Patents Assigned to Jentek Sensors, Inc.
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Patent number: 12253492Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: GrantFiled: September 1, 2023Date of Patent: March 18, 2025Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Publication number: 20250044257Abstract: A system and method are provided for inspecting challenging material locations such as holes. The system may include a sensor cartridge (“mandrel”) for hole inspection that has a helical portion to which a sensor array is attached. The radius of the helical portion can be increased or decreased by applying a torque to the helical portion thereby allowing the sensor to be inserted into a hole or pressed against the wall of the hole. A scanner is described to which mandrels can be quickly connected and changed enabling an inspector to quickly switch between different mandrels (e.g., for different holes sizes and sensor configurations). Also disclosed is an inspection procedure and data processing algorithm for performing an inspection. The data processing algorithm utilizes a signature library for enhancing the detection or sizing of features of interest such as cracks. The algorithm and library can account for material edges, various material types.Type: ApplicationFiled: August 13, 2024Publication date: February 6, 2025Applicant: JENTEK Sensors, Inc.Inventors: Todd Dunford, Neil Goldfine, Stuart Chaplan
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Publication number: 20240377360Abstract: Axially symmetric objects may require scanning for reasons such as quality inspection, remaining life prediction, and flaw detection. Scanning systems and methods are provided for test objects that may be substantially symmetric about an axis. The scanning system may have curved supports to provide mechanical support to the test object during scanning. The curved support may reduce bending of the test object during scanning and prevent permanent deformation that may otherwise occur during the scanning process. A sensor system may be mounted (at least in part) to a mounting rail such that a sensor may move axially along the rail during a scanning process. Measurement data may be collected and analyzed to assist in determining the disposition of the test object.Type: ApplicationFiled: May 10, 2024Publication date: November 14, 2024Applicant: JENTEK Sensors, Inc.Inventors: Todd M Dunford, Neil J. Goldfine, Jared Nelms, Matthew Helseth
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Patent number: 12061169Abstract: A system and method are provided for inspecting challenging material locations such as holes. The system may include a sensor cartridge (“mandrel”) for hole inspection that has a helical portion to which a sensor array is attached. The radius of the helical portion can be increased or decreased by applying a torque to the helical portion thereby allowing the sensor to be inserted into a hole or pressed against the wall of the hole. A scanner is described to which mandrels can be quickly connected and changed enabling an inspector to quickly switch between different mandrels (e.g., for different holes sizes and sensor configurations). Also disclosed is an inspection procedure and data processing algorithm for performing an inspection. The data processing algorithm utilizes a signature library for enhancing the detection or sizing of features of interest such as cracks. The algorithm and library can account for material edges, various material types.Type: GrantFiled: April 27, 2022Date of Patent: August 13, 2024Assignee: JENTEK Sensors, Inc.Inventors: Todd Dunford, Neil Goldfine, Stuart Chaplan
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Publication number: 20240255323Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: December 11, 2023Publication date: August 1, 2024Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Patent number: 11959880Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: GrantFiled: August 16, 2021Date of Patent: April 16, 2024Assignee: JENTEK Sensors, Inc.Inventors: Scott A Denenberg, Yanko K Sheiretov, Neil J Goldfine, Todd M Dunford, Andrew P Washabaugh, Don Straney, Brian L Manning
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Publication number: 20230408449Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: ApplicationFiled: September 1, 2023Publication date: December 21, 2023Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Patent number: 11841245Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: GrantFiled: January 6, 2023Date of Patent: December 12, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Patent number: 11802851Abstract: Disclosed are method and apparatus for measuring material properties. Segmented field sensors have multiple sensing elements at different spatial geometries to capture field components having substantially different depths of penetration. These sensors are excited and measured on these different sensing elements to facilitate characterization of unknown material properties. This is illustrated in some embodiments using eddy current sensors to characterize materials that are frequency dispersive and/or do not produce a measurable phase shifts. Only a single scalar quantity may provide independent information from one or more of the sensing elements. Property estimation techniques, such as those using precomputed databases of sensor responses are used to estimate the unknown material properties.Type: GrantFiled: March 1, 2022Date of Patent: October 31, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Andrew P. Washabaugh, Todd M. Dunford, Zachary M. Thomas
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Patent number: 11747304Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: GrantFiled: January 2, 2023Date of Patent: September 5, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Publication number: 20230160728Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: January 6, 2023Publication date: May 25, 2023Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Publication number: 20230152278Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: ApplicationFiled: January 2, 2023Publication date: May 18, 2023Applicant: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Todd M. Dunford
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Publication number: 20230095662Abstract: Disclosed are method and apparatus for measuring material properties. Segmented field sensors have multiple sensing elements at different spatial geometries to capture field components having substantially different depths of penetration. These sensors are excited and measured on these different sensing elements to facilitate characterization of unknown material properties. This is illustrated in some embodiments using eddy current sensors to characterize materials that are frequency dispersive and/or do not produce a measurable phase shifts. Only a single scalar quantity may provide independent information from one or more of the sensing elements. Property estimation techniques, such as those using precomputed databases of sensor responses are used to estimate the unknown material properties.Type: ApplicationFiled: March 1, 2022Publication date: March 30, 2023Applicant: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Andrew P. Washabaugh, Todd M. Dunford, Zachary M. Thomas
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Patent number: 11549831Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: GrantFiled: September 16, 2019Date of Patent: January 10, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Patent number: 11543388Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: GrantFiled: March 1, 2022Date of Patent: January 3, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Publication number: 20220412918Abstract: Eddy current sensing is governed by the diffusion equation of magnetoquasistatic fields. As such the eddy current sensor's proximity to the object to be inspected (i.e., “liftoff”) significantly affects the sensor's response signal. Methods and apparatus are disclosed for improving performance for an eddy current sensor, though they may also be used for other sensor types. These solutions are beneficial for both single channel eddy current sensors and arrays, and are particularly beneficial for measuring parts with complex surfaces. In some aspects improved performance is achieved by varying the stiffness of the mechanical support for the sensor. Some mechanical supports may exhibit anisotropic stiffness. After performing a scan with an eddy current array, a multi-channel shape filtering module is applied to improve defect detection. The module reduces the variability of defect response measured due to the unpredictability of the defect location transverse to the scan direction.Type: ApplicationFiled: September 5, 2022Publication date: December 29, 2022Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Mark Windoloski, Todd M Dunford
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Publication number: 20220373367Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: September 16, 2019Publication date: November 24, 2022Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Publication number: 20220358630Abstract: A system and method are disclosed for enhancing pit detection and sizing in a test object. Response signatures are created and stored in a signature library to characterize various sensor responses (liftoff, orientation) and pit properties (e.g., depth, width), possibly with or without additional considerations (e.g., edges, cracks). A sensor is placed on and scanned across a surface of interest on the test object. During scanning the sensor is measured repeatedly at regular intervals. An encoder may be used to record the sensor position for each measurement. The measurement results are then correlated with one or more signatures in the signature library. A threshold is used to determine if the correlation is indicative of the detection of a pit. If so additional processing may be performed to estimate pit properties.Type: ApplicationFiled: May 9, 2022Publication date: November 10, 2022Applicant: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Andrew P. Washabaugh, Mark Windoloski
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Publication number: 20220341875Abstract: A system and method are provided for performing a hole inspection performance study. Specimens for the performance study are made from a reconfigurable set of inspection plates. Each plate includes multiple test holes which are located symmetrically. The plates may be of various thicknesses and materials. Each test hole may or may not have a feature such as a crack or machining notch. Such features may be located at various positions of the hole, such as at an edge, within the bore, and at various circumferential positions. A specimen is formed by stacking two or more plates and securing the stack together with an alignment tool. A variety of specimens may be formed by using different combinations of inspection plates and flipping and rotating the member plates. A hole inspection system is disclosed as well as an inspection procedure and data processing algorithm for inspecting each hole.Type: ApplicationFiled: April 27, 2022Publication date: October 27, 2022Applicant: JENTEK Sensors, Inc.Inventors: Stuart Chaplan, Neil Goldfine, Zachary M. Thomas
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Publication number: 20220341876Abstract: A system and method are provided for inspecting challenging material locations such as holes. The system may include a sensor cartridge (“mandrel”) for hole inspection that has a helical portion to which a sensor array is attached. The radius of the helical portion can be increased or decreased by applying a torque to the helical portion thereby allowing the sensor to be inserted into a hole or pressed against the wall of the hole. A scanner is described to which mandrels can be quickly connected and changed enabling an inspector to quickly switch between different mandrels (e.g., for different holes sizes and sensor configurations). Also disclosed is an inspection procedure and data processing algorithm for performing an inspection. The data processing algorithm utilizes a signature library for enhancing the detection or sizing of features of interest such as cracks. The algorithm and library can account for material edges, various material types.Type: ApplicationFiled: April 27, 2022Publication date: October 27, 2022Applicant: JENTEK Sensors, Inc.Inventors: Todd Dunford, Neil Goldfine, Stuart Chaplan