Abstract: A retractable memory drive in accordance with the present invention comprises a top casing, a middle carrier, an electronic device such as a USB thumb drive, and a bottom casing. A positioning device on the middle carrier has a portion that protrudes outside the casing and operates like a button. The location of the positioning device where the button is located has two key attributes. First, there is a protrusion that acts as a lock with the casing. Second, the area below the button is not rigid and so it gives way when pressure is applied to the button. The top and bottom casings provide a casing structure which includes two detents. One detent is for locking the device with the connector in the extended position, and one detent for locking the device with the connector retracted in the in position. This allows for just one press of the extended portion of the positioning device to unlock it from its present position. When the device reaches its new position it will automatically lock.

Abstract: A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.

Abstract: A memory card comprising a substrate, a memory die on top of the memory die, a controller die on top of the memory die; and a interposer surrounding the controller die and on top of the memory die wherein the interposer allows for wire bonding to the substrate to be minimized. A system and method in accordance with the present invention achieves the following objectives: (1) increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies when stacking is necessary, to increase density of the Flash card; (3) has only a few necessary signal I/O bonding wires to the substrate to improve production yield.

Abstract: A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash IC and a (e.g., land grad array) controller package for enclosing a controller IC are mounted on a printed wiring board within a mold cavity. A high melt flow index resin is injected into the mold cavity to form an integral, solid body within which to completely encapsulate the flash IC and controller packages and form a cover over top the flash IC package so as to maintain the required memory card height tolerance. In one embodiment, the resin material is injected downwardly into the mold cavity from locations above the respective rows of leads of the flash IC package.

Abstract: A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate. First and second digital memory devices (e.g., TSOP packages or bare semiconductor dies) are located within the cavity so as to be recessed relative to the top and bottom of the substrate. The recessed first and second memory devices are arranged in spaced, face-to-face alignment with one another within the cavity. The first and second memory devices are covered and protected by respective first and second memory packages that are located on the top and bottom of the substrate. By virtue of the foregoing, the memory package density of the assembly can be increased without increasing the height or area consumed by the assembly for receipt within an existing external housing.

Abstract: A computer drive carrier to be removably received within a receiving frame so that a computer drive transported by the carrier can be interfaced with a host computer. A handle is pivotally connected to the computer drive carrier and adapted to be rotated between a closed position when the carrier is received within the receiving frame and an open position when it is desirable to remove the carrier and its drive from the receiving frame to be replaced by a different carrier. A key controlled lock is mounted on the receiving frame and includes a locking pawl that is rotatable from an unlocked position, at which to permit the handle to be rotated from the closed position to the open position so that the computer drive carrier can be removed from its receiving frame, to a locked position, at which to prevent the handle from being rotated to the open position so that the computer drive carrier is locked in place in the receiving frame.

Abstract: A high density, low profile, three dimensional memory module having multi-level semiconductor packages mounted on one or opposite sides of a printed wiring board. Each multi-level package of the memory module contains an upper level DRAM integrated circuit package that is surface mounted on the printed wiring board and at least one lower level DRAM integrated circuit package that is surface mounted on the printed wiring board below the upper level package, such that the upper and lower level packages are stacked one above the other. The upper level package is preferably a thin small outline package, and the lower level package is preferably a leadless chip scale package. The leads of the upper level package are of sufficient length so that the standoff height of the upper level package establishes a clearance thereunder in which to receive the lower level package.

Abstract: A vertically integrated chip scale package (CSP) assembly comprising two or more single chip package subassemblies having an upper level CSP subassembly superimposed directly above a lower level CSP subassembly. The lower-most CSP subassembly in the vertical stack contains an array of solder balls for interconnection to a printed wiring board. The vertical electrical connection between the upper and lower level package subassemblies is accomplished by using wire bonding from perimeter wire bonding pads located on an upper level substrate extension to matching perimeter wire bonding pads located on a lower level substrate extension that is longer in length than the upper level substrate extension. The stacked package subassemblies are bonded together by using a thin adhesive material, and the perimeter wire bonds are encapsulated by an encapsulant for protection.

Abstract: An improvement in a Rambus memory system of the type used in personal computers. On a module level, each RIMM (Rambus Interface Memory Module) includes a positive and a negative module time delay element on the CTM (clock to master) clock line. On a system level, where a motherboard has a plurality of RIMMs coupled to a chipset (i.e. memory controller), a positive or negative system time delay element is placed on the CFM (clock from master line). By virtue of the module and system time delay elements, the clock timing can be adjusted from the data timing, whereby the overall TQ (timing skew between clock and data) can be advantageously reduced to allow more RIMMs to be placed on the same motherboard. What is more, the module and system delays also improve timing margins on the standard Rambus channel so as to increase the robustness of a conventional Rambus system.

Abstract: A mounting bracket is disclosed, a pair of which are affixed at opposite sides of a conventional computer memory device (e.g. a hard disk drive system). The mounting brackets detachably connect the memory device to a removable computer circuit card by way of slots formed through the card. The brackets have legs which are received through the slots to engage the circuit card and thereby prevent the detachment of the memory device. Blocking arms of the mounting brackets are received through respective slots to prevent the disengagement of the legs of the brackets from the circuit card. A blocking arm and a leg are engaged in a single slot. The blocking arms may be rotated out of the slots to then permit the disengagement of the bracket legs from the circuit card so that the memory device may be disconnected from the card.