Patents Assigned to Knowles Electronics, LLC
  • Patent number: 11399237
    Abstract: The disclosure relates to a MEMS sensor and an assembly including the MEMS sensor and an electrical circuit disposed in an assembly housing. The sensor includes a suspended structure (148) having a top diaphragm (118), a central electrode (120) and a bottom diaphragm (122) connected by a pillar portion (134). A peripheral portion of the suspended structure is coupled to a support structure (114), forming a low pressure cavity (130). The MEMS sensor includes a top electrode (136) disposed between the top diaphragm and the central electrode and a bottom electrode (138) disposed between the bottom diaphragm and central electrode each coupled to the support structure, wherein in the event of a sound pressure condition, the suspended structures moves up or down together, while the top electrode and the bottom electrode remain substantially stationary.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: July 26, 2022
    Assignee: Knowles Electronics, LLC
    Inventor: Zhijun Guo
  • Patent number: 11399238
    Abstract: Microphone devices and methods for manufacturing microphone devices that include a substrate having a first surface and a second surface, a cover secured to the first surface of the substrate to form an enclosed back volume, an application specific integrated circuit (ASIC) embedded between the first surface and the second surface of the substrate, a microelectromechanical systems (MEMS) transducer mounted on the first surface of the substrate, and an inductor mounted on the first surface of the substrate.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: July 26, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Joshua Watson, Karan Jumani, Donald Yochem
  • Patent number: 11399236
    Abstract: This disclosure provides methods, systems, and apparatuses, for a microphone circuit. In particular, the circuit includes transducer that can sense pressure changes and generate an electrical signal having frequency components in a first frequency range and in a second frequency range higher than the first frequency range. The circuit includes a feedback circuitry that can attenuate frequency components in the first frequency range in the electrical signal and, from it, generate an audio signal. A feedback path circuit includes a low pass filter having a cut-off frequency within the first frequency range, and filters the audio signal to generate a low pass filter signal that includes frequency components in the first frequency range. The low pass filter signal can be used to generate a low frequency pressure signal that corresponds to low frequency pressure changes sensed by the transducer.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: July 26, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Venkataraman Chandrasekaran, Christian Lillelund, Claus Erdmann Fürst, Mohammad Shajaan
  • Patent number: 11381911
    Abstract: The present disclosure relates generally to digital microphone and other sensor assemblies including a transducer, a delta-sigma analog-to-digital converter (ADC), a dynamic element matching (DELM) entity configured to compensate for nonlinearity resulting from variation among digital-to-analog conversion (DAC) elements of the ADC, and a control circuit configured to enable and disable the DELM based on a magnitude of a digital signal generated by the ADC.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: July 5, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Mohammad Sadegh Mohammadi, Mohammad Shajaan, Claus Erdmann Furst
  • Patent number: 11375318
    Abstract: A MEMS can include a substrate including a first side and a second side on an opposite side of the substrate from the first side. The MEMS device can include an aperture running through the substrate from the first side to the second side. The substrate can have an edge surrounding the aperture on the first side. The MEMS device can include a diaphragm located over the aperture on the first side. The MEMS device can include a support structure that extends at least partially across the aperture from the edge.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 28, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Jeremy Johnson, Yenhao Chen
  • Patent number: 11368783
    Abstract: A microphone device includes a substrate having a first surface, a wall disposed on the first surface, a microelectromechanical systems (MEMS) transducer, and an integrated circuit. Both the MEMS transducer and the integrated circuit are mounted on the first surface of the wall. The wall separates the MEMS transducer from the integrated circuit and acoustically isolates the MEMS transducer from the integrated circuit. The microphone device additionally includes a first set of wires extending through the wall and electrically connecting the MEMS transducer to the integrated circuit. The microphone device further includes a second set of wires electrically connecting the integrated circuit to a conductor on the substrate.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: June 21, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Thomas E. Miller, Andrew D. Unruh
  • Patent number: 11368794
    Abstract: A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: June 21, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Michael Pedersen, Joshua Watson, John Szczech
  • Patent number: 11365118
    Abstract: The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: June 21, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Joshua Watson, Adam Ariffin
  • Publication number: 20220182759
    Abstract: A microphone assembly includes an acoustic transducer configured to generate an analog signal in response to pressure changes sensed by the acoustic transducer. The analog signal includes frequency components below a threshold frequency. The microphone assembly also includes an integrated circuit electrically coupled to the acoustic transducer and configured to determine a characteristic of frequency components below the threshold frequency, determine whether the characteristic of the frequency components corresponds to a fall event, and generate an output signal in response to a determination that the characteristic of the frequency components corresponds to the fall event. The microphone assembly also includes a housing having an external device interface with electrical contacts. The acoustic transducer and the integrated circuit are disposed within the housing. The integrated circuit is electrically coupled to contacts of the external device interface.
    Type: Application
    Filed: April 3, 2020
    Publication date: June 9, 2022
    Applicant: Knowles Electronics, LLC
    Inventor: John Albers
  • Patent number: 11338324
    Abstract: The disclosure describes devices and methods for implementing impedance matching. The device may be implemented on an integrated circuit that includes a communication protocol interface circuit, a first signal output terminal, a first output driver circuit, and a controller. The first output driver circuit is coupled to the controller and has a corresponding plurality of parallel driver stages, each driver stage including a driver and a configurable resistance coupling an output of the driver to the first signal output terminal (e.g., first contact). The configurable resistances of the first output driver form a first series terminated resistance. The controller is configured to adjust the configurable resistances to adjust the first series terminated resistance.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: May 24, 2022
    Assignee: Knowles Electronics, LLC
    Inventor: Andrzej Pawlowski
  • Patent number: 11337000
    Abstract: A wearable audio device, like a wireless earpiece, that generates a composite voice signal based on a low band signal and a high band signal is disclosed. The low band signal includes a component of the user's voice obtained from an acoustic vibration sensor that detect body conducted sounds and the high band signal includes a component of the user's voice obtained from a microphone that detects atmospheric sounds, wherein the low band signal is obtained predominately from the acoustic vibration sensor and the high band signal is obtained predominately from the microphone. The low and high band signals are based on one or more characteristics of the vibration sensor signal.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: May 17, 2022
    Assignee: Knowles Electronics, LLC
    Inventor: Gints Klimanis
  • Patent number: 11303758
    Abstract: Systems and methods for improved acoustic echo cancellation are provided. In various embodiments, a microphone located in the loudspeaker enclosure provides a first signal that is used to estimate the loudspeaker displacement which is proportional to the sound pressure level (SPL) inside the enclosure. A second signal is then derived by mapping the displacement to the loudspeaker's force factor (Bl(x)) and then modulating this by a measured current to a voice coil inside the speaker to provide an estimate of the force acting on the moving mass of the loudspeaker. The first signal is highly correlated with the echo signal for low frequencies and the second signal is highly correlated with the echo signal for high frequencies. The two signals are then combined to provide a single improved AEC reference signal.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: April 12, 2022
    Assignee: Knowles Electronics, LLC
    Inventor: Andrew D. Unruh
  • Patent number: 11297406
    Abstract: Acoustic transducers for generating electrical signals in response to acoustic signals are disclosed. In some embodiments, an acoustic transducer includes an at least partially evacuated hermetically sealed cavity defined in part by a first diaphragm. The acoustic transducer also includes a backplate disposed at least partially within the cavity. The cavity having a pressure lower than atmospheric pressure. The acoustic transducer further includes a pressure sensor coupled to the backplate and configured to sense the pressure in the cavity.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: April 5, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Venkataraman Chandrasekaran, Michael Kuntzman, Michael Pedersen, Sung Bok Lee
  • Patent number: 11284202
    Abstract: The disclosure describes soft limiting electrical signals generated by a transducer before amplification, buffering or other signal conditioning in a microphone assembly, circuits and methods therefor. The soft limiting circuit includes a first circuit portion that limits a first portion of the electrical signal with reduced distortion when the first portion of the signal exceeds a threshold. A second circuit portion of the soft limiting circuit similarly limits a second portion of the electrical signal. In this way, overloading of an amplifier is avoided without excessive distortion.
    Type: Grant
    Filed: April 26, 2020
    Date of Patent: March 22, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Abdulah Korishe, John Nielsen, Jens J. G. Henriksen
  • Patent number: 11272294
    Abstract: Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.
    Type: Grant
    Filed: December 26, 2020
    Date of Patent: March 8, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Shehab Albahri, Yahui Zhang, Kalyan Nadella, Thomas Miller, Christopher Monti, Charles King, Jose Salazar
  • Patent number: 11265666
    Abstract: This disclosure provides methods, systems, and apparatuses, for a microphone. In particular, the microphone includes a housing having an external device interface with a plurality of contacts including a data contact. An electro-acoustic transducer is configured to generate an electrical signal in response to sound. An electrical circuit is coupled to contacts of the interface, the electrical circuit including an ADC having an input coupled to an output of the conditioning circuit and configured to convert the electrical signal to audio data after conditioning. A controller is configured to communicate data, other than the audio data, via the data contact of the external device interface during a start-up transition period of the microphone assembly, wherein the controller is configured to communicate the audio data via the data contact of the external device interface only after the start-up transition period is complete.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: March 1, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Saket Thukral, Lane Schaller
  • Patent number: 11265641
    Abstract: A MEMS vibration sensor die can include a substrate having a top portion, a mounting surface, and an aperture extending at least partially through the substrate. The die can include a first electrode coupled to the top portion of the substrate and positioned over the aperture. The die can include a second electrode disposed between the substrate and the first electrode. The second electrode can be spaced apart from the first electrode. The die can include a proof mass that can have a first portion coupled to the first electrode or the second electrode. The proof mass can have a second end opposite the first portion. The second end can be recessed within the aperture relative to the mounting surface of the substrate. The proof mass can be suspended freely within the aperture. The proof mass can move the first electrode or the second electrode from which it is suspended in response to vibration.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: March 1, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Michael Pedersen, Venkataraman Chandrasekaran, Joshua Watson, Jeremy Johnson
  • Patent number: 11259132
    Abstract: A micro-electromechanical system (MEMS) transducer assembly includes a transducer including a condenser microphone, an integrated circuit electrically connected to the transducer to receive an output voltage from the transducer, wherein the integrated circuit comprises a test signal generator configured to induce a test acoustic response in the transducer, and an evaluation circuit configured to compare the test acoustic response to a baseline acoustic response to identify a fault in the transducer.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: February 22, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, Venkataraman Chandrasekaran, Daryl Barry, Michael Pedersen, Dean Badillo
  • Patent number: 11259104
    Abstract: A microphone can include an adapter housing. The adapter housing can include an opening and an outer acoustic port. The microphone can include an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port. The internal microphone assembly can include a plurality of contacts disposed on the internal housing. The contacts can be accessible through the opening of the adapter housing. An interior of the internal housing can be acoustically coupled to the outer acoustic port via the internal acoustic port.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: February 22, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Janice LoPresti, Steve Kearey, Usha Murthy
  • Patent number: 11259133
    Abstract: A microphone assembly includes a substrate defining a port, a MEMS transducer, a guard ring, and a can. The MEMS transducer is coupled to the substrate such that the MEMS transducer is positioned over the port. The guard ring is coupled to the substrate and surrounds the MEMS transducer. The guard ring includes a plurality of edges that further includes a first edge and an opposing second edge. A portion of the first edge and a portion of the second edge have a reduced thickness relative to adjacent ones of the plurality of edges. The can is coupled to the guard ring such that the substrate and the can cooperatively define an interior cavity.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: February 22, 2022
    Assignee: Knowles Electronics, LLC
    Inventors: Norman Dennis Talag, Anthony Schmitz