Patents Assigned to Japan Solderless Terminal Mfg. Co., Ltd.
  • Patent number: 5829110
    Abstract: Improvement in connection to an automatic crimper (6) which operates in the known manner to divide leads (1) into groups (1a,1b,1c, etc.), before crimping one ends of the leads to branching connectors (2) and crimping the other ends of all the leads to a common connector (3) so as to form a multiple harness (4). Subsequently, the crimper drives the branching connectors to travel in parallel and in unison with the common connector along a pair of delivery rails (7) until discharged from the rails. The improvement resides in that the branching connectors (2) are caused to take a position close to the common connector (3) so that leads in each group are folded double, then the leads are gathered to form a compact bundle (1') before being tied with tapes (5) which serve as an easily breakable binding material.
    Type: Grant
    Filed: June 9, 1997
    Date of Patent: November 3, 1998
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventor: Masatoshi Kashihara
  • Patent number: 5810617
    Abstract: A jumper connector (15) for making an electric connection between contact pins or posts (14) that protrude from a printed circuit board (11) has a recipient core (16) made of a conductive elastomer. The jumper connector further has parallel bores (17) formed through the recipient core so as tightly fit on the two contact pins (15). An insulating mantle (18) is integrally secured to and covers the outer periphery of the recipient core. One or two finger tabs (19) extend in the longitudinal direction of the insulating mantle (18), and a guide (30) is formed in or on the bottom of the recipient core so that the contacts pins (14) are guided to take a correct position relative to the parallel bores (17) of the jumper connector, which enables a high density array of contact pins, is easily mountable on and dismountable from a printed circuit board and is of such a simple structure as reducing manufacture cost.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: September 22, 1998
    Assignee: Japan Solderless Terminal MFG Co., Ltd.
    Inventor: Miki Hasagawa
  • Patent number: 5641291
    Abstract: A printed circuit board connector has: an insulating housing (2); SMT type contacts (7, 11) disposed in the insulating housing and spaced apart from each other; and each contact having a lead (11) which extends to a junction surface (2a) of the housing so as to be soldered to a conductive pattern (16) formed on a printed circuit board (15). The lead (11) of each contact is a plating layer (10) formed on the junction surface (2a). The contacts (7) are pin contacts held in place by the insulating housing (2) so as to be electrically connected to the plating layer (10) formed as the leads. The contacts' leads are included in a common plane so that the reliability of electric connection and the durability of connector are improved, and the connector is rendered thinner and more compact to reduce an area required to mount it.
    Type: Grant
    Filed: December 9, 1994
    Date of Patent: June 24, 1997
    Assignees: Japan Solderless Terminal Mfg. Co., Ltd., Polyplastics Co., Ltd.
    Inventors: Kunimichi Sueki, Satoru Kihira, Yasuyuki Takeda