Abstract: A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.
Type:
Grant
Filed:
March 19, 2018
Date of Patent:
May 19, 2020
Assignee:
Hong Kong Beida Jade Bird Display Limited
Inventors:
Wing Cheung Chong, Lei Zhang, Qiming Li, Jen-Shyan Chen
Abstract: A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.
Type:
Grant
Filed:
December 3, 2018
Date of Patent:
April 14, 2020
Assignee:
Hong Kong Beida Jade Bird Display Limited
Abstract: A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.
Type:
Grant
Filed:
August 13, 2018
Date of Patent:
March 24, 2020
Assignee:
Hong Kong Beida Jade Bird Display Limited
Inventors:
Wing Cheung Chong, Lei Zhang, Qiming Li, Jen-Shyan Chen
Abstract: A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.
Type:
Application
Filed:
March 19, 2018
Publication date:
January 30, 2020
Applicant:
Hong Kong Beida Jade Bird Display Limited
Inventors:
Wing Cheung CHONG, Lei ZHANG, Qiming LI, Jen-Shyan CHEN
Abstract: A light-emitting diode (LED) display panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits, a micro lens array including a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies, and an optical spacer formed between the LED array and the micro lens array.
Type:
Grant
Filed:
August 17, 2016
Date of Patent:
May 28, 2019
Assignee:
Hong Kong Beida Jade Bird Display Limited
Abstract: A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.
Type:
Grant
Filed:
January 27, 2016
Date of Patent:
January 8, 2019
Assignee:
Hong Kong Beida Jade Bird Display Limited
Abstract: Various embodiments include a display panel with integrated micro lens array. The display panel typically includes an array of pixel light sources (e.g., LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The array of micro lenses are aligned to the pixel light sources and positioned to reduce the divergence of light produced by the pixel light sources. The display panel may also include an integrated optical spacer to maintain the positioning between the micro lenses and pixel driver circuits.
Type:
Grant
Filed:
September 21, 2016
Date of Patent:
September 18, 2018
Assignee:
Hong Kong Beida Jade Bird Display Limited
Abstract: Various embodiments include a semiconductor device with thin-film transistor (TFT) circuitry monolithically integrated with other non-TFT functional devices. One example is an integrated LED display panel, in which an array of LEDs is integrated with corresponding TFT driver circuitry. The TFT driver circuitry typically is an array of pixel drivers that drive the LEDs.
Type:
Grant
Filed:
April 21, 2016
Date of Patent:
September 18, 2018
Assignee:
Hong Kong Beida Jade Bird Display Limited
Abstract: Embodiments include a manufacturing method of making a semiconductor device via multiple stages of alignment bonding and substrate removal. One example is an integrated full-color LED display panel, in which multiple wafers with different arrays of LEDs are integrated onto a host wafer with driver circuitry. The driver circuitry typically is an array of pixel drivers that drive individual LEDs on the display panel.
Type:
Grant
Filed:
September 19, 2016
Date of Patent:
September 4, 2018
Assignee:
Hong Kong Beida Jade Bird Display Limited
Abstract: A light-emitting diode (LED) projector includes an LED display panel and a projection lens arranged in front of LED display panel and configured to collect and project light emitted by the LED display panel. The LED display panel includes an LED panel and a micro lens array arranged over the LED panel. The LED panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits. The micro lens array includes a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies.
Type:
Grant
Filed:
August 24, 2016
Date of Patent:
July 24, 2018
Assignee:
Hong Kong Beida Jade Bird Display Limited
Abstract: Various embodiments include a display panel with integrated micro lens array. The display panel typically includes an array of pixel light sources (e.g., LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The array of micro lenses are aligned to the pixel light sources and positioned to reduce the divergence of light produced by the pixel light sources. The display panel may also include an integrated optical spacer to maintain the positioning between the micro lenses and pixel driver circuits.
Type:
Grant
Filed:
September 19, 2016
Date of Patent:
May 22, 2018
Assignee:
Hong Kong Beida Jade Bird Display Limited