Abstract: A lampshade includes a top lampshade frame, a bottom lampshade frame, a lampshade covering covering the top lampshade frame and the bottom lampshade frame, hook materials (or loop materials) provided at the top lampshade frame and the bottom lampshade frame, and loop materials (or hook materials) provided at the lampshade covering and detachably fastened to the hook materials (or loop materials) to secure the lampshade covering to the top lampshade frame and the bottom lampshade frame.

Abstract: In a charged particle detecting apparatus 100 for which an MCP is sandwiched with an IN electrode 1 and an OUT electrode and an anode electrode and a rear cover are installed therebehind, the component members in the rear of the IN electrode 1 are arranged further inside than the IN electrode 1 when viewed from an MCP incident surface, and the charged particle detecting apparatus 100 is fixed by screwing and the like to a cabinet wall surface 330 of a TOF-MS by using a flange portion provided at a part of IN electrode 1 projected further outside than the rear component members.

Abstract: An electrostatically actuatable micro electromechanical device is provided with enhanced reliability and lifetime. The electrostatically actuatable micro electromechanical device comprises: a substrate, a first conductor fixed to the top layer of the substrate, forming a fixed electrode, a second conductor fixed to the top layer of the substrate, and a substrate area. The second conductor is electrically isolated from the first conductor and comprises a moveable portion, suspended at a predetermined distance above the first conductor, the moveable portion forming a moveable electrode which approaches the fixed electrode upon applying an actuation voltage between the first and second conductors. The selected substrate surface area is defined as the orthogonal projection of the moveable portion on the substrate between the first and second conductors. In the substrate surface area at least one recess is provided in at least the top layer of the substrate.

Abstract: A magnetic head includes a main pole, a write shield, and a gap part. The write shield includes first and second side shields and a top shield. The main pole has first and second side parts. The first side shield has a first sidewall. The second side shield has a second sidewall. The gap part includes a gap film and a nonmagnetic layer. The gap film is disposed to be in contact with the first and second sidewalls. The first side part has first and third side surfaces arranged in this order from the medium facing surface side. The second side part has second and fourth side surfaces arranged in this order from the medium facing surface side. The nonmagnetic layer is present between the third side surface and the first sidewall and between the fourth side surface and the second sidewall.

Abstract: In a terahertz antenna module 1, a photoconductive antenna element 17 is fixed to a wiring board 9, and electrically connected to an electric signal input/output pin 24 of an electric signal input/output port 23 via a signal electrode of the wiring board 9. Further, a buffer member 7, a hemispherical lens 8, a photoconductive antenna element 17, and the wiring board 9 are disposed in a recess 3 of a container 2 in this order from an opening 6 side of the container 2, and by attaching a cover 25 to the container 2, the wiring board 9, the photoconductive antenna element 17, and the hemispherical lens 8 are pressed against the buffer member 7. Further, the wiring board 9 is positioned by the recess 4 and the hemispherical lens 8 is positioned by the buffer member 7 so that the optical axis OA of the hemispherical lens 8 passes just through a photoconductive antenna part of the photoconductive antenna element 17.

Abstract: A process for extracting a substance or a substance group from a mixture utilizes a solvent for separation. The mixture is treated with the solvent in the presence of a sorbent as the stationary phase, wherein the solvent is conducted past the sorbent in a co-current flow with the mixture or in a counter-current flow against the mixture, or wherein the solvent is conducted past the non-moving mixture and the sorbent. The solvent and the sorbent are selected such that the holding effect of the sorbent supports the separation by the solvent during the separation procedure and/or subsequently supplements the separation by interacting with the solvent as the mobile phase.

Abstract: The present invention relates to a solid-state imaging device, etc., which makes it possible to obtain an image with higher resolution by properly correcting pixel data even when any one of row selecting wirings is disconnected. A solid-state imaging device (1) comprises a photodetecting section (10), a signal reading-out section (20), a controlling section (30), and a correction processing section (40). In the photodetecting section (10), M×N pixel portions P1,1 to PM,N are two-dimensionally arrayed in a matrix of M rows and N columns, and each of the pixel portions P1,1 to PM,N includes a photodiode and a reading-out switch. Charges generated in each pixel portion Pm,n are inputted into an integrating circuit Sn through a reading-out wiring LO,n, and a voltage value corresponding to the amount of charges is outputted from the integrating circuit Sn. The voltage value from the integrating circuit Sn is outputted to an output wiring Lout through a holding circuit Hn.

Abstract: A rail set assembly includes following elements. A retainer is capable of being fixed to a frame by a bending portion thereof and thus to provide a supporting force to the rail. The retainer further has a positioning locking hole. An engaging unit has a plurality of through holes and bending sides on each of a long upper side and a long lower side. The engaging unit can further retain the retainer in a certain position. A sliding track has a front fixing unit, a rear post, a long slot at a central part thereof. The sliding track further has a bending portion on each of an upper and a lower side of the track, and the sliding track is parallel and slidable along the engaging unit. An embedding unit has a guide block and a positioning block.

Abstract: A slider for a head gimbal assembly includes a trailing surface, a plurality of connection pads arranged on the trailing surface adapted for both bonding the slider to a suspension of the head gimbal assembly and testing the performance of the slider. At least a part of the connection pads each comprises a bonding portion and a testing portion electrically connected to the bonding portion and larger than the bonding portion, all the bonding portions and the rest part of the connection pads are arranged in a first row and the testing portions are arranged outside the first row. The slider of the present invention has a new pad layout to facilitate bonding of the connection pads and permit to provide additional pads thereon to connect the additional sensors therein for precise reading and writing, thereby improving the performance of the slider. The invention also discloses a head gimbal assembly and a disk drive unit including the same.

Abstract: An epitaxial SiC single crystal substrate including a SiC single crystal wafer whose main surface is a c-plane or a surface that inclines a c-plane with an angle of inclination that is more than 0 degree but less than 10 degrees, and SiC epitaxial film that is formed on the main surface of the SiC single crystal wafer, wherein the dislocation array density of threading edge dislocation arrays that are formed in the SiC epitaxial film is 10 arrays/cm2 or less.

Abstract: The production process for 1,2,3,4-tetrachlorohexafluorobutane of the present invention is characterized in that 1,2,3,4-tetrachlorobutane is reacted with fluorine in the presence of a solvent containing hydrogen fluoride. The 1,2,3,4-tetrachlorobutane may be obtained by chlorination of 3,4-dichlorobutene-1. Further, the present invention provides as well a process of refining 1,2,3,4-tetrachlorohexafluorobutane obtained in the manner described above. According to the present invention, 1,2,3,4-tetrachlorohexafluorobutane which is useful, for example, as a synthetic raw material for hexafluoro-1,3-butadiene used as an etching gas for semiconductors can industrially efficiently be produced by using 1,2,3,4-tetrachlorobutane which is a by-product of chloroprene and which has so far been disposed.

Abstract: A method of forming side spacers upwardly extending from a substrate, includes: providing a template constituted by a photoresist formed on and in contact with an etch-selective layer laminated on a substrate; anisotropically etching the template in a thickness direction with an oxygen-containing plasma to remove a footing of the photoresist and an exposed portion of the underlying layer; depositing a spacer film on the template by atomic layer deposition (ALD); and forming side spacers using the spacer film by etching. The etch-selective layer has a substantially lower etch rate than that of the photoresist.

Abstract: A projection lens system has first, second and third lens groups. The first lens group with combined focal length f1 has, in order from a screen side, a first negative meniscus lens, a second negative meniscus lens with focal length f12, refractive index n12 and screen side surface radius of curvature R12a, and a negative biconcave lens with focal length f13. A second lens group consists of a positive biconvex lens with a radius of curvature R21b of a surface on a light modulator side of the positive biconvex lens. The system satisfies the following conditions: 1.0<|f12/f1|<4.0; 5.0<|f13/f1|<9.0; 1.75<n12<2.0; and 0.1<|R21b/R12a|<0.8.

Abstract: In producing a semiconductor light-emitting chip whose substrate is composed of a sapphire single crystal, cracking in semiconductor light-emitting elements in the obtained semiconductor light-emitting chip is suppressed.

Abstract: A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The write shield layer has an opposing shield part opposing the main magnetic pole layer and a front shield part. The front shield part is connected to the opposing shield part without straddling the thin-film coil. Besides, the front shield part has a shield front end face disposed in the medium-opposing surface and a shield upper end face formed distanced from the medium-opposing surface. Further, the front shield part has a shield connecting part. The shield front end face is connected to the shield upper end face by the shield connecting part.

Abstract: An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999 mass % or higher, 2-5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.

Abstract: A glass layer 3 is irradiated with laser light L2 for temporary firing in order to gasify a binder and melt the glass layer 3, thereby fixing the glass layer 3 to a glass member 4. Here, an irradiation region of the laser light L2 has regions A1, A2 arranged along an extending direction of a region to be fused R and is moved along the region to be fused R such that the region A1 precedes the region A2. The region A2 irradiates the glass layer 3 before the glass layer 3 molten by irradiation with the region A1 solidifies. This makes the glass layer 3 take a longer time to solidify, whereby the binder gasified by irradiation with the region A1 of the laser light L2 is more likely to escape from the glass layer 3.

Abstract: There is provided an infusion pump system for delivering a predetermined medical solution at a preset reference infusion speed. The system comprises a medical solution container; an infusion line through which the medical solution is drawn out of the medical solution container; an infusion pump configured to discharge the medical solution via the infusion line. The infusion pump is controlled so that the discharge speed of the infusion pump is computed on the basis of a current discharge speed of the infusion pump and the infusion speed of the medical solution, the resulting discharge speed is corrected by a predefined correction coefficient, and the medical solution is discharged at the corrected discharge speed.

Abstract: A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the back metal layer (16, 31). A region in the back metal layer (16, 31) that is directly below a semiconductor device (12) is defined as a directly-below region (A1), and a region outside the directly-below region (A1) that corresponds to and has the same dimensions as the directly-below region (A1) is defined as a comparison region (A21). The volume of the stress relaxation spaces (17) in the range of the directly-below region (A1) is less than the volume of the stress relaxation spaces (17) formed in the range of the comparison region (A21).