Patents Assigned to Knowles Electronics, LLC
  • Patent number: 11438702
    Abstract: Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a housing, a first diaphragm, and a motor. The housing has an internal volume separated by the first diaphragm into a first front volume and a first back volume such that the first front volume has a first sound outlet. The first diaphragm includes a first paddle movable about a first hinge. The motor is disposed in the housing and includes an armature mechanically coupled to the first paddle. The first hinge is located between opposite ends of the first paddle such that actuation of the armature pivots both ends of the first paddle about the hinge.
    Type: Grant
    Filed: December 26, 2020
    Date of Patent: September 6, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Kalyan Nadella, Thomas Miller, Shehab Albahri, Yahui Zhang
  • Patent number: 11438682
    Abstract: A microphone assembly includes a housing including a base, a cover, and a sound port. The microphone assembly further includes an acoustic transducer and an electrical circuit, both of which are disposed in an enclosed volume of the housing. The transducer and electrical circuit work in concert to convert sound waves into a processed digital audio signal. The electrical circuit is configured to process digital data in a series of frames that correspond to a fixed period in time. The electrical circuit is further configured to reduce noise in the resulting signal by varying the current draw required in a randomized or pseudo-randomized fashion between adjacent frames of digital data.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 6, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Adam Abed, Edwin Cordon, Niel Warren, Donald Sanders, Maulik Patel, Dushyant Liya
  • Patent number: 11418890
    Abstract: The disclosure relates to microphone and other sensor assemblies having a transduction element and an integrated circuit. The integrated circuit includes a switched-capacitor delta-sigma analog-to-digital converter (ADC) including a first integrator stage having a switched-capacitor circuit and a first plurality of parallel amplifiers. A logic circuit coupled to the integrator circuit is configured to selectably disable a subset of enabled amplifiers of the first integrator stage during a first phase of operation and to re-enable the subset of disabled amplifiers during a second phase.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: August 16, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Allan Nielsen, Emil Jakobsen, Per F. Høvesten
  • Patent number: 11399236
    Abstract: This disclosure provides methods, systems, and apparatuses, for a microphone circuit. In particular, the circuit includes transducer that can sense pressure changes and generate an electrical signal having frequency components in a first frequency range and in a second frequency range higher than the first frequency range. The circuit includes a feedback circuitry that can attenuate frequency components in the first frequency range in the electrical signal and, from it, generate an audio signal. A feedback path circuit includes a low pass filter having a cut-off frequency within the first frequency range, and filters the audio signal to generate a low pass filter signal that includes frequency components in the first frequency range. The low pass filter signal can be used to generate a low frequency pressure signal that corresponds to low frequency pressure changes sensed by the transducer.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: July 26, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Venkataraman Chandrasekaran, Christian Lillelund, Claus Erdmann Fürst, Mohammad Shajaan
  • Patent number: 11399237
    Abstract: The disclosure relates to a MEMS sensor and an assembly including the MEMS sensor and an electrical circuit disposed in an assembly housing. The sensor includes a suspended structure (148) having a top diaphragm (118), a central electrode (120) and a bottom diaphragm (122) connected by a pillar portion (134). A peripheral portion of the suspended structure is coupled to a support structure (114), forming a low pressure cavity (130). The MEMS sensor includes a top electrode (136) disposed between the top diaphragm and the central electrode and a bottom electrode (138) disposed between the bottom diaphragm and central electrode each coupled to the support structure, wherein in the event of a sound pressure condition, the suspended structures moves up or down together, while the top electrode and the bottom electrode remain substantially stationary.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: July 26, 2022
    Assignee: Knowles Electronics, LLC
    Inventor: Zhijun Guo
  • Patent number: 11399238
    Abstract: Microphone devices and methods for manufacturing microphone devices that include a substrate having a first surface and a second surface, a cover secured to the first surface of the substrate to form an enclosed back volume, an application specific integrated circuit (ASIC) embedded between the first surface and the second surface of the substrate, a microelectromechanical systems (MEMS) transducer mounted on the first surface of the substrate, and an inductor mounted on the first surface of the substrate.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: July 26, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Joshua Watson, Karan Jumani, Donald Yochem
  • Patent number: 11399235
    Abstract: The present disclosure relates to a balanced armature receiver (100) including a housing having a diaphragm comprising a movable paddle (116) disposed in the housing and separating the housing into a back volume (112) and a front volume (110) defined partly by space between a ceiling of the housing and the diaphragm, wherein the paddle is oriented non-parallel to the ceiling. A sound port (142) in the housing acoustically couples the front volume to an exterior of the housing, wherein the sound port is located on an end wall between the diaphragm and the ceiling. A motor disposed in the back volume includes a coil magnetically coupled to an armature having an end portion movably disposed between magnets retained by a yoke and coupled to the paddle.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: July 26, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Thomas Miller, Paul C Dayton
  • Patent number: 11381911
    Abstract: The present disclosure relates generally to digital microphone and other sensor assemblies including a transducer, a delta-sigma analog-to-digital converter (ADC), a dynamic element matching (DELM) entity configured to compensate for nonlinearity resulting from variation among digital-to-analog conversion (DAC) elements of the ADC, and a control circuit configured to enable and disable the DELM based on a magnitude of a digital signal generated by the ADC.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: July 5, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Mohammad Sadegh Mohammadi, Mohammad Shajaan, Claus Erdmann Furst
  • Patent number: 11375318
    Abstract: A MEMS can include a substrate including a first side and a second side on an opposite side of the substrate from the first side. The MEMS device can include an aperture running through the substrate from the first side to the second side. The substrate can have an edge surrounding the aperture on the first side. The MEMS device can include a diaphragm located over the aperture on the first side. The MEMS device can include a support structure that extends at least partially across the aperture from the edge.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 28, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Jeremy Johnson, Yenhao Chen
  • Patent number: 11368794
    Abstract: A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: June 21, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Michael Pedersen, Joshua Watson, John Szczech
  • Patent number: 11365118
    Abstract: The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: June 21, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Joshua Watson, Adam Ariffin
  • Patent number: 11368783
    Abstract: A microphone device includes a substrate having a first surface, a wall disposed on the first surface, a microelectromechanical systems (MEMS) transducer, and an integrated circuit. Both the MEMS transducer and the integrated circuit are mounted on the first surface of the wall. The wall separates the MEMS transducer from the integrated circuit and acoustically isolates the MEMS transducer from the integrated circuit. The microphone device additionally includes a first set of wires extending through the wall and electrically connecting the MEMS transducer to the integrated circuit. The microphone device further includes a second set of wires electrically connecting the integrated circuit to a conductor on the substrate.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: June 21, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Thomas E. Miller, Andrew D. Unruh
  • Publication number: 20220182759
    Abstract: A microphone assembly includes an acoustic transducer configured to generate an analog signal in response to pressure changes sensed by the acoustic transducer. The analog signal includes frequency components below a threshold frequency. The microphone assembly also includes an integrated circuit electrically coupled to the acoustic transducer and configured to determine a characteristic of frequency components below the threshold frequency, determine whether the characteristic of the frequency components corresponds to a fall event, and generate an output signal in response to a determination that the characteristic of the frequency components corresponds to the fall event. The microphone assembly also includes a housing having an external device interface with electrical contacts. The acoustic transducer and the integrated circuit are disposed within the housing. The integrated circuit is electrically coupled to contacts of the external device interface.
    Type: Application
    Filed: April 3, 2020
    Publication date: June 9, 2022
    Applicant: Knowles Electronics, LLC
    Inventor: John Albers
  • Patent number: 11338324
    Abstract: The disclosure describes devices and methods for implementing impedance matching. The device may be implemented on an integrated circuit that includes a communication protocol interface circuit, a first signal output terminal, a first output driver circuit, and a controller. The first output driver circuit is coupled to the controller and has a corresponding plurality of parallel driver stages, each driver stage including a driver and a configurable resistance coupling an output of the driver to the first signal output terminal (e.g., first contact). The configurable resistances of the first output driver form a first series terminated resistance. The controller is configured to adjust the configurable resistances to adjust the first series terminated resistance.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: May 24, 2022
    Assignee: Knowles Electronics, LLC
    Inventor: Andrzej Pawlowski
  • Patent number: 11335331
    Abstract: A system and method provides for multibeam keyword detection. A composite audio signal may include sound components. The system and method groups the sound components into subsets based on the angles of arrival of sound components. Keyword detectors evaluate each subset and determine whether a keyword is present.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: May 17, 2022
    Assignee: KNOWLES ELECTRONICS, LLC.
    Inventors: Harsha Rao, Malakapati Loka Nagendra Prasad, Hindupur Keerthi Sagar, Pratik Shah, Murali Mohan Deshpande, John Woodruff, Sai Ravi Teja Pulugurtha, Rohit Paturi
  • Patent number: 11337000
    Abstract: A wearable audio device, like a wireless earpiece, that generates a composite voice signal based on a low band signal and a high band signal is disclosed. The low band signal includes a component of the user's voice obtained from an acoustic vibration sensor that detect body conducted sounds and the high band signal includes a component of the user's voice obtained from a microphone that detects atmospheric sounds, wherein the low band signal is obtained predominately from the acoustic vibration sensor and the high band signal is obtained predominately from the microphone. The low and high band signals are based on one or more characteristics of the vibration sensor signal.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: May 17, 2022
    Assignee: Knowles Electronics, LLC
    Inventor: Gints Klimanis
  • Publication number: 20220150645
    Abstract: A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 12, 2022
    Applicant: KNOWLES ELECTRONICS, LLC
    Inventors: Sung Bok LEE, Vahid NADERYAN, Bing YU, Michael KUNTZMAN, Yunfei MA, Wade CONKLIN, Peter LOEPPERT
  • Patent number: 11323805
    Abstract: A microphone assembly includes a transducer element and a processing circuit. The processing circuit includes an analog-to-digital converter (ADC) configured to receive, sample and quantize a microphone signal generated by the transducer element to generate a corresponding digital microphone signal. The processing circuit includes a feedback path including a digital loop filter configured to receive and filter the digital microphone signal to provide a first digital feedback signal and a digital-to-analog converter (DAC) configured to convert the first digital feedback signal into a corresponding analog feedback signal. The processing circuit additionally includes a summing node at the transducer output configured to combine the microphone signal and the analog feedback signal.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: May 3, 2022
    Assignee: KNOWLES ELECTRONICS, LLC.
    Inventors: Mohammad Shajaan, Claus Erdmann Fürst, Per Flemming Høvesten, Kim Spetzler Berthelsen, Henrik Thomsen
  • Patent number: 11323823
    Abstract: An MEMS acoustic transducer includes a substrate having an opening formed therein, a diaphragm comprising a slotted insulative layer, and a first conductive layer. The slotted insulative layer is attached around a periphery thereof to the substrate and over the opening, and the first conductive layer is disposed on a first surface of the slotted insulative layer. A backplate is separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate.
    Type: Grant
    Filed: January 18, 2021
    Date of Patent: May 3, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Shubham Shubham, Hungchien Lin
  • Patent number: 11310600
    Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals includes a transducer substrate, a back plate, and a diaphragm assembly. The diaphragm assembly includes a first diaphragm and a second diaphragm coupled thereto. The second diaphragm is positioned closer to the back plate than the first diaphragm. The second diaphragm includes a plurality of diaphragm apertures configured to allow air to pass through the second diaphragm. Each of the back plate and the first diaphragm are coupled to the transducer substrate at their periphery. In an embodiment, the transducer includes a post coupled to the first diaphragm and the second diaphragm, the post configured to prevent movement of the second diaphragm relative to the first diaphragm in a direction substantially perpendicular to the second diaphragm.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: April 19, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Vahid Naderyan, Sung Bok Lee, Michael Kuntzman