Abstract: A microelectromechanical systems (MEMS) device comprises a MEMS die that comprises first and second diaphragms, a first plurality of electrodes each disposed on the first diaphragm, and a second plurality of electrodes each disposed on the second diaphragm. A fixed dielectric element is disposed between the first and second diaphragms and includes a plurality of apertures. The MEMS die further comprises a third plurality of electrodes, wherein each of the third plurality comprises a first conductive layer disposed on the first diaphragm proximate to at least one of the first plurality and a second conductive layer disposed on the second diaphragm proximate to at least one of the second plurality, and a conductive pin that extends through an aperture of the plurality of apertures and electrically connects the first conductive layer to the second conductive layer.

Abstract: Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g.

Abstract: A capacitive sensor assembly is disclosed, including a capacitive motor coupled to a charge pump circuit via a low pass filter, and a frontend amplifier circuit having an input coupled to the capacitive motor interface and an output coupled to an output of the electrical circuit. An injection current source (ICS) is coupled to the charge pump circuit output and configured to control voltage across a diode-based resistive element of the low pass filter during a transient startup phase of the charge pump circuit, wherein a settling time of the charge pump is reduced.

Abstract: A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.

Abstract: A microelectromechanical systems (MEMS) sensor, a capacitive MEMS motor sensing circuit and a method are provided. The MEMS sensor includes a housing having electrical contacts disposed on an exterior of the housing. The MEMS sensor further includes a capacitive MEMS motor disposed in the housing, and an electrical circuit disposed in the housing and being electrically coupled to the electrical contacts. The electrical circuit includes a bias voltage source having an output coupled to an input of the MEMS motor. The electrical circuit further includes an amplifier including an amplifier input stage having an input, coupled to an output of the MEMS motor, the amplifier input stage having a negative input resistance, where a sum of a series resistance of the MEMS motor at the input and the negative input resistance is less than zero, and wherein application of a signal from the output of the MEMS motor to the input of the amplifier input stage produces a negative real part of input current.

Abstract: An ear-worn hearing device and acoustic transducer subassemblies therefor are disclosed. The hearing device includes a hearing device housing with a sound passage terminating at a sound port on a portion of the hearing device housing configured to protrude toward or into a user's ear canal. Multiple transducers are arranged end-to-end along a lengthwise dimension, wherein a first transducer is located between the other transducers and the sound port of the hearing device housing. The transducers each include a sound outlet acoustically coupled to the sound port via the sound passage.

Abstract: A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.

Abstract: A microelectromechanical systems (MEMS) die comprises a first diaphragm having a first side and a second side, and a second diaphragm having a first side facing the first side of the first diaphragm. A first plurality of interconnect strips is disposed along at least the first side of the first diaphragm, a second plurality of interconnect strips is disposed along the first side of the first diaphragm, and a third plurality of interconnect strips is disposed along the first side of the second diaphragm. First, second, and third runner strips are disposed along the second side of the first diaphragm transverse to the first, second, and third plurality of interconnect strips, respectively. Each of the first, second, and third runner strips is electrically connected to at least a subset of the first, second, and third plurality of interconnect strips, respectively, via electrical connections disposed through the first diaphragm.

Abstract: The disclosure relates to a transducer assembly like a microphone including a bias circuit having a charge pump and a filter circuit coupled to a transducer. The filter circuit includes a voltage-controlled resistor located between an output of the charge pump and the transducer, and a capacitor coupled to the voltage-controlled resistor opposite the charge pump, wherein the bias circuit is configured with a larger bandwidth for faster settling during transient operation than during steady-state operation.

Abstract: The present disclosure relates to a transducer assembly including a transducer having a movable member, and a servo-loop controller configured to compensate for effects of a disturbance on the transducer assembly by adjusting a bias voltage applied to the transducer. A servo-loop controller having a smaller bandwidth for out-of-band disturbances than for in-band disturbances and configured to control the bias voltage based on a feedback signal generated by a sensor that detects an effect of the disturbance on the transducer assembly. The transducer assembly can be implemented as a microphone or a speaker among other sensors and actuators.

Abstract: A balanced armature receiver including a motor with a yoke for retaining magnets and fastening to an armature are disclosed. The yoke includes a close-ended wall structure defining a passage through which an armature is extendable. The close-ended wall structure includes a plurality of wall portions interconnecting a plurality of folded corner portions, wherein a thickness of the plurality of wall portions less than a thickness of the plurality of folded corner portions.

Abstract: An ear-worn hearing device including an acoustic transducer and a physiological sensor located between an acoustic sealing flange and an inner end portion of the hearing device is disclosed. The flange can be integrated with the hearing device or be an integral part of a removable ear dome. The flange is configured to form at least a partial seal with the user's ear. The flange can also prevent light from entering into the user's ear canal. A removable ear dome can be located on the hearing device by a portion of the physiological sensor protruding from the housing.

Abstract: A PM signal generator can generate a variable PM signal based on a position of a movable element of a MEMS motor. A bias voltage generator can provide a bias voltage to the MEMS motor. The bias voltage generator can include a reference signal generator that can generate a reference signal that varies based on variation of pulses of the PM signal. The bias voltage can be based on the reference signal.

Abstract: An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.

Abstract: A balanced armature receiver can include a motor disposed in a case. The motor can include an armature having a first portion fixed to and extending from a yoke and a second portion extending through a coil tunnel. The second portion can have a free end-portion movably disposed in a magnet gap. The balanced armature receiver can include a damping compound-locating structure disposed on one or both of the armature and another portion of the receiver proximate the armature. The balanced armature receiver can include damping compound contacting the damping compound-locating structure and located between the armature and another portion of the receiver.

Abstract: A loudspeaker for hearing devices including a diaphragm arranged in a housing to form a back volume and a front volume acoustically coupled to a sound port is disclosed. A surface of a first magnet in the front volume faces an opposing surface of a second magnet in the back volume, and the opposing surfaces of the magnets are separated by a gap and have the same magnetic polarity. An electrical coil assembly coupled to the diaphragm has a radial difference dimension to thickness dimension ratio greater than 1, wherein the diaphragm and the electrical coil assembly are movable in the gap between the magnets in response to an electrical audio signal applied to the electrical coil assembly.

Abstract: A balanced armature receiver including a motor with a yoke for retaining magnets and fastening to an armature are disclosed. The yoke includes a close-ended wall structure formed of a soft magnetic material having multiple folded corners defining an armature passage. A first magnet retaining wall portion of the yoke is arranged in parallel with, and opposite, a second magnet retaining wall portion, wherein at least a portion of the first magnet retaining wall portion has a reduced thickness relative to other wall portions of the close-ended wall structure. The armature is connected to the reduced thickness portion of the first magnet retaining wall portion, thereby reducing an overall z-axis dimension of the motor.

Abstract: A microphone assembly can include a form-factor adapter housing including an interface opening and an external acoustic port, and an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port and electrical interface contacts, a microelectromechanical systems (MEMS) motor disposed in the internal housing, and an integrated circuit disposed in the internal housing, the integrated circuit electrically coupled to the MEMS motor and to the electrical interface contacts. The assembly can include an adapter interface located at the interface opening and comprising external host device interface contacts electrically coupled to the electrical interface contacts, the external host device interface contacts exposed to an exterior of the microphone assembly. The internal acoustic port can be acoustically coupled to the external acoustic port.

Abstract: A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

Abstract: A microphone assembly can include a microelectromechanical systems (MEMS) transducer comprising a transducer substrate, a diaphragm oriented substantially parallel to the transducer substrate and spaced apart from the transducer substrate to form a gap, and a counter electrode coupled to the transducer substrate, the counter electrode positioned between the diaphragm and the transducer substrate. The MEMS transducer can generate a signal representative of a change in capacitance between the counter electrode and the diaphragm. A back volume of the MEMS transducer can be an enclosed volume positioned between the transducer substrate and the diaphragm. The microphone assembly can include an integrated circuit that receives the signal, wherein every point within the back volume is less than a thermal boundary layer thickness from a nearest solid surface at an upper limit of an audio frequency band that the integrated circuit is monitoring.