Patents Assigned to Kitagawa Industries Co., Ltd.
  • Patent number: 10287472
    Abstract: A thermally conductive material according to the present invention is prepared by allowing silicon carbide having an average particle size of 10 ?m or more and less than 50 ?m, aluminum hydroxide having an average particle size of 1 ?m or more and less than 10 ?m, and magnesium hydroxide having an average particle size of 0.5 ?m or more and less than 1 ?m to be contained in a polymer obtained by polymerizing a monomer containing acrylic acid ester.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: May 14, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Yasuhiro Kawaguchi, Takashi Mizuno
  • Publication number: 20190127550
    Abstract: A thermally conductive sheet including: an acrylic polymer; a high-soda alumina in an amount of 70 to 75% by volume; and a magnesium hydroxide having a particle size smaller than a particle size of the high-soda alumina in an amount of 2.7 to 5.3% by volume, the magnesium hydroxide is coated with a higher fatty acid. The thermally conductive sheet has a compressive force required in a deformation with a compressibility of 20% or less of 200 N or less, and has a thermal resistance of 0.45°C./W or less.
    Type: Application
    Filed: March 29, 2017
    Publication date: May 2, 2019
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Takashi MIZUNO, Yasuhiro KAWAGUCHI
  • Publication number: 20190127621
    Abstract: Provided is a thermally conductive elastomer composition excellent in thermal conductivity, insulation property, low hardness property, moldability, and the like. [Solving Means] The thermally conductive elastomer composition of the present invention including: a styrene-based elastomer in an amount of 100 parts by mass; a process oil in an amount of 800 to 1,000 parts by mass including a petroleum-based hydrocarbon; an aluminum hydroxide powder in an amount of 240 to 290 parts by mass; and an artificial graphite powder in a platelike form with an average particle size of 8 ?m to 30 ?m, or a natural graphite powder in a flake form or a vein form with an average particle size of 8 ?m to 30 ?m, in an amount of 270 to 400 parts by mass.
    Type: Application
    Filed: November 2, 2017
    Publication date: May 2, 2019
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Tatsuya UCHIDA
  • Patent number: 10251296
    Abstract: A clip is provided with a base portion, at least one holding portion, and a guiding portion. The holding portion includes spring pieces including a first and second spring pieces connected to the base portion and facing each other, and sandwiches an insert inserted between these spring pieces. The guiding portion includes a contact surface that guides the insert toward a position between the first and second spring pieces when the insert moves in an insertion direction and the guide portion comes into contact with the insert. The contact surface is at least partially in a position farther away from the base portion than the second portion of at least one of the first or second spring pieces. The contact surface is at least partially, in relation to a facing direction, in a position farther away from the corresponding spring piece than the second portion of the one spring piece.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: April 2, 2019
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Tatsuya Nakamura
  • Patent number: 10205429
    Abstract: An object is to provide an output-noise reduction device that can prevent noise from an electronic device accommodated in a metal casing from being transmitted due to electromagnetic coupling. An output voltage is extracted to the outside through a conducting bar. A magnetic body core includes a through hole through which the conducting bar is inserted. A chip capacitor is mounted on a mounting board and connects between the output terminal VO and ground potential. A section from the output terminal VO to at least part of the chip capacitor mounted on the mounting board is isolated from the electromagnetic coupling from the electronic device. Thus, noise is prevented from being transmitted to the output terminal VO.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: February 12, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Tomokazu Tanimizu, Kazushige Ueno, Katsuyuki Morita, Yoshinori Ohashi
  • Patent number: 10200005
    Abstract: An object is to provide an output-noise reduction device in which a component encapsulated through insert molding can be appropriately protected. In a noise filter module (output-noise reduction device), a conducting bar and a magnetic body core are protected with a molded member formed through insert molding. The molded member is formed of a resin material with a molding shrinkage rate of 0.5% or less. Thus, the amount of shrinkage after the molded member is molded and stress as a result of the shrinkage can be made small, whereby damage on the magnetic body core, deformation of a lead frame, and the like can be prevented from occurring.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: February 5, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Tomokazu Tanimizu, Kazushige Ueno, Katsuyuki Morita
  • Publication number: 20190014676
    Abstract: A clip is provided with a base portion, at least one holding portion, and a guiding portion. The holding portion includes spring pieces including a first and second spring pieces connected to the base portion and facing each other, and sandwiches an insert inserted between these spring pieces. The guiding portion includes a contact surface that guides the insert toward a position between the first and second spring pieces when the insert moves in an insertion direction and the guide portion comes into contact with the insert. The contact surface is at least partially in a position farther away from the base portion than the second portion of at least one of the first or second spring pieces. The contact surface is at least partially, in relation to a facing direction, in a position farther away from the corresponding spring piece than the second portion of the one spring piece.
    Type: Application
    Filed: December 22, 2016
    Publication date: January 10, 2019
    Applicant: Kitagawa Industries Co., Ltd.
    Inventor: Tatsuya NAKAMURA
  • Publication number: 20190003787
    Abstract: Provided is a thermally conductive liquid pack including a liquid thermal conductive material and a hollow pliable outer package filled with the liquid thermal conductive material, the pliable outer package having a first contact surface and a second contact surface different from the first contact surface and being in a closed state, the pliable outer package including a first sheet including the first contact surface, a second sheet including the second contact surface and disposed opposite to the first sheet, the first sheet and the second sheet including a plurality of fine discharge holes capable of discharging the thermal conductive material, a release sheet configured to seal the discharged holes from the outside being releasably layered on the first sheet and the second sheet, and the second sheet including a third sheet formed from a non-woven fabric or mesh in the inside thereof.
    Type: Application
    Filed: June 27, 2018
    Publication date: January 3, 2019
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Ken TANAKA, Hideo YUMI
  • Patent number: 10165714
    Abstract: A noise current absorber including a pair of housing parts capable of housing each of the pair of magnetic bodies, wherein the pair of magnetic bodies forms an overall cylindrical shape or a ring shape when abutted against each other; an engaging portion and an engaged portion capable of maintaining a closed state of the pair of housing parts; and a wall molded integrally with at least a first housing part of the pair of housing parts, adjacent to an abutting surface of at least the first housing part against a second housing part of the pair of housing parts, the wall protruding to a side where the second housing part abuts.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: December 25, 2018
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Hideharu Kawai
  • Publication number: 20180345626
    Abstract: PROBLEM: To provide a cushioning material excelling in impact absorption with respect to a movable member and a receiving member. SOLUTION: The present invention provides a composite cushioning material installed on a receiving member to receive a movable member, the composite cushioning material including a high damping elastomer having a JIS-A hardness of 20 or greater and a loss factor of 2.0 or greater, and a low hardness elastomer disposed between the high damping elastomer and the receiving member and having an ASKER-FP hardness of 80 or less; and a ratio of thicknesses between the high damping elastomer and the low hardness elastomer being in a range from 4:1 to 1:4.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 6, 2018
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Shinya WASHINO
  • Patent number: 10132575
    Abstract: The heat conduction member comprises a laminate formed by laminating a resin layer and a metal layer. The resin layer is formed from a thermally conductive resin material. The thickness of the laminate is smaller at the peripheral edge of the laminate than in the center portion of the laminate, and the thickness of the laminate is greater in the intermediate portion of the laminate than in the center portion of the laminate. An inclined surface is formed on the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: November 20, 2018
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Takashi Mizuno, Hideo Yumi
  • Patent number: 10118367
    Abstract: A thermal conducting sheet having a high adhesion between layers even if the thermal conducting sheet has a multilayer structure is provided. The thermal conducting sheet including a low-hardness layer and a reinforcing layer laminated on one side or both sides of the low-hardness layer. The reinforcing layer having a hardness greater than a hardness of the low-hardness layer. The low-hardness layer comprises: acrylic polymer, silicon carbide, aluminum hydroxide, magnesium hydroxide, and plasticizer.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: November 6, 2018
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Rika Oya
  • Patent number: 10034364
    Abstract: An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: July 24, 2018
    Assignees: Kitagawa Industries Co., Ltd., TYK Corporation
    Inventors: Yasuhiro Kawaguchi, Masataka Kubo
  • Publication number: 20180193799
    Abstract: A method of forming a reverse osmosis membrane 1 of the present invention includes a coating membrane forming step of forming a coating membrane which is soluble in a predetermined solvent on a surface of a porous support substrate 2 that is insoluble in the solvent, a carbon membrane forming step of forming a carbon membrane 3 on the coating membrane by a physical vapor deposition which deposits carbon as a target material under an atmosphere where rare gas and nitrogen gas are contained, and a removing-by-dissolving step of removing the coating membrane by dissolving the same in the solvent after formation of the carbon membrane 3.
    Type: Application
    Filed: July 28, 2016
    Publication date: July 12, 2018
    Applicants: KITAGAWA INDUSTRIES CO., LTD., SHINSHU UNIVERSITY
    Inventors: Hiroki KITANO, Akio YAMAGUCHI, Morinobu ENDO, Josue ORTIZ MEDINA
  • Patent number: 10014610
    Abstract: A contact in one aspect of the present disclosure comprises a fixing portion, an elastic contact piece, and a pair of projecting tabs, which are formed as an integrated entity from a metal thin plate. The projecting tabs project from the fixing portion at positions on both sides of the elastic contact piece. A dimension of the elastic contact piece in a width direction, which matches the direction of an interval between the projecting tabs, is a first dimension. The projecting tabs are formed such that each projecting tab is a flat plate having the same thickness as the thin plate. The projecting tabs are arranged such that the thickness directions thereof are the same direction, in locations that have inner surfaces of the projecting tabs facing each other, and an interval between the inner surfaces is a second dimension greater than the first dimension.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: July 3, 2018
    Assignee: KITAGAWA INDUSTRIES, CO., LTD.
    Inventors: Tomohisa Kurita, Hideo Yumi
  • Patent number: 9991610
    Abstract: A pair of solder bonding portions to be solder-bonded onto the printed wiring board and a contact portion to contact the different conductive member or the like are coupled by a pair of flat spring portions. The respective flat spring portions protrude from side surfaces of mutually opposed corners of the contact portion. Sections following protruded sections of the respective flat spring portions are bent so as to wind in the same direction around a pillar-shaped space obtained by projecting the contact portion downward, and the flat spring portions reach the corresponding solder bonding portions. When the contact portion is pressed by the conductive member, the contact portion and the solder bonding portions remain parallel to each other, whereby the contact member can be successfully flattened toward the printed wiring board. At this point, outward deformation of the flat spring portions is inhibited.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: June 5, 2018
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Tomohisa Kurita
  • Patent number: 9976025
    Abstract: A thermally conductive material is provided. The thermally conductive material includes: a polymer containing a thermally conductive filler and an antioxidant; the polymer being a polymer of a monomer containing an acrylic ester, a hindered phenol-based antioxidant being contained as the antioxidant, a thermal conductivity being 3.2 W/m·K or greater, and an initial Asker C hardness at ambient temperature being 22 or less.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: May 22, 2018
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Takashi Mizuno, Yasuhiro Kawaguchi
  • Patent number: 9976012
    Abstract: A method for producing a flame-retardance-imparting material comprises: a shredding step of shredding plant material containing stems and/or leaves of tomato plants and/or eggplant plants in a aqueous solvent; and an aqueous solvent removal step or removing the aqueous solvent from the plant material after shredding.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: May 22, 2018
    Assignees: KITAGAWA INDUSTRIES CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Yo Utsuno, Ichinori Shigematsu, Masako Seki
  • Patent number: 9876364
    Abstract: This power receiving device includes a magnetic shield, and the magnetic shield includes: a first magnetic sheet located beside the power receiving unit; a conductive sheet located opposite to the power receiving unit with the first magnetic sheet interposed therebetween; and a second magnetic sheet located opposite to the first magnetic sheet with the conductive sheet interposed therebetween.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: January 23, 2018
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Takashi Fujimaki, Akira Mori, Toru Matsuzaki, Taichi Ishihara
  • Patent number: 9868889
    Abstract: A thermal conductive electromagnetic wave absorbing sheet to be provided includes: a polymer including acrylate ester as a monomer; a metal magnetic oxide; and flame retardant filler subjected to surface treatment. The metal magnetic oxide includes a small-diameter metal magnetic oxide with an average particle diameter of 1 to 10 ?m and a large-diameter metal magnetic oxide with an average particle diameter of 50 to 100 ?m. A mixing ratio between the small-diameter metal magnetic oxide and the large-diameter metal magnetic oxide is in a range of 9:13 to 15:7 in volume ratio. The small-diameter metal magnetic oxide and the large-diameter metal magnetic oxide are contained by 55 to 60 vol % in total in the entire thermal conductive electromagnetic wave absorbing sheet. The flame retardant filler subjected to the surface treatment is contained by 8 to 10 vol % in the entire thermal conductive electromagnetic wave absorbing sheet.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: January 16, 2018
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Yasuhiro Kawaguchi, Takashi Mizuno