Abstract: An electronic apparatus according to various embodiments of the present disclosure may include: a communication circuit that is communicatively connected to a solder printing apparatus and a measurement apparatus; one or more memories; and one or more processors. One or more processors may be configured to: acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first control parameter set to the solder printing apparatus; acquire first solder measurement information indicating a state of the solder printed on the first substrate; determine a first yield for the first substrate based on the first solder measurement information; and generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield.

Abstract: The apparatus according to various embodiments includes one or more processors, and one or more memories operatively connected to the one or more processors. The one or more memories may store instructions that, when executed, cause the one or more processors to acquire a plurality of first position offsets of a plurality of first components respectively mounted on a plurality of first substrates with respect to a plurality of pads of the plurality of first substrates corresponding to the plurality of first components from the optical measurement device, set a range of a normal state for a component position offset based on the plurality of first position offsets, generate a control signal for adjusting at least one control parameter of the component mounting device associated with a component mounting position based on the range of the normal state, and transmit the control signal to the component mounting device.

Abstract: A substrate inspection apparatus is disclosed. The substrate inspection apparatus includes: a first light source configured to radiate an ultraviolet light onto a coated film of a substrate, the coated film being mixed with fluorescent pigments; a first light detector configured to capture fluorescence generated from the coated film onto which the ultraviolet light is radiated, and to obtain a two-dimensional (2D) image of the substrate; a processor configured to derive one region among a plurality of regions of the substrate based on the 2D image; a second light source configured to radiate a laser light onto the one region; and a second light detector configured to obtain optical interference data generated from the one region by the laser light, wherein the processor is configured to derive a thickness of the coated film of the one region based on the optical interference data.

Abstract: A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.

Abstract: A substrate inspection apparatus generates, when anomalies of a plurality of second solder pastes among a plurality of first solder pastes printed on a first substrate is detected, at least one image indicating a plurality of second solder pastes with anomalies detected by using an image about a first substrate, applies the at least one image to a machine-learning-based model, acquires a plurality of first values indicating relevance of respective first fault types to the at least one image and a plurality of first images indicating regions associated with one of a plurality of first fault types, determines a plurality of second fault types, which are associated with the plurality of second solder pastes by using the plurality of first values and the plurality of first images, and determines at least one third solder paste, which is associated with the respective second fault types.

Abstract: The present disclosure proposes a detachable second apparatus coupled to a first apparatus that determines a first three-dimensional shape of an object and configured to determine an angle of an upper surface of the object. The second apparatus includes a first light source configured to sequentially irradiate first pattern lights having one phase range, a beam splitter and lenses configured to change optical paths of the first pattern lights so that a beam of light corresponding to a respective phase of the phase range spreads, and arrives at each point of a partial region of the upper surface of the object, a communication interface, and a first processor configured to obtain first information on first reflected lights generated by reflecting the first pattern lights from the partial region and determine the angle of the upper surface with respect to the reference plane based on the first information.

Abstract: The present disclosure relates to a medical microscope field. A stereo microscope connected to an optical coherence tomography (OCT) unit for forming a tomographic image of a target object includes an objective lens unit including a plurality of lenses each having an aperture of a predetermined size, a pair of first magnification lens units each including a plurality of lenses having a pair of magnification lens apertures positioned within the aperture of the objective lens unit, a second magnification lens unit including a plurality of lenses having an OCT aperture disposed separately from the pair of magnification lens aperture within the aperture of the objective lens unit, and a light delivery unit configured to receive light from the OCT unit and deliver the light to the second magnification lens unit and configured to deliver light received from the second magnification lens unit to the OCT unit.

Abstract: The present disclosure proposes an apparatus for determining a first three-dimensional shape of an object. The apparatus includes one or more first light sources configured to irradiate one or more first pattern lights to the object, a second light source configured to sequentially irradiate one or more second pattern lights having one phase range, a beam splitter and one or more lenses configured to change optical paths of the one or more second pattern lights, an image sensor configured to capture one or more first reflected lights and one or more second reflected lights, and a processor configured to determine the first three-dimensional shape of the object based on the one or more first reflected lights and the one or more second reflected lights.

Abstract: The present disclosure proposes an apparatus for determining a first three-dimensional shape of an object. The apparatus includes a first light source configured to irradiate first pattern lights to the object, first image sensors configured to capture first reflected lights generated by reflecting the first pattern lights from the object, a second light source configured to sequentially irradiate second pattern lights having one phase range, a beam splitter and lenses configured to change optical paths of the second pattern lights, a second image sensor configured to capture second reflected lights generated by reflecting the second pattern lights from the partial region, and a processor configured to determine the first three-dimensional shape of the object based on the first reflected lights and the second reflected lights.

Abstract: A method and a device for registering three-dimensional data are disclosed.

Abstract: An apparatus for inspecting components may include a processor for: determining exterior information of a first component mounted on a first printed circuit board; inspecting a mounting state of the first component by using inspection information of a second component having a first similarity value, when the first similarity value is higher than or equal to a preset reference similarity value, and updating the inspection information of the plurality of components by using the inspection information of the first component matched with the inspection information of the second component, when it is determined that the mounting state of the first component is good.

Abstract: A method of verifying a fault of an inspection unit, an inspection apparatus, and an inspection system are disclosed. The method according to the present disclosure includes: providing a verification reference body which is formed on a frame attached to an inspection system; placing the inspection unit on the verification reference body; obtaining image data of the verification reference body through the inspection unit; verifying a fault of the inspection unit by extracting a movement error and height error of the inspection unit from the image data; and generating a verification result indicating the fault of the inspection unit.

Abstract: The present disclosure provides an optical tracking system for tracking a location and a posture of a marker. The marker is attachable to a target and configured so that a pattern surface formed inside the marker is visible through an optical system formed in an aperture. The system includes a processor configured to determine the posture of the marker based on a first image in which a part of the pattern surface viewed through the aperture is captured at an infinite focal length, and to determine the location of the marker based on a second image and a third image in which outgoing lights emitted through the aperture in different directions are captured at a focal length shorter than the infinite focal length.

Abstract: An electronic apparatus including a display and one or more processor is disclosed. The one or more processor is configured to: divide a first error value of each of a plurality of first components with respect to a mounting position acquired through inspection of a plurality of substrates of a first type, into a plurality of error values, generate a graph of a tree structure including a plurality of nodes corresponding to the plurality of first components, component types of each of the plurality of first components and a plurality of components included in a mounter, adjust attributes of each of the plurality of nodes using the plurality of error values divided from the first error value of each of the plurality of first components, and display the graph in which the attributes of each of the plurality of nodes are adjusted, on the display.

Abstract: A computed tomography (CT) apparatus according to various embodiments may include a gantry including a first rotation device, a second rotation device and a third rotation device which have a ring shape, share an axis of rotation, and are rotatable independently of one another, a plurality of first light sources provided on the first rotation device at regular intervals and configured to emit X-rays to a subject, a plurality of second light sources provided on the second rotation device at regular intervals and configured to emit X-rays to the subject, a detector provided on a region of the third rotation device and configured to detect X-rays passing through the subject, and one or more processors.

Abstract: A computed tomography (CT) apparatus includes a gantry with a first rotation device and a second rotation device, a plurality of light sources configured to emit X-rays to a subject, a detector configured to detect X-rays passing through the subject, and one or more processors. The one or more processors may be configured to rotate the first rotation device in a first rotation direction by an angle of rotation determined based on a total number of the plurality of light sources, emit X-rays to the subject by using at least one of the plurality of light sources and detect X-rays passing through the subject during the rotation of the first rotation device in the first rotation direction, and rotate the first rotation device by the determined angle of rotation in a second rotation direction.

Abstract: An inspection apparatus may include: a structured-light source configured to sequentially radiate a plurality of structured lights having one phase range; a lens configured to adjust, for each of the plurality of structured lights, optical paths of light beams corresponding to phases of the phase range such that a light beam corresponding to one phase of the phase range arrives at each point of a partial region on an object; an image sensor configured to capture a plurality of reflected lights generated by the structured lights being reflected from the partial region; and a processor configured to acquire a light quantity value of the reflected lights; and derive an angle of the surface by deriving phase values of the reflected lights based on the light quantity value for the reflected lights.

Abstract: A method of verifying a fault of an inspection unit, an inspection apparatus, and an inspection system are disclosed. The method according to the present disclosure includes: providing a verification reference body which is formed on a frame attached to an inspection system; placing the inspection unit on the verification reference body; obtaining image data of the verification reference body through the inspection unit; verifying a fault of the inspection unit by extracting a movement error and height error of the inspection unit from the image data; and generating a verification result indicating the fault of the inspection unit.

Abstract: A stereotactic surgery robot according to the present disclosure may include: a rotating unit that is configured to have a surgical instrument that is able to be attached thereto, and is configured to rotate the surgical instrument on at least one of two rotational axes according to an entry posture of the surgical instrument; a moving unit that is configured to move the rotating unit in the direction of at least one of three linear axes according to the position of a surgical target; and a surgical portion support unit that is configured to be connected to the moving unit, and is configured to be detachable with respect to an operating table, wherein the moving unit may move the rotating unit such that an intersection point of the two rotational axes matches the surgical target.

Abstract: A method for determining a cause of a mounting failure for a component mounted on a substrate, which is performed by an electronic apparatus, comprises: receiving an inspection result of a mounting failure for each of a plurality of first components determined by inspecting a plurality of substrates of a first type; calculating a mounting failure rate of each of the plurality of first components using the inspection result; determining a plurality of second components in which a mounting failure has occurred based on the mounting failure rate; and determining a cause of the mounting failure for each of the plurality of second components as at least one of a component mounting position setting error, a mounting condition setting error according to a component type and a defect of a nozzle, based on the mounting failure rate of each of the plurality of first components.