Abstract: An interconnect assembly includes a number of interconnects combined in a preferably planar dielectric carrier frame having resilient portions acting as spring members in conjunction with their respective interconnect's rotational displacement during operational contacting. Each interconnect is fabricated as a see-saw structure pivoting around a rotation axis that substantially coincides with a symmetry plane of the torsion features provided by the resilient portion. The torsion features protrude towards and adhere to a central portion of the see-saw interconnect such that an angular movement of the interconnect is resiliently opposed by the torsion feature and the resilient portion. The torsion features and interconnects may be independently optimized to provide the interconnect with maximum stiffness and a maximum deflection at same time.
Type:
Grant
Filed:
January 16, 2004
Date of Patent:
June 13, 2006
Assignee:
K & S Interconnect, Inc.
Inventors:
January Kister, James Jaquette, Gene Tokraks
Abstract: A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.
Type:
Application
Filed:
August 3, 2005
Publication date:
February 9, 2006
Applicant:
K&S Interconnect, Inc.
Inventors:
Bahadir Tunaboylu, Edward Malantonio, David Beatson, Andrew Hmiel
Abstract: A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.
Type:
Application
Filed:
July 26, 2005
Publication date:
February 2, 2006
Applicant:
K&S Interconnect, Inc.
Inventors:
Edward Malantonio, Edward Laurent, Ilan Hanoon
Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal.
Type:
Grant
Filed:
May 1, 2003
Date of Patent:
November 15, 2005
Assignee:
K&S Interconnect, Inc.
Inventors:
January Kister, David Beatson, Edward Laurent