Patents Assigned to Japan Aviation Electronics Industry
  • Patent number: 11764465
    Abstract: An antenna assembly comprises a circuit board formed with an antenna, a coaxial cable and a conductive film. The circuit board has an edge, a first pad and a second pad. An outer conductor of the coaxial cable has an exposed portion which is exposed from an outer cover of the coaxial cable over a predetermined area. The exposed portion is connected with the second pad. In a second direction perpendicular to a first direction, a center of the coaxial cable is positioned at a predetermined position. The conductive film is fixed on the circuit board. The conductive film has a main portion and at least one extending portion. In the predetermined area, the at least one extending portion and the second pad are aligned in the first direction. The at least one extending portion extends from the main portion over the predetermined position in the second direction.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: September 19, 2023
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Osamu Hashiguchi
  • Patent number: 11764502
    Abstract: A solderable component comprises a body portion configured to be mounted on a board and an auxiliary portion extending from the body portion. The body portion has at least two solderable portions. The at least two solderable portions include two predetermined solderable portions. The auxiliary portion has one abutment portion and a coupling portion. The abutment portion and lower ends of the two predetermined solderable portions define a board-attachment plane which is an imaginary plane. The coupling portion couples the abutment portion and the body portion to each other. A boundary between the coupling portion and the body portion is apart from the abutment portion in a plane in parallel to the board-attachment plane. The coupling portion is separable from the body portion at the boundary between the coupling portion and the body portion.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: September 19, 2023
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Osamu Hashiguchi
  • Patent number: 11754792
    Abstract: This connector (100) is provided with a locking member (200), a receiving part (192), an additional elastic part (420) and a pressing member (440). The locking member (200) comprises a supporting part (220) and a locking part (250). A mating-side connector (600) is provided with a mating-side locking part (660) and an abutting part (632). In the fitted state, the locking part (250) applies backwards force on the mating-side locking part (660) with the elasticity of the supporting part (220). The abutting part (632) is positioned in front of the receiving part (192), is pressed against the receiving part (192), and is restricted from moving backwards by the receiving part (192). When the pressing member (440) is in a first position, the additional elastic part (420) is interposed between the supporting part (220) and the pressing member (440), presses down the supporting part (220), and maintains pressing of the locking part (250) against the mating-side locking part (660).
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 12, 2023
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yuichi Koreeda, Hideto Shimazu, Masaki Ishiguro
  • Patent number: 11751340
    Abstract: A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 ?m.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: September 5, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi Sakaue
  • Patent number: 11749929
    Abstract: A connector comprises two holding members, two terminal rows, a midplate and a shell. Each of the holding members is lightly press-fit into the shell. Each of the terminal rows has a plurality of terminals. The terminals of each of the terminal rows include a specific terminal. The specific terminal has an exposed portion. The exposed portion is, at least in part, exposed from the holding member in an up-down direction perpendicular to a pitch direction. The midplate has a receiving portion. The exposed portion is brought into contact with the receiving portion. One of the holding member and the shell is formed with at least one light press-fit portion. A position of the at least one light press-fit portion overlaps with a position of the exposed portion in a front-rear direction perpendicular to both the up-down direction and the pitch direction.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: September 5, 2023
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Kimiaki Saitou, Hiroaki Kuribayashi
  • Patent number: 11742619
    Abstract: In this circuit board 30, first signal wiring portions 351 and second ground wiring portions 353 of a first wiring layer 34 are adjacent to each other in a pitch direction. Further, second signal wiring portions 381 and first ground wiring portions 383 of a second wiring layer 37 are adjacent to each other in the pitch direction. In the pitch direction, outer edges 405 of line portions 345 of two first signal wiring portions 351 are located more inward than both edges 435 of a line portion 375 of the first ground wiring portions 383. Outer edges 415 of line portions 375 of two second wiring portions 381 are located more inward than both edges 425 of the line portion 345 of the second ground wiring portion 353. This achieves good signal transmission characteristics without providing a ground layer separate from a signal layer.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: August 29, 2023
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Kentaro Toda
  • Publication number: 20230269885
    Abstract: A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 ?m.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 24, 2023
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi SAKAUE
  • Patent number: 11735842
    Abstract: An electrical component comprises a main body, a fulcrum portion and at least two terminals including a first terminal and a second terminal. Each of the terminals has a first portion and a second portion. The first portion of one of the first terminal and the second terminal is brought into contact with a circuit board when the main body is tilted relative to the circuit board with the fulcrum portion, which acts as a fulcrum, under an insertion state where the terminals are inserted into through-holes, respectively, while none of the terminals are soldered thereto. When the main body is tilted relative to the circuit board with the fulcrum portion, which acts as the fulcrum, under the insertion state, the second portion of one of the first terminal and the second terminal is brought into contact with the circuit board to regulate an excessive tilt of the main body.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: August 22, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu Hashiguchi
  • Publication number: 20230261401
    Abstract: A connector comprises an insert-molded body. The insert-molded body comprises a holding member and a plurality of terminals. The terminals include at least one first terminal and at least one second terminal. The first terminal has a first mounted portion and a first main portion. The first mounted portion has a first carrier cut-off surface which is an end surface of the first mounted portion. The end surface of the first mounted portion faces in a width direction. The second terminal has a second mounted portion, a second main portion and an unmounted portion. The unmounted portion has a second carrier cut-off surface which is an end surface of the unmounted portion. The end surface of the unmounted portion faces in the width direction. The first carrier cut-off surface and the second carrier cut-off surface face in orientations same as each other in the width direction.
    Type: Application
    Filed: December 30, 2022
    Publication date: August 17, 2023
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Tadamichi YAYOSHI, Yosuke HONDA
  • Publication number: 20230261402
    Abstract: A connector is mountable on a board and is mateable with a mating connector which comprises a mating terminal. The connector comprises a terminal held by a holding member. The terminal has a first support portion which is resiliently deformable, a primary contact point supported by the first support portion, a second support portion which extends from the primary contact point and is resiliently deformable, and a pressed portion supported by the second support portion. The pressed portion is movable in an upper-lower direction (Z-direction) and a width direction (Y-direction). When the connector is mated with the mating connector, the primary contact point is brought into contact with the mating terminal and is moved in the width direction. When the connector is under a mated state where the connector is mated with the mating connector, the pressed portion is pressed against the board in the upper-lower direction.
    Type: Application
    Filed: January 6, 2023
    Publication date: August 17, 2023
    Applicant: Japan Aviation Electronics Industry, Limited
    Inventor: Keisuke NAKAMURA
  • Publication number: 20230261418
    Abstract: A connector assembly is provided with a first connector and a second connector. In the first connector, a first contact point portion, a first indented portion, a first lock portion and a regulated portion of a first terminal are supported by a spring portion. A first holding member holding the first terminal has a regulating portion. The regulated portion is located downward of the regulating portion and faces the regulating portion. In the second connector, a second terminal held by a second holding member has an insertion end portion, a second contact point portion, a second indented portion and a second lock portion. In a mated state, the first lock portion and the second lock portion are located between the first indented portion and the second indented portion and face each other in the up-down direction.
    Type: Application
    Filed: January 17, 2023
    Publication date: August 17, 2023
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Osamu HASHIGUCHI
  • Publication number: 20230251093
    Abstract: A ring laser gyroscope includes an optical block for generating laser beams that counter-propagate in a closed-loop type optical path, a dither mechanism for applying dither vibration for mitigating a lock-in phenomenon to the optical block, and a dither controller for controlling the dither vibration. The dither controller imparts randomness to the frequency of the angular velocity of the dither vibration.
    Type: Application
    Filed: December 29, 2022
    Publication date: August 10, 2023
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Yusuke GOCHO, Naoki YAMAMOTO, Kazunori YOSHIOKA, Kenji ABE
  • Patent number: D995440
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: August 15, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Junji Oosaka, Yohei Yokoyama
  • Patent number: D995441
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: August 15, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Junji Oosaka, Yohei Yokoyama
  • Patent number: D995444
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: August 15, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Yuta Shimomaki
  • Patent number: D994608
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: August 8, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Tetsuya Komoto
  • Patent number: D994609
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: August 8, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Takashi Omodachi
  • Patent number: D997882
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: September 5, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Junji Oosaka, Yohei Yokoyama
  • Patent number: D998572
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: September 12, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Junji Oosaka, Yohei Yokoyama
  • Patent number: D999173
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: September 19, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Junji Oosaka, Yohei Yokoyama