Patents Assigned to Kitagawa Industries Co., Ltd.
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Patent number: 9196395Abstract: A conductive member includes a metal part and an elastomer part. The conductive member is configured such that, when the conductive member is interposed between a first member and a second member, the elastomer part is elastically deformed so that a top end portion of at least one upper surface-side convex part in the metal part is pressed toward a side of the second member, and a top end portion of at least one under surface-side convex part in the metal part is pressed toward a side of the first member.Type: GrantFiled: November 11, 2011Date of Patent: November 24, 2015Assignee: Kitagawa Industries Co., Ltd.Inventor: Hiroki Kitano
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Publication number: 20150299548Abstract: A heat storage material composition contains a styrene-ethylene-ethylene-propylene-styrene copolymer and a paraffin-based wax. The heat storage material composition preferably further contains a paraffin-based process oil that softens the styrene-ethylene-ethylene-propylene-styrene copolymer. Also, the heat storage material composition preferably contains not less than 300 parts by mass and not more than 1000 parts by mass of the wax with respect to 100 parts by mass of the styrene-ethylene-ethylene-propylene-styrene copolymer.Type: ApplicationFiled: October 23, 2013Publication date: October 22, 2015Applicant: Kitagawa Industries Co., Ltd.Inventors: Tomoyuki SUZUKI, Yasuo KONDO, Makoto KATO, Ryosuke SHIONO, Teruaki YUOKA
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Patent number: 9167698Abstract: A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.Type: GrantFiled: June 30, 2011Date of Patent: October 20, 2015Assignee: Kitagawa Industries Co., Ltd.Inventors: Kenji Konda, Tomohisa Kurita, Hiroki Kitano, Tatsuya Nakamura, Hideo Yumi
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Publication number: 20150282394Abstract: An electromagnetic shielding member comprises: a shielding portion, including a metal material, for sealing an electronic component on an electronic circuit board, between the shielding portion itself and the electronic circuit board; a dielectric portion between a conductive portion of the electronic component, and the shielding portion, the dielectric portion including a dielectric material having a relative permittivity of 6 or more; and a laminated portion around the electronic component, the laminated portion being a laminate of the shielding portion and the dielectric portion.Type: ApplicationFiled: March 25, 2015Publication date: October 1, 2015Applicant: KITAGAWA INDUSTRIES CO., LTD.Inventor: HIDEO YUMI
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Publication number: 20150270717Abstract: This power receiving device includes a magnetic shield, and the magnetic shield includes: a first magnetic sheet located beside the power receiving unit; a conductive sheet located opposite to the power receiving unit with the first magnetic sheet interposed therebetween; and a second magnetic sheet located opposite to the first magnetic sheet with the conductive sheet interposed therebetween.Type: ApplicationFiled: March 13, 2015Publication date: September 24, 2015Applicants: KITAGAWA INDUSTRIES CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takashi FUJIMAKI, Akira MORI, Toru MATSUZAKI, Taichi ISHIHARA
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Patent number: 9105387Abstract: A retainer includes a pair of housings having opening surfaces; a connecting portion connecting outer peripheral surfaces of the pair of housings. The retainer is configured to be at a closed state with the opening surfaces of the pair of housing put together and to be at an open state with the opening surfaces of the pair housings separated. Parts of wall surfaces, constituting the housings, are structured as flexible walls capable of deforming, and the connecting portion is connected to the flexible walls.Type: GrantFiled: October 22, 2010Date of Patent: August 11, 2015Assignee: Kitagawa Industries Co., LTD.Inventors: Hideharu Kawai, Yoshiaki Yanase
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Publication number: 20150222035Abstract: A contact member has a first flat-plate portion, a pair of leg portions, a second flat-plate portion, and a projection portion. The pair of leg portions extends from opposite ends of the first flat-plate portion along a first orientation in a direction intersecting with the first flat-plate portion. The second flat-plate portion is connected to a projecting end of the leg portion. The projection portion extends from an end of the first flat-plate portion on a first direction side of a second orientation, which intersects with the first orientation, to the same direction as the direction where the leg portion extends. The projection portion is bent in a second direction of the second orientation to pass through the space between the pair of leg portions, thereby projecting in the second direction of the second orientation. The projection portion is provided with a protruding portion that expands along the first orientation.Type: ApplicationFiled: September 25, 2013Publication date: August 6, 2015Applicant: KITAGAWA INDUSTRIES CO., LTD.Inventor: Tomohisa Kurita
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Patent number: 9064634Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.Type: GrantFiled: August 23, 2011Date of Patent: June 23, 2015Assignee: Kitagawa Industries Co., Ltd.Inventor: Tatsuya Nakamura
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Patent number: 8974165Abstract: A screw has an outer diameter in a range of 0.3 mm to 1.4 mm. The screw includes resin and carbon fiber which is dispersed in the resin and has a fiber diameter in a range of 0.01 ?m to 0.20 ?m.Type: GrantFiled: November 8, 2013Date of Patent: March 10, 2015Assignee: Kitagawa Industries Co., Ltd.Inventors: Hideo Yumi, Yasuo Kondo, Makoto Kato
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Publication number: 20150004388Abstract: A thermally conductive material according to the present invention is prepared by allowing silicon carbide having an average particle size of 10 ?m or more and less than 50 ?m, aluminum hydroxide having an average particle size of 1 ?m or more and less than 10 ?m, and magnesium hydroxide having an average particle size of 0.5 ?m or more and less than 1 ?m to be contained in a polymer obtained by polymerizing a monomer containing acrylic acid ester.Type: ApplicationFiled: June 26, 2014Publication date: January 1, 2015Applicant: KITAGAWA INDUSTRIES CO., LTD.Inventors: YASUHIRO KAWAGUCHI, TAKASHI MIZUNO
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Patent number: 8915760Abstract: A surface mount clip includes a base part having a rear surface electrically connected to a conductor part of a printed wiring board; and an extension part extending from the base part. The extension part contacts with a conductive member attached to the printed wiring board with elastic deformation of the extension part to hold the conductive member and make electrical connection thereto. The base part includes a solder-bonding part having a bonding plane to be bonded with the printed wiring board and a floating part forming a gap from the printed wiring board in a state that the solder-bonding part is solder-bonded to the printed wiring board. The extension part includes a root part extending from the floating part toward the rear surface of the base part and a folded-back part extending from an end of the root part toward a front surface of the base part.Type: GrantFiled: April 15, 2013Date of Patent: December 23, 2014Assignee: Kitagawa Industries Co., Ltd.Inventor: Tomohisa Kurita
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Patent number: 8902036Abstract: A ferrite clamp includes a pair of divided cores, each being formed in an open circular shape; and a pair of case parts, each being adapted to hold each of the divided cores. When the case parts are assembled with each other, the pair of divided cores held by the case parts constitute a circular magnetic core having an insertion hole to insert an electric cable therethrough. The case part includes, in a portion thereof to hold an outer peripheral surface of the divided core, a protruding portion which is outwardly convex.Type: GrantFiled: November 2, 2011Date of Patent: December 2, 2014Assignee: Kitagawa Industries Co., Ltd.Inventor: Hideharu Kawai
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Publication number: 20140326499Abstract: A frequency range and an attenuation amount of noise to be eliminated change depending upon to which one of two regions of side frames of a bottom serving as a ground conductor surface first, second and third capacitors are connected. Even if impedance of a ferrite core, the shape of a casing, capacitances of the capacitors, and the like are constant, a noise elimination characteristic changes by changing positions of the first to third capacitors. As a result, components including the ferrite core are commonalized and the noise elimination characteristic is easily adjusted in spite of characteristics of electrical equipment.Type: ApplicationFiled: September 13, 2013Publication date: November 6, 2014Applicant: KITAGAWA INDUSTRIES CO., LTD.Inventor: Yoshinori Ohashi
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Publication number: 20140261605Abstract: A thermoelectric conversion module according to one aspect of embodiments of the present invention as disclosed herein includes a plurality of layered planar bodies. Each of the plurality of layered planar bodies includes a base material having a planar shape, a plurality of p-type granular bodies made of a p-type thermoelectric material, and a plurality of n-type granular bodies made of an n-type thermoelectric material. The plurality of p-type granular bodies and the plurality of n-type granular bodies are held by the base material in such a manner as to be spaced apart from each other in a direction along a face of the base material crossing a layered direction of the plurality of layered planar bodies.Type: ApplicationFiled: March 12, 2014Publication date: September 18, 2014Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KITAGAWA INDUSTRIES CO., LTD.Inventors: HIROKI KITANO, HIDEO YUMI, YASUHIRO KAWAGUCHI, KENTA TAKAGI, KIMIHIRO OZAKI
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Patent number: 8808011Abstract: A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.Type: GrantFiled: November 4, 2011Date of Patent: August 19, 2014Assignee: Kitagawa Industries Co., Ltd.Inventors: Hiroki Kitano, Hideo Yumi, Tatsuya Nakamura
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Publication number: 20140133936Abstract: A screw has an outer diameter in a range of 0.3 mm to 1.4 mm. The screw includes resin and carbon fiber which is dispersed in the resin and has a fiber diameter in a range of 0.01 ?m to 0.20 ?m.Type: ApplicationFiled: November 8, 2013Publication date: May 15, 2014Applicant: KITAGAWA INDUSTRIES CO., LTD.Inventors: Hideo YUMI, Yasuo KONDO, Makoto KATO
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Patent number: 8616458Abstract: A non-contact IC tag of the present invention includes a first member including an IC chip and a first antenna connected to the IC chip; a second member including a second antenna; and a movement restriction unit that, when the first member is moved to a predetermined position in the second member, restricts a movement of the first member from the predetermined position. The predetermined position is a position where the first antenna and the second antenna are electromagnetically coupled to each other or a position where the first antenna and the second antenna are electrically conducted to each other.Type: GrantFiled: November 15, 2012Date of Patent: December 31, 2013Assignee: Kitagawa Industries Co., Ltd.Inventor: Yasuyuki Suzuki
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Patent number: 8569626Abstract: A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.Type: GrantFiled: November 16, 2010Date of Patent: October 29, 2013Assignee: Kitagawa Industries Co., Ltd.Inventors: Tomohisa Kurita, Hideo Yumi, Tatsuya Nakamura, Kenji Konda, Hiroki Kitano
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Patent number: D712355Type: GrantFiled: May 2, 2013Date of Patent: September 2, 2014Assignee: Kitagawa Industries Co., Ltd.Inventor: Tatsuya Nakamura
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Patent number: D734130Type: GrantFiled: January 3, 2013Date of Patent: July 14, 2015Assignee: KITAGAWA INDUSTRIES CO., LTD.Inventors: Keisuke Ito, Toshiki Seto