Patents Assigned to Knowles Electronics, LLC
  • Publication number: 20260136130
    Abstract: A Micro-Electro-Mechanical System (MEMS) microphone can include a housing, an integrated circuit (IC), and a MEMS transducer. The housing can include a cover mounted on a base having a first printed circuit board (PCB) facing a second PCB. A first recess can be located in the base and be at least partially defined by an aperture through the first PCB. A second recess can be located in the base and be at least partially defined by a cavity in the first PCB. An internal electrical interface can be located in the housing on a side of the first PCB facing the second PCB. The MEMS transducer can be electrically connected to the IC and include a diaphragm that separates an interior of the housing into a front volume and a back volume, wherein the first recess and the second recess constitute a portion of the back volume.
    Type: Application
    Filed: November 12, 2024
    Publication date: May 14, 2026
    Applicant: Knowles Electronics, LLC
    Inventors: Chris Monti, John Szczech
  • Patent number: 12620385
    Abstract: An ear-worn hearing device includes a speaker disposed in a housing comprising a portion configured for wear over, on, or at least partially in a canal of a user's ear. Microphones are integrated with the housing, and a digital signal processing chain is coupled to and located between the microphones and the speaker. The digital signal processing chain includes active noise cancellation (ANC) circuitry configured to generate an anti-noise signal, and speaker-performance-enhancement circuitry coupled to the ANC circuitry and configured to generate a signal based on the anti-noise signal for the speaker. The digital signal processing chain is configured to communicate audio signals between the ANC circuitry and the speaker-performance-enhancement circuitry without changing a format of the audio signals.
    Type: Grant
    Filed: April 6, 2023
    Date of Patent: May 5, 2026
    Assignee: Knowles Electronics, LLC
    Inventor: Thomas E. Miller
  • Patent number: 12617670
    Abstract: A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: May 5, 2026
    Assignee: Knowles Electronics, LLC
    Inventors: Ken Deng, Bing Yu, Michael Pedersen, Nicholas Palcheck, Jeremy Johnson, Richard Li-Chen Chen
  • Patent number: 12615482
    Abstract: An ear-worn hearing device is disclosed and includes a body portion with a sound-producing transducer acoustically coupled to a sound passage of a nozzle. a resilient portion protrudes from a side of the body portion and includes a physiological or activity sensor coupled to a flexible portion of a flex harness. The resilient portion at least partially covers a portion of the flex harness without impeding operation of the sensor, wherein the flexible portion and the sensor are flexible toward and away from the body portion upon depression and release of the resilient portion.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: April 28, 2026
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Johannes Kreuzer, David Biegger, Leo Lorenz, Christopher Monti, Charles King
  • Patent number: 12589987
    Abstract: A microelectromechanical systems (MEMS) sensor, a capacitive MEMS motor sensing circuit and a method are provided. The present application provides a microelectromechanical systems (MEMS) sensor. The MEMS sensor includes a housing having electrical contacts disposed on an exterior of the housing. The MEMS sensor further includes a capacitive MEMS motor disposed in the housing, and an electrical circuit disposed in the housing and being electrically coupled to the electrical contacts. The electrical circuit includes a bias voltage source having an output coupled to an input of the MEMS motor. The electrical circuit further includes a buffer circuit including an amplifier input stage having an input coupled to an output of the MEMS motor.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: March 31, 2026
    Assignee: Knowles Electronics, LLC
    Inventors: Michael Jennings, Steven Boor, Divya Kesharwani
  • Patent number: 12552659
    Abstract: Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g., a rigid piece of silicon such as an integrated circuit die) in place of a diaphragm.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: February 17, 2026
    Assignee: Knowles Electronics, LLC
    Inventor: Michael Pedersen
  • Patent number: 12509344
    Abstract: A microelectromechanical system (MEMS) die includes a substrate, a diaphragm made from a conductive material and supported over the substrate, and a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate. The backplate includes a central electrode layer disposed on a surface facing the diaphragm, and a ring electrode layer disposed on the surface facing the diaphragm, the ring electrode layer spaced from and surrounding the central electrode layer.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: December 30, 2025
    Assignee: Knowles Electronics, LLC
    Inventors: Yunfei Ma, Ann George, Shubham Shubham
  • Patent number: 12497283
    Abstract: A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.
    Type: Grant
    Filed: March 8, 2024
    Date of Patent: December 16, 2025
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, Michael Pedersen, Vahid Naderyan
  • Patent number: 12464272
    Abstract: A micro-speaker for use in hearing and other body worn devices is disclosed, including an acoustic conduit defining an acoustic path between first and second air spaces. A first acoustic transducer is located between the acoustic conduit and the first air space and a second acoustic transducer located between the acoustic conduit and the second air space. The second acoustic transducer is operable to more or less obstruct an acoustic aperture between the acoustic conduit and the second air space, wherein concurrent operation of the first and second acoustic transducers generates an acoustic audio signal that propagates between the first and second air spaces. An acoustic vent between the acoustic conduit and the second air space has an acoustic impedance that is independent of the operation of the second acoustic transducer.
    Type: Grant
    Filed: December 11, 2023
    Date of Patent: November 4, 2025
    Assignee: Knowles Electronics, LLC
    Inventors: Charles B. King, Thomas E. Miller, Mohammad Mohammadi
  • Patent number: 12355197
    Abstract: An ear-worn hearing device component is disclosed and includes an electrical connector a housing and multiple connector contacts integrated with a contact carrier. A portion of the contact carrier and connector contacts protrudes from the housing and each connector contact is connected to a corresponding contact of a circuit board located in a cavity of the housing. Wires of an electrical cable mechanically coupled to the electrical connector are connected to the connector contacts via the circuit board.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: July 8, 2025
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Matthew Manley, Christopher Monti, Charles King
  • Patent number: 12356167
    Abstract: A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm, a geometric central region surrounding the geometric center of the diaphragm assembly, and a plurality of pillars connecting the first and second diaphragms, each of the plurality of pillars having a cross-sectional shape having a maximum radial dimension, A, and a maximum circumferential dimension, B, wherein at least a first subset of the plurality of pillars is disposed within the geometric central region and wherein A is greater than B for the at least first sub set.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: July 8, 2025
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Shubham Shubham, Jim Guo
  • Patent number: 12348238
    Abstract: A sensor assembly including a transducer and interface circuit with a DSL-controlled input voltage is disclosed. The interface circuit includes a logic circuit configured to generate and provide a pulse width and amplitude modulated (PWAM) signal to an n-bit iDAC coupled to an analog front end (AFE) amplifier or buffer. The PWAM signal is based on an output of a forward signal-path ADC or low-power ADC coupled to the AFE amplifier or buffer, wherein the n-bit iDAC regulates a voltage at the input of the AFE amplifier or buffer based on the PWAM signal.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: July 1, 2025
    Assignee: Knowles Electronics, LLC
    Inventors: Vezio Malandruccolo, Luca Bettini
  • Patent number: 12349266
    Abstract: According to some embodiments, the present disclosure is directed to a printed circuit board for a microphone assembly that includes a top layer structured for a MEMS transducer to be mounted thereon, a bottom layer, at least one edge, a ground plane, and a conductor electrically connected to the ground plane and the bottom layer. The MEMS transducer includes a transducer substrate, a back plate and a diaphragm. The conductor extends vertically from the top layer to the bottom layer of the printed circuit board, and horizontally along a portion of a length of at least one edge of the printed circuit board. The printed circuit board includes two short edges and two long edges, and the conductor is connected to at least one of the four edges.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: July 1, 2025
    Assignee: Knowles Electronics, LLC
    Inventors: Joshua Watson, Adam Ariffin
  • Patent number: 12317019
    Abstract: A microphone assembly can include a microelectromechanical systems (MEMS) form-factor adapter housing including an interface opening and an adapter housing acoustic port and a MEMS microphone disposed at least partially within the MEMS form-factor adapter housing. The MEMS microphone can include a MEMS microphone housing comprising a MEMS microphone acoustic port; a plurality of electrical interface contacts physically accessible through the interface opening of the MEMS form-factor adapter housing; a MEMS motor disposed in the MEMS microphone housing; and an integrated circuit disposed in the MEMS microphone housing and electrically coupled to the MEMS motor and to the plurality of electrical interface contacts. The MEMS form-factor adapter housing can change a form-factor of the MEMS microphone housing.
    Type: Grant
    Filed: March 20, 2024
    Date of Patent: May 27, 2025
    Assignee: Knowles Electronics, LLC
    Inventors: Janice LoPresti, Steve Kearey, Usha Murthy
  • Patent number: 12317045
    Abstract: A diaphragm for a balanced armature receiver and combinations thereof. The diaphragm includes a paddle having an area of concentrated mass located at or near a central portion of the paddle, the area of concentrated mass having an area density greater than an area density of other portions of the paddle, wherein the area of concentrated mass shifts a bending-mode frequency of the paddle to a lower frequency compared to a bending-mode frequency of the paddle in the absence of the area of concentrated mass.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: May 27, 2025
    Assignee: Knowles Electronics, LLC
    Inventor: Christopher Monti
  • Patent number: 12317040
    Abstract: An ear-worn hearing device and an electrical cable assembly for such a hearing device are disclosed. The electrical cable assembly includes a discrete retention member rotationally and axially fixing the retention member at least partially about an end portion of an electrical conductor conduit. The retention member also axially and rotationally fixes the cable assembly to a housing. The housing can include an acoustic receiver and be configured for insertion at least partially in the user's ear. Alternatively, the housing can be part of a connector plug that mates with a base unit worn outside the user's ear.
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: May 27, 2025
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Matthew Manley, Randall A. Sanecki
  • Patent number: 12291445
    Abstract: A microelectromechanical systems (MEMS) device comprises a MEMS die that comprises first and second diaphragms, a first plurality of electrodes each disposed on the first diaphragm, and a second plurality of electrodes each disposed on the second diaphragm. A fixed dielectric element is disposed between the first and second diaphragms and includes a plurality of apertures. The MEMS die further comprises a third plurality of electrodes, wherein each of the third plurality comprises a first conductive layer disposed on the first diaphragm proximate to at least one of the first plurality and a second conductive layer disposed on the second diaphragm proximate to at least one of the second plurality, and a conductive pin that extends through an aperture of the plurality of apertures and electrically connects the first conductive layer to the second conductive layer.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: May 6, 2025
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, Michael Pedersen
  • Publication number: 20250136433
    Abstract: Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g.
    Type: Application
    Filed: December 27, 2024
    Publication date: May 1, 2025
    Applicant: Knowles Electronics, LLC
    Inventor: Michael Pedersen
  • Patent number: 12250520
    Abstract: A capacitive sensor assembly is disclosed, including a capacitive motor coupled to a charge pump circuit via a low pass filter, and a frontend amplifier circuit having an input coupled to the capacitive motor interface and an output coupled to an output of the electrical circuit. An injection current source (ICS) is coupled to the charge pump circuit output and configured to control voltage across a diode-based resistive element of the low pass filter during a transient startup phase of the charge pump circuit, wherein a settling time of the charge pump is reduced.
    Type: Grant
    Filed: December 31, 2022
    Date of Patent: March 11, 2025
    Assignee: Knowles Electronics, LLC
    Inventors: Shenjie Wang, René Scheuner, Mark Niederberger
  • Patent number: 12240748
    Abstract: A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.
    Type: Grant
    Filed: March 21, 2021
    Date of Patent: March 4, 2025
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, Michael Pedersen, Vahid Naderyan