Patents Assigned to Japan Solderless Terminal Mfg. Co., Ltd.
  • Patent number: 6561829
    Abstract: A connector that absorbs alignment error to be connected to a pin-shaped conducting member of the counterpart. This connector includes a base housing to be arranged on a printed circuit board, a slide housing being slidably supported in relation to the base housing in a plane crossing the longitudinal direction of the conducting member of the counterpart, and at least one contact spanning both the housings and being fixed to both the housings and being to be soldered on the printed circuit board. Said slide housing having at least one inlet hole of which one end faces to and opens to the contact and the other end expands toward the end and opens to the conducting member of the counterpart. This connector can effectively absorb alignment error and prevent occurrence of connection failure and defective connection to increase the reliability and enhance the workability of assembly of printed circuit boards.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: May 13, 2003
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Tomoharu Maeda, Norihiro Ninomiya, Junichi Itoh
  • Patent number: 6408352
    Abstract: A card connection adaptor is provided which is used for connecting, to a connector of a card slot compliant with a first standard, a card compliant with a second standard. The adaptor includes: a first connector compliant with the first standard and adapted to be electrically connected to the connector of the card slot; a second connector compliant with the second standard; and signal conversion circuitry for performing signal conversion between a first-standard-compliant signal and a second-standard-compliant signal. A card retaining space for retaining the second-standard-compliant card inserted therein is formed in a housing which holds the first connector, the second connector and the signal conversion circuit. The card retaining space has a card insertion port which opens generally perpendicularly to an insertion direction in which the card connection adaptor is inserted into the card slot.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: June 18, 2002
    Assignee: Japan Solderless Terminal Mfg. Co., LTD
    Inventors: Taiji Hosaka, Kaori Yasufuku
  • Patent number: 6379199
    Abstract: A female terminal for a connector wherein a leaf spring is provided inside the terminal proper. The front half of the terminal proper is provided with a bottom wall, side walls rising from both ends, in the direction of width, of the bottom wall, an outer upper wall and an inner upper wall extending from the upper edges of side walls to the upper edges of the opposing side walls. A leaf spring is formed by separating said rear inner upper wall from said side walls, with the rear end of said rear inner upper wall being left intact. A bead with a curved section is formed on the leaf spring to increase the flexural rigidity. The female terminal can be compactified, and a sufficient contacting force can be provided reliably. The contacting part of the leaf spring can be shifted forward. The developed shape can be made smaller. The bending steps can be reduced.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: April 30, 2002
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventor: Ping Chen
  • Patent number: 6350145
    Abstract: An FPC crimp terminal comprising a bottom plate being formed from a flat plate and a fixing part rising from an edge of the bottom plate, said FPC crimp terminal being formed in such a way that when a core or a lead wire is brought into direct contact with a conductor of an FPC, the fixing part is made to pierce the FPC from its back or front and the top end of the fixing part coming out of the FPC is bent towards the bottom plate, the core or the lead wire and the FPC will be pinched between the top end of the fixing part and the bottom plate. As the fixing part is used to effect the piercing process and the connecting process at the same time, the FPC crimp terminal can be compactified and the work efficiency can be enhanced through reduction in the number of processes.
    Type: Grant
    Filed: January 5, 2000
    Date of Patent: February 26, 2002
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Ping Chen, Takashi Iida
  • Patent number: 6238248
    Abstract: A thin cartridge to which a connector of the present invention is applied has an insertion space therein which is open through an opening formed on an end face of a frame thereof. A printed circuit board having terminals patterned on an edge surface portion thereof is provided on one of surfaces defining the insertion space. The connector includes an engagement wall to be inserted into the frame as a single component for engagement with the frame of the cartridge. The engagement wall has first and second opposite faces exposed to the outside. Arrangement of contact members retained in retention grooves formed in the first face can be viewed from the side opposed to the first face.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: May 29, 2001
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Toshiaki Ogura, Yuzuru Ohta
  • Patent number: 6224391
    Abstract: A memory card adaptor card which adapts a memory card compliant with a first standard to a memory card slot compliant with a second standard different from the first standard for electrical connection therebetween. The adaptor card includes a grounding connection mechanism for electrically connecting a grounding contact of the memory card to a grounding circuit of the memory card slot. The grounding connection mechanism includes, for example, a contact spring piece which is to be brought into resilient contact with a contact portion of the memory card and a conductive cover of the adaptor card.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: May 1, 2001
    Assignees: Matsushita Electric Industrial Co., Ltd., Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Naoya Horie, Hiroshi Sakurai, Kiyoshi Washino, Yoshitaka Shobara
  • Patent number: 6207298
    Abstract: A tin-nickel alloy containing not less than 75 wt % and less than 100 wt % of tin with the balance of nickel. The alloy is used, for example, for formation of a surface treatment layer of an electronic component which is to be soldered onto a substrate with the use of the surface mount technology. The surface treatment layer preferably has a thickness of not less than 0.1 &mgr;m and less than 0.5 &mgr;m. The electronic component preferably further includes a nickel deposit layer as an underlying layer interposed between a base of the component and the surface treatment layer.
    Type: Grant
    Filed: December 16, 1998
    Date of Patent: March 27, 2001
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventor: Kunihiko Fukui
  • Patent number: 6176709
    Abstract: A socket for an integrated circuit which is used for attaching the integrated circuit to a socket mounted on a primary wiring board with an intermediate wiring board interposed therebetween, an adapter for an integrated circuit utilizing the integrated circuit socket, and an integrated circuit assembly utilizing the integrated circuit adapter. The integrated circuit socket includes: a housing to be directly fitted with the integrated circuit; a long insertion pin which is to be inserted through the intermediate wiring board and to be fitted in the socket of the primary wiring board; a short insertion pin which is to be inserted through the intermediate wiring board but not to reach the socket of the primary wiring board; and a surface-mount pin which is to be connected to a surface of the intermediate wiring board opposed to the housing; the long insertion pin, the short insertion pin and the surface-mount pin being implanted in the housing.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: January 23, 2001
    Assignees: Melco Inc, Japan Solderless Terminal Mfg. Co., LTD
    Inventors: Yoshiiku Sonobe, Makoto Oya, Satoru Watanabe, Osamu Nishida
  • Patent number: 6174208
    Abstract: A female terminal for a connector comprising a terminal body that is fixed by a retainer of a housing, a leaf spring that extends forward in the terminal body, and a stabilizer that is fixed by a lance of the housing. At the root end of the leaf spring, a round part that bends lengthwise into an approximately circular arc is formed. A bead having a curved section to increase flexural rigidity of the leaf spring is formed ahead of the round part on the top end side. A stabilizer having a face directed in the width direction is erected in the height direction from the top end of the terminal body.
    Type: Grant
    Filed: July 7, 1999
    Date of Patent: January 16, 2001
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventor: Ping Chen
  • Patent number: 6129558
    Abstract: A connector for a printed circuit board including a board-shaped housing with windows and connecting terminals arranged for the windows. An intermediate part of each connecting terminal is fixed to a housing part at an edge of the window, and a contacting part of the connecting terminal is arranged so that it can undergo elastic deformation in the window in the direction of thickness of the housing near the top of the housing. The external end of the connecting terminal is formed as a lead, and the connecting terminal is provided with a reinforcing lead that extends from the intermediate part toward the bottom of the housing in the window. If necessary, a reinforcing frame is embedded in the housing. A production method thereof is indicated by example, wherein connecting terminals and a frame being connected together are press-formed, and they are integrally molded with the housing, then the connecting terminals and the frame are disconnected from the rest.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: October 10, 2000
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Satoru Kihira, Masaaki Harasawa, Takayasu Onoda
  • Patent number: 6126485
    Abstract: A flanged connector (20) has an insulating housing (21), a plurality of contacts (22) separated one from another within the housing, a metal shell (23) covering the housing so as to shield the contacts, and at least one flange (28) bent at and outwardly extending from at least one of edges of a front opening (24) formed in the metal shell. A female-threaded bore (30) is formed in each flange (28), which continues from a folded-back portion (27). This portion is formed by bending outwards and further bending rearwards an extension from the at least one edge so that the flange is or the flanges are retracted from the edges a predetermined distance. A pair of the flanges (28) may extend along the opposite side edges of the opening (24), or alternatively the single flange (28) may extend along an upper one of those edges.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: October 3, 2000
    Assignee: Japan Solderless Terminal MFG, Co., Ltd.
    Inventors: Yoshitaka Shobara, Masato Kato
  • Patent number: 5951329
    Abstract: Improvement in connection to an automatic crimper (6) which operates in the known manner to divide leads (1) into groups (1a,1b,1c, etc.), before crimping one ends of the leads to branching connectors (2) and crimping the other ends of all the leads to a common connector (3) so as to form a multiple harness (4) subsequently, the crimper drives the branching connectors to travel in parallel and in unison with the common connector along a pair of delivery rails (7) until discharged from the rails. The improvement resides in that the branching connectors (2) are caused to take a position close to the common connector (3) so that leads in each group are folded double, then the leads are gathered to form a compact bundle (1') before being tied with tapes (5) which serve as an easily breakable binding material.
    Type: Grant
    Filed: September 24, 1996
    Date of Patent: September 14, 1999
    Assignee: Japan Solderless Terminal MFG Co., Ltd.
    Inventor: Masatoshi Kashihara
  • Patent number: D402273
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: December 8, 1998
    Assignees: Sony Corporation, Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Yasuhiro Kataoka, Terumi Nakashima, Narihiko Hashimoto
  • Patent number: D402274
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: December 8, 1998
    Assignees: Sony Corporation, Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Yasuhiro Kataoka, Terumi Nakashima, Narihiko Hashimoto
  • Patent number: D407383
    Type: Grant
    Filed: July 9, 1998
    Date of Patent: March 30, 1999
    Assignees: Sony Corporation, Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Yasuhiro Kataoka, Terumi Nakashima, Narihiko Hashimoto
  • Patent number: D432498
    Type: Grant
    Filed: July 22, 1999
    Date of Patent: October 24, 2000
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventor: Keiji Kuroda
  • Patent number: D432988
    Type: Grant
    Filed: July 22, 1999
    Date of Patent: October 31, 2000
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventor: Keiji Kuroda
  • Patent number: D434040
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: November 21, 2000
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Kaori Yasufuku, Taiji Hosaka
  • Patent number: D434042
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: November 21, 2000
    Assignee: Japan Solderless Terminal Mfg. Co., LTD
    Inventors: Kaori Yasufuku, Taiji Hosaka
  • Patent number: D434375
    Type: Grant
    Filed: August 25, 1999
    Date of Patent: November 28, 2000
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd
    Inventor: Hideo Kawamoto