an axial direction, and a base end-side close-contact part positioned at a base end side with respect to the middle position.

Abstract: A high-linearity linearizer system includes a multi-stage linearizer circuit formed by cascading multiple linearizer circuits. The multi-stage linearizer circuit is configured to pre-distort an input signal to generate a pre-distorted signal. A non-linear high-power amplifier (HPA) having non-linear characteristics is coupled to the multi-stage linearizer circuit and is configured to amplify the pre-distorted signal. Pre-distortion characteristics of the multi-stage linearizer circuit are configured to counter the non-linear characteristics of the non-linear HPA and to compensate a non-linearity of the non-linear HPA to achieve a desired level of linearity.

Abstract: Determining the geographic location of a portable electronic device (100) in a radio communications network, by transmitting radio signals from a plurality of first network transmitters (200, 300, 400); receiving, in the network, a measurement signal from the portable electronic device, which measurement signal comprises, for each transmitted radio signal, a plurality of data samples obtained in the electronic device from the respective transmitted signal at different time points during a measurement period with movement of the portable electronic device (100), and local position data associated to each data sample obtained from a local positioning unit in the electronic device, so as to form a synthetic antenna array; obtaining, a direction measurement between the electronic device and the first network transmitter from the synthetic antenna array; obtaining geographic location data for the first network transmitter; and identifying geographic location data of the portable electronic device based on the dire

Abstract: An adhesive film including a substrate film and an adhesive agent layer formed thereon is adhered to the back surface side of a mounting region of a flexible substrate, and an electronic component is mounted on the front surface side. An adhesive agent in the adhesive agent layer contains silica fine particles having a primary particle diameter of less than 100 nm, and the adhesive agent layer has a shear storage elastic modulus at 160° C. of 0.15 MPa or more. When the anisotropic conductive film is disposed on the mounting region and the electronic component is mounted on the anisotropic conductive film by heating and pressing, the adhesive agent is not pushed out to a large extent, and conductive particles sandwiched between a bump on the electronic component and the electrode are pressed and squashed, improving an electrical connection between the electronic component and the electrode.

Abstract: A method of manufacturing tin-plated copper terminal material as a terminal crimped to a terminal end of an electric wire made of an aluminum wire material, using a base member of copper or copper alloy in which galvanic corrosion is not easy to occur and an adhesiveness of a tin layer is excellent, the method includes: a zinc-nickel alloy layer forming step forming a zinc-nickel alloy layer having a nickel content of 5 mass % to 50 mass % inclusive and a thickness of 0.1 ?m to 5.0 ?m inclusive on a base member made of copper or copper alloy; and a tin-plating step forming a tin layer by tin plating on the zinc-nickel alloy layer; more preferably, following the tin-plating step, the method includes a diffusion treatment step diffusing zinc from the zinc-nickel alloy layer to the tin layer by maintaining at 40° C. to 160° C. inclusive for 30 minutes or longer.

Abstract: A semiconductor device includes a wiring substrate including wiring layers, a semiconductor chip including electrode pads and mounted on the wiring substrate, and a first capacitor including a first electrode and a second electrode, and mounted on the wiring substrate. The wiring layers include a first wiring layer including a first terminal pad electrically connected with the first electrode of the first capacitor and a second terminal pad electrically connected with the second electrode of the first capacitor; and a second wiring layer on an inner side by one layer from the first wiring layer of the wiring substrate and including a first conductor pattern having a larger area than each of the first terminal pad and the second terminal pad. The first conductor pattern includes a first opening in a region overlapping with each of the first terminal pad and the second terminal pad in the second wiring layer.

Abstract: A method, system and memory controller are provided for implementing refresh power optimization during long idle mode in a memory subsystem utilizing Dynamic Random Access Memory (DRAM). The DRAM includes DRAM cells requiring periodic refresh. A DRAM activity monitoring mechanism monitors an instruction queue and asserts a predefined mode register bit when the instruction queue is empty. Responsive to the asserted predefined mode register bit, a refresh rate is increased and a low power mode is established by reducing DRAM core power level for optimizing refresh power during the long idle mode to provide enhanced system performance.

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract: A connector includes a connector housing and a fitting assurance member. A repulsion arm of the connector housing is sandwiched between an arm contact portion of a mating connector and an arm displacement regulation portion of the fitting assurance member and the repulsion arm is elastically deformed to be pressed to an outside by a leading end portion of the arm contact portion to be stretched in a straight line, when the leading end portion of the arm contact portion slides on an inner inclined surface of an arm inclined portion of the repulsion arm toward an arm leading end of the repulsion arm.

Abstract: The present disclosure provides a signal processing system and method for a non-orthogonal multiple access communication system, a base station and a user equipment. The signal processing system is configured to perform interleaving processing on information to be transmitted subjected to modulation processing. The signal processing system can obtain at least one of the following beneficial effects: capable of saving length of an interleaver; and capable of obtaining more diversity gain.