Abstract: The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.

Abstract: An object of the present invention is to provide a sensor unit that can suppress deterioration in communication quality as compared with in the conventional art even when a number of sensor units are connected in sequence, and multiple-type sensor using the sensor unit. A sensor unit in the present invention includes a sensor, and a microcontroller that is electrically connected with the sensor and processes a detection signal of the sensor, wherein the microcontroller includes a host communication control unit that communicates with a host device and a client communication control unit that communicates with a client device. According to the present invention, the deterioration in communication quality can be suppressed as compared with in the conventional art, even when a number of sensor units are connected in sequence.

Abstract: A shunt resistor mounting structure comprising: a resistor including a pair of terminal portions and adapted to perform current sensing; and a mounting board. The mounting board includes: a mounting portion including a pair of a first land and a second land to which the pair of terminal portions are respectively connected, and which allow a current to be measured to flow through the resistor; a substrate having the pair of lands formed thereon; a first voltage terminal formed on the substrate and including a line pattern led out from the first land; and a second voltage terminal including a wire connected to the terminal portion corresponding to the second land.

Abstract: Provided is a current measuring device for measuring current, including a conductor adapted to pass current therethrough, at least a pair of voltage sensing terminals arranged apart from each other on the conductor in the current flowing direction, and a substrate to which the voltage sensing terminals are connected. The substrate is long in the current flowing direction, and connection portion of the substrate that are connected to the voltage sensing terminals are arranged closer to one end side of the substrate in the lengthwise direction.

Abstract: A resistor has a structure including a resistor substrate that has paired electrodes and a resistive element formed on an insulating substrate, an insulating exterior material that covers at least the upper and the side surface of the resistor substrate, and harness electric wires that have one end parts connected to the respective electrodes, pass through the exterior material, and extend outside. The paired electrodes are formed on areas other than the end parts of the insulating substrate, and junctions of the end parts of the harness electric wires and the paired electrodes are at positions where creepage distance of insulation from the junctions to the bottom ends of the insulating substrate is a predetermined distance or longer. Such structure provides the resistor having a secured creepage distance of insulation between the conductor parts of the resistor and the metal case in which the resistor is installed.

Abstract: An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.

Abstract: An object is to provide a chip resistor in which hot spots can be dispersed and the adverse effects on performance caused by microcracks can also be reduced. A chip resistor includes an insulating substrate, a resistive element, and electrodes. In the resistive element, a first trimming groove and a second trimming groove are formed. A first vertical groove of the first trimming groove and a second vertical groove of the second trimming groove are formed with a spacing in between in an X1-X2 direction. A first horizontal groove of the first trimming groove and a second horizontal groove of the second trimming groove extend in directions approaching each other, and terminal ends of the first horizontal groove and the second horizontal groove are formed to be separated in the X1-X2 direction such that the first horizontal groove and the second horizontal groove do not overlap in a Y1-Y2 direction.

Abstract: An object is to provide a resistor manufacturing method and a resistor capable of suppressing variation in the thickness of a thermally conductive layer intervening between a resistive body and electrode plates. The method of manufacturing the resistor according to the present invention includes a step of forming an uncured first thermally conductive layer on a surface of a resistive body, a step of curing the first thermally conductive layer, a step of laminating an uncured second thermally conductive layer on a surface of the first thermally conductive layer, and a step of bending electrode plates respectively disposed at both sides of the resistive body, curing the second thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the first thermally conductive layer and the second thermally conductive layer.

Abstract: To provide a flow sensor having improved responsiveness compared to the prior art, the flow sensor of the present invention includes an insulation board, a flow-rate detection resistance element, and a temperature compensation resistance element. Each of the flow-rate detection resistance element and the temperature compensation resistance element is arranged on the insulation board such that a terminal temperature of the temperature compensation resistance element approaches a terminal temperature of the flow-rate detection resistance element. Accordingly, responsiveness can be improved.

Abstract: Provided is a current measuring device including a first wire member formed of a conductive metal and a second wire member formed of a conductive metal, the second wire member partially including a resistive element metal, in which the first wire member and the second wire member are arranged in parallel with an insulator sandwiched therebetween in a portion where at least the resistive element metal is present.

Abstract: An object of the present invention is to provide a sensor unit that can detect a wide range of physical quantity changes with a higher degree of freedom than in the conventional art and is capable of reporting detection information, and a multiple-type sensor using the sensor unit. A flow sensor in the present invention includes a board, a sensor that is arranged on the board and detects a physical quantity change, a plurality of external connection terminals that are electrically connected to the sensor, and a reporting part that reports detection information of the sensor to the outside. In the present invention, a wide range of physical quantity changes can be detected with a higher degree of freedom. Connecting a plurality of sensor units enables use for various applications.

Abstract: An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.

Abstract: The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.

Abstract: The present invention provides a heater temperature control circuit including a heater and a control circuit that controls a temperature of the heater, wherein the control circuit includes a bridge circuit in which a first circuit and a second circuit are connected in parallel, and an operational amplifier connected to the bridge circuit, wherein in the first circuit, the heater and a resistor are connected in series, and a midpoint of the first circuit is connected to one input portion of the operational amplifier, and an output value Vout from the second circuit is input to the other input portion of the operational amplifier, the output value Vout being obtained by multiplying a division ratio of a target resistance value Rh of the heater and a resistance value R1 of the resistor with a reference voltage Vref of the bridge circuit.

Abstract: An object of the present invention is to provide a sensor unit that can suppress deterioration in communication quality as compared with in the conventional art even when a number of sensor units are connected in sequence, and multiple-type sensor using the sensor unit. A sensor unit in the present invention includes a sensor, and a microcontroller that is electrically connected with the sensor and processes a detection signal of the sensor, wherein the microcontroller includes a host communication control unit that communicates with a host device and a client communication control unit that communicates with a client device. According to the present invention, the deterioration in communication quality can be suppressed as compared with in the conventional art, even when a number of sensor units are connected in sequence.

Abstract: Provided is a method for manufacturing a current detection resistor, which can prevent uneven-shaped weld trace from generating on a surface close to the bonded surface between the electrode metal and the resistor metal body in a current detection resistor in which electrode metals are bonded to both ends of the resistor metal body. The method includes preparing electrode metals and a resistor metal; stacking the electrode metal, the resistor metal, and the electrode metal, and applying pressure from the stacked direction to form an integrated resistor base material; applying pressure to the resistor base material from a direction perpendicular to the stacked direction to make the resistor base material a thin plate-shape resistor base material; and, obtaining individual resistors from the thin plate-shape resistor base material. The resistor base material is preferably formed by using a hot pressure bonding process.

Abstract: In order to provide a hydrogen sensor for measuring a hydrogen concentration with high sensitivity and excellent mass-productivity, the hydrogen sensor includes: at least a first quartz vibrator and a second quartz vibrator formed in a quartz plate; a hydrogen reaction catalytic layer including a platinum film of platinum black formed on both sides of the first quartz vibrator; and a hydrogen non-reactive layer formed in the second quartz vibrator, wherein a hydrogen concentration is measured by measuring a temperature of the first quartz vibrator increasing by heat of combustion caused by oxidization of hydrogen by the hydrogen reaction catalytic layer as a change of a natural frequency of the first quartz vibrator with respect to a natural frequency of the second quartz vibrator.

Abstract: Provided is a current detection device that enables to eliminate the influence of vibration that is applied to a bus bar, which is configured as a shunt resistor and measures current with high accuracy and high reliability. The current detection device is provided with a first wiring member and a second wiring member consisting of a conductive metal material, and a resistor body consisting of a metal material having a lower temperature coefficient of resistance than those wiring members and is joined between the first wiring member and the second wiring member, wherein a connection portion for making a connection to another wiring member or device is formed at an end of the first wiring member and second wiring member, the end being an opposite side from a joint with the resistor body, and a fixing member is provided between the connection portion and the joint with the resistor body.

Abstract: To provide an image display device configured to more faithfully display a projection image on a region where a physical quantity change has occurred. An image display device of the present invention includes a flow rate sensor and a screen on which an image from a projector is projected, and a control is performed such that the image is projected on the screen so as to include a position of the flow rate sensor that has detected the physical quantity change, and the image changes corresponding to a measured value change of the flow rate sensor. Preferably, a plurality of the physical quantity detection units are disposed, and the control is performed such that the image changes corresponding to the measured value changes in the respective physical quantity detection units.

Abstract: A shunt resistor including a first terminal and a second terminal, each of the first terminal and the second terminal being made of a conductive metallic material and having a first plane, a second plane, and an outer periphery as side faces thereof. The first planes of the first terminal and the second terminal are opposite each other, and a resistive element is connected to the first planes so as to connect the first terminal and the second terminal. The joint area between the resistive element and each first plane is smaller than the area of the first plane. Each of the first terminal and the second terminal has formed therein a hole portion that penetrates therethrough from the first plane to the second plane.