Patents Assigned to Knowles Electronics, LLC
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Publication number: 20260136130Abstract: A Micro-Electro-Mechanical System (MEMS) microphone can include a housing, an integrated circuit (IC), and a MEMS transducer. The housing can include a cover mounted on a base having a first printed circuit board (PCB) facing a second PCB. A first recess can be located in the base and be at least partially defined by an aperture through the first PCB. A second recess can be located in the base and be at least partially defined by a cavity in the first PCB. An internal electrical interface can be located in the housing on a side of the first PCB facing the second PCB. The MEMS transducer can be electrically connected to the IC and include a diaphragm that separates an interior of the housing into a front volume and a back volume, wherein the first recess and the second recess constitute a portion of the back volume.Type: ApplicationFiled: November 12, 2024Publication date: May 14, 2026Applicant: Knowles Electronics, LLCInventors: Chris Monti, John Szczech
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Patent number: 12620385Abstract: An ear-worn hearing device includes a speaker disposed in a housing comprising a portion configured for wear over, on, or at least partially in a canal of a user's ear. Microphones are integrated with the housing, and a digital signal processing chain is coupled to and located between the microphones and the speaker. The digital signal processing chain includes active noise cancellation (ANC) circuitry configured to generate an anti-noise signal, and speaker-performance-enhancement circuitry coupled to the ANC circuitry and configured to generate a signal based on the anti-noise signal for the speaker. The digital signal processing chain is configured to communicate audio signals between the ANC circuitry and the speaker-performance-enhancement circuitry without changing a format of the audio signals.Type: GrantFiled: April 6, 2023Date of Patent: May 5, 2026Assignee: Knowles Electronics, LLCInventor: Thomas E. Miller
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Patent number: 12617670Abstract: A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.Type: GrantFiled: December 22, 2022Date of Patent: May 5, 2026Assignee: Knowles Electronics, LLCInventors: Ken Deng, Bing Yu, Michael Pedersen, Nicholas Palcheck, Jeremy Johnson, Richard Li-Chen Chen
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Patent number: 12615482Abstract: An ear-worn hearing device is disclosed and includes a body portion with a sound-producing transducer acoustically coupled to a sound passage of a nozzle. a resilient portion protrudes from a side of the body portion and includes a physiological or activity sensor coupled to a flexible portion of a flex harness. The resilient portion at least partially covers a portion of the flex harness without impeding operation of the sensor, wherein the flexible portion and the sensor are flexible toward and away from the body portion upon depression and release of the resilient portion.Type: GrantFiled: July 28, 2023Date of Patent: April 28, 2026Assignee: KNOWLES ELECTRONICS, LLCInventors: Johannes Kreuzer, David Biegger, Leo Lorenz, Christopher Monti, Charles King
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Patent number: 12589987Abstract: A microelectromechanical systems (MEMS) sensor, a capacitive MEMS motor sensing circuit and a method are provided. The present application provides a microelectromechanical systems (MEMS) sensor. The MEMS sensor includes a housing having electrical contacts disposed on an exterior of the housing. The MEMS sensor further includes a capacitive MEMS motor disposed in the housing, and an electrical circuit disposed in the housing and being electrically coupled to the electrical contacts. The electrical circuit includes a bias voltage source having an output coupled to an input of the MEMS motor. The electrical circuit further includes a buffer circuit including an amplifier input stage having an input coupled to an output of the MEMS motor.Type: GrantFiled: December 29, 2022Date of Patent: March 31, 2026Assignee: Knowles Electronics, LLCInventors: Michael Jennings, Steven Boor, Divya Kesharwani
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Patent number: 12552659Abstract: Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g., a rigid piece of silicon such as an integrated circuit die) in place of a diaphragm.Type: GrantFiled: January 7, 2022Date of Patent: February 17, 2026Assignee: Knowles Electronics, LLCInventor: Michael Pedersen
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Patent number: 12509344Abstract: A microelectromechanical system (MEMS) die includes a substrate, a diaphragm made from a conductive material and supported over the substrate, and a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate. The backplate includes a central electrode layer disposed on a surface facing the diaphragm, and a ring electrode layer disposed on the surface facing the diaphragm, the ring electrode layer spaced from and surrounding the central electrode layer.Type: GrantFiled: December 28, 2022Date of Patent: December 30, 2025Assignee: Knowles Electronics, LLCInventors: Yunfei Ma, Ann George, Shubham Shubham
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Patent number: 12497283Abstract: A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.Type: GrantFiled: March 8, 2024Date of Patent: December 16, 2025Assignee: Knowles Electronics, LLCInventors: Peter V. Loeppert, Michael Pedersen, Vahid Naderyan
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Patent number: 12464272Abstract: A micro-speaker for use in hearing and other body worn devices is disclosed, including an acoustic conduit defining an acoustic path between first and second air spaces. A first acoustic transducer is located between the acoustic conduit and the first air space and a second acoustic transducer located between the acoustic conduit and the second air space. The second acoustic transducer is operable to more or less obstruct an acoustic aperture between the acoustic conduit and the second air space, wherein concurrent operation of the first and second acoustic transducers generates an acoustic audio signal that propagates between the first and second air spaces. An acoustic vent between the acoustic conduit and the second air space has an acoustic impedance that is independent of the operation of the second acoustic transducer.Type: GrantFiled: December 11, 2023Date of Patent: November 4, 2025Assignee: Knowles Electronics, LLCInventors: Charles B. King, Thomas E. Miller, Mohammad Mohammadi
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Patent number: 12355197Abstract: An ear-worn hearing device component is disclosed and includes an electrical connector a housing and multiple connector contacts integrated with a contact carrier. A portion of the contact carrier and connector contacts protrudes from the housing and each connector contact is connected to a corresponding contact of a circuit board located in a cavity of the housing. Wires of an electrical cable mechanically coupled to the electrical connector are connected to the connector contacts via the circuit board.Type: GrantFiled: December 29, 2022Date of Patent: July 8, 2025Assignee: KNOWLES ELECTRONICS, LLCInventors: Matthew Manley, Christopher Monti, Charles King
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Patent number: 12356167Abstract: A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm, a geometric central region surrounding the geometric center of the diaphragm assembly, and a plurality of pillars connecting the first and second diaphragms, each of the plurality of pillars having a cross-sectional shape having a maximum radial dimension, A, and a maximum circumferential dimension, B, wherein at least a first subset of the plurality of pillars is disposed within the geometric central region and wherein A is greater than B for the at least first sub set.Type: GrantFiled: May 26, 2022Date of Patent: July 8, 2025Assignee: KNOWLES ELECTRONICS, LLCInventors: Shubham Shubham, Jim Guo
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Patent number: 12348238Abstract: A sensor assembly including a transducer and interface circuit with a DSL-controlled input voltage is disclosed. The interface circuit includes a logic circuit configured to generate and provide a pulse width and amplitude modulated (PWAM) signal to an n-bit iDAC coupled to an analog front end (AFE) amplifier or buffer. The PWAM signal is based on an output of a forward signal-path ADC or low-power ADC coupled to the AFE amplifier or buffer, wherein the n-bit iDAC regulates a voltage at the input of the AFE amplifier or buffer based on the PWAM signal.Type: GrantFiled: May 8, 2023Date of Patent: July 1, 2025Assignee: Knowles Electronics, LLCInventors: Vezio Malandruccolo, Luca Bettini
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Patent number: 12349266Abstract: According to some embodiments, the present disclosure is directed to a printed circuit board for a microphone assembly that includes a top layer structured for a MEMS transducer to be mounted thereon, a bottom layer, at least one edge, a ground plane, and a conductor electrically connected to the ground plane and the bottom layer. The MEMS transducer includes a transducer substrate, a back plate and a diaphragm. The conductor extends vertically from the top layer to the bottom layer of the printed circuit board, and horizontally along a portion of a length of at least one edge of the printed circuit board. The printed circuit board includes two short edges and two long edges, and the conductor is connected to at least one of the four edges.Type: GrantFiled: December 18, 2020Date of Patent: July 1, 2025Assignee: Knowles Electronics, LLCInventors: Joshua Watson, Adam Ariffin
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Patent number: 12317019Abstract: A microphone assembly can include a microelectromechanical systems (MEMS) form-factor adapter housing including an interface opening and an adapter housing acoustic port and a MEMS microphone disposed at least partially within the MEMS form-factor adapter housing. The MEMS microphone can include a MEMS microphone housing comprising a MEMS microphone acoustic port; a plurality of electrical interface contacts physically accessible through the interface opening of the MEMS form-factor adapter housing; a MEMS motor disposed in the MEMS microphone housing; and an integrated circuit disposed in the MEMS microphone housing and electrically coupled to the MEMS motor and to the plurality of electrical interface contacts. The MEMS form-factor adapter housing can change a form-factor of the MEMS microphone housing.Type: GrantFiled: March 20, 2024Date of Patent: May 27, 2025Assignee: Knowles Electronics, LLCInventors: Janice LoPresti, Steve Kearey, Usha Murthy
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Patent number: 12317045Abstract: A diaphragm for a balanced armature receiver and combinations thereof. The diaphragm includes a paddle having an area of concentrated mass located at or near a central portion of the paddle, the area of concentrated mass having an area density greater than an area density of other portions of the paddle, wherein the area of concentrated mass shifts a bending-mode frequency of the paddle to a lower frequency compared to a bending-mode frequency of the paddle in the absence of the area of concentrated mass.Type: GrantFiled: December 22, 2022Date of Patent: May 27, 2025Assignee: Knowles Electronics, LLCInventor: Christopher Monti
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Patent number: 12317040Abstract: An ear-worn hearing device and an electrical cable assembly for such a hearing device are disclosed. The electrical cable assembly includes a discrete retention member rotationally and axially fixing the retention member at least partially about an end portion of an electrical conductor conduit. The retention member also axially and rotationally fixes the cable assembly to a housing. The housing can include an acoustic receiver and be configured for insertion at least partially in the user's ear. Alternatively, the housing can be part of a connector plug that mates with a base unit worn outside the user's ear.Type: GrantFiled: December 30, 2022Date of Patent: May 27, 2025Assignee: KNOWLES ELECTRONICS, LLCInventors: Matthew Manley, Randall A. Sanecki
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Patent number: 12291445Abstract: A microelectromechanical systems (MEMS) device comprises a MEMS die that comprises first and second diaphragms, a first plurality of electrodes each disposed on the first diaphragm, and a second plurality of electrodes each disposed on the second diaphragm. A fixed dielectric element is disposed between the first and second diaphragms and includes a plurality of apertures. The MEMS die further comprises a third plurality of electrodes, wherein each of the third plurality comprises a first conductive layer disposed on the first diaphragm proximate to at least one of the first plurality and a second conductive layer disposed on the second diaphragm proximate to at least one of the second plurality, and a conductive pin that extends through an aperture of the plurality of apertures and electrically connects the first conductive layer to the second conductive layer.Type: GrantFiled: March 16, 2022Date of Patent: May 6, 2025Assignee: Knowles Electronics, LLCInventors: Peter V. Loeppert, Michael Pedersen
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Publication number: 20250136433Abstract: Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g.Type: ApplicationFiled: December 27, 2024Publication date: May 1, 2025Applicant: Knowles Electronics, LLCInventor: Michael Pedersen
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Patent number: 12250520Abstract: A capacitive sensor assembly is disclosed, including a capacitive motor coupled to a charge pump circuit via a low pass filter, and a frontend amplifier circuit having an input coupled to the capacitive motor interface and an output coupled to an output of the electrical circuit. An injection current source (ICS) is coupled to the charge pump circuit output and configured to control voltage across a diode-based resistive element of the low pass filter during a transient startup phase of the charge pump circuit, wherein a settling time of the charge pump is reduced.Type: GrantFiled: December 31, 2022Date of Patent: March 11, 2025Assignee: Knowles Electronics, LLCInventors: Shenjie Wang, René Scheuner, Mark Niederberger
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Patent number: 12240748Abstract: A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.Type: GrantFiled: March 21, 2021Date of Patent: March 4, 2025Assignee: Knowles Electronics, LLCInventors: Peter V. Loeppert, Michael Pedersen, Vahid Naderyan