Abstract: A biological tissue inspection apparatus is disclosed. The biological tissue inspection apparatus comprises a stage and a probe. The probe comprises an optical imaging device, an optical interference detector, and a light guide. The probe acquires data regarding optical images and optical interference, through the optical imaging device and the optical interference detector. The stage or the probe moves such that a selected area of the inspection object is positioned in the FOV of the optical imaging device and of the optical interference detector. The light guide is configured such that illumination light from the optical imaging device and measurement light from the optical interference detector are coaxially emitted to the inspection object.

Abstract: A substrate inspection apparatus is disclosed. The substrate inspection apparatus includes: a first light source configured to radiate an ultraviolet light onto a coated film of a substrate, the coated film being mixed with fluorescent pigments; a first light detector configured to capture fluorescence generated from the coated film onto which the ultraviolet light is radiated, and to obtain a two-dimensional (2D) image of the substrate; a processor configured to derive one region among a plurality of regions of the substrate based on the 2D image; a second light source configured to radiate a laser light onto the one region; and a second light detector configured to obtain optical interference data generated from the one region by the laser light, wherein the processor is configured to derive a thickness of the coated film of the one region based on the optical interference data.

Abstract: The present invention relates to an inspection apparatus and method, and a system and a method for mounting components including the same. In the system for mounting components according to the present invention, solder paste inspection equipment receives mounting tolerance information from component mounting equipment, generates warp information of a flexible array board by measuring the flexible array board, generates mount-impossible information on a region where mounting of components is impossible by comparing the mounting tolerance information and the warp information, and transmits the mount-impossible information to the component mounting equipment. The component mounting equipment mounts components on remaining regions except for the region where mounting of components is impossible based on the mount-impossible information.

Abstract: A patterned light irradiation apparatus is enclosed. The patterned light irradiation apparatus comprises a light source, a pattern grating, an aperture, wherein the pattern grating includes a striped shape in a form including repetition of a transmission part and a shielding part, and the aperture includes an opening having a sinusoidal wave-shaped cross section. When the patterned light irradiation apparatus irradiates patterned light to a subject, the patterned irradiation apparatus performs defocusing and thus can irradiate patterned light having an ideal sinusoidal form to the subject. Therefore, a three-dimensional image of high quality can be acquired.

Abstract: A tracking system and a tracking method using the same are disclosed. The tracking system includes a marker, a camera unit, a first inertial measuring unit, a second inertial measuring unit and a tracking processing unit. The marker is fixed on the measurement object, and the camera unit outputs a marker image by photographing the marker. The first inertial measuring unit is fixed on the camera unit, and measures and outputs first inertia comprising first accelerated velocity and first angular velocity. The second inertial measuring unit is fixed to one of the measurement object and the marker, and measures and outputs second inertia comprising second accelerated velocity and second angular velocity. The tracking processing unit primarily extracts the position and the posture of the measurement object using the marker image, and secondarily extracts the position and the posture of the measurement object using the first and second inertias.

Abstract: Disclosed are an inspection system and an inspection method of performing image processing on an outline of an inspection object according to whether the inspection object is good or defective, and overlapping and displaying the image-processed outline with reference information for determining whether the inspection object is good or defective. The inspection system includes: a data acquisition unit configured acquire an image of an inspection object by irradiate light on the inspection object; a processing unit configured to detect an outline of the inspection object based on the image data of the inspection object; and an output unit configured to overlap and display the outline with reference information, wherein the processing unit is configured to determine whether the outline is good or defective based on the reference information to perform image processing on the outline according to whether the outline is good or defective.

Abstract: A board inspecting apparatus include a measuring section, a processing section and a display section. The measuring section obtains measurement data for at least a portion of a board. The processing section compares the measurement data and reference data of the board, based on selection feature objects, by associated selection feature objects, to perform distortion compensation for the board, and inspects the board with distortion compensation. The display section distinguishably displays a first area with the distortion compensation successful and a second area with the distortion compensation failed. The processing section compares a number of recognizable effective feature objects with a reference number, and determine the distortion compensation as failed when the number of the recognizable effective feature objects is below the reference number.

Abstract: A three-dimensional shape measurement apparatus includes main pattern illumination parts, main image-capturing parts and a control part. The main pattern illumination parts obliquely illuminate grating pattern light in different directions toward a measurement target. The main image-capturing parts obtain a grating pattern image of the measurement target by receiving reflection light of the grating pattern light illuminated from the main pattern illumination parts and obliquely reflected by the measurement target. The control part produces height data of the measurement target using grating pattern images of the measurement target, or produces height data of the measurement target using image positions of plane images for the measurement target and texture information of the measurement target. The control part employs a grating pattern illuminated on the measurement target as the texture information to produce height data of the measurement target.

Abstract: There is provided a technique that includes: a camera configured to capture images of the target object; a memory configured to store the images of the target object and feature data including one or more predetermined exterior features of the target object; and a processor configured to: determine a first process configuration for an operation including a plurality of image processes; perform the operation under the first process configuration; generate inspection data from the sets of images that have been processed; generate an inspection score by comparing the inspection data with the feature data; compare the inspection score with a predetermined threshold score; set the first process configuration as an optimal configuration if the inspection score satisfies the predetermined threshold score.

Abstract: The present disclosure provides an optical tracking system for tracking a location and a posture of a marker. The marker is attachable to a target and configured so that a pattern surface formed inside the marker is visible through an optical system formed in an aperture. The system includes a processor configured to determine the posture of the marker based on a first image in which a part of the pattern surface viewed through the aperture is captured at an infinite focal length, and to determine the location of the marker based on a second image and a third image in which outgoing lights emitted through the aperture in different directions are captured at a focal length shorter than the infinite focal length.

Abstract: A biological tissue inspection apparatus is disclosed. The biological tissue inspection apparatus comprises a stage and a probe. The probe comprises an optical imaging device, an optical interference detector, and a light guide. The probe acquires data regarding optical images and optical interference, through the optical imaging device and the optical interference detector. The stage or the probe moves such that a selected area of the inspection object is positioned in the FOV of the optical imaging device and of the optical interference detector. The light guide is configured such that illumination light from the optical imaging device and measurement light from the optical interference detector are coaxially emitted to the inspection object.

Abstract: The present disclosure relates to a medical microscope field. A stereo microscope connected to an optical coherence tomography (OCT) unit for forming a tomographic image of a target object includes an objective lens unit including a plurality of lenses each having an aperture of a predetermined size, a pair of first magnification lens units each including a plurality of lenses having a pair of magnification lens apertures positioned within the aperture of the objective lens unit, a second magnification lens unit including a plurality of lenses having an OCT aperture disposed separately from the pair of magnification lens aperture within the aperture of the objective lens unit, and a light delivery unit configured to receive light from the OCT unit and deliver the light to the second magnification lens unit and configured to deliver light received from the second magnification lens unit to the OCT unit.

Abstract: A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.

Abstract: A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.

Abstract: An item inspection apparatus includes an image obtaining section and a control section. The image obtaining section obtains a captured image of at least a part of an item. The control section determines whether the item is defective by using the captured image of the item. The control section performs a first inspection for at least one of position, shape and size with respect to at least one of a first element and a second element. The first element has a predetermined shape and is formed on the item and the second element includes at least one of an opening, a depression and a through-hole formed in the item. The control section performs a second inspection for at least one of foreign substance adhesion, scratch and surface stain on the item. Thus, the defect inspection may be performed more precisely and effectively.

Abstract: To inspect a board, first, a measurement area is set on the board and a reference data of the measurement area is obtained. Then, a measurement data of the measurement area is obtained per colors, and a lighting condition is set using the reference data of the measurement area and the measurement data obtained per colors. Next, a feature object in the measurement area is set, and a distortion quantity between the reference data and the measurement data is obtained by comparing the reference data corresponding to the feature object and the measurement data corresponding to the feature object obtained under the lighting condition. Then, an inspection area is set by compensating the distortion quantity. Therefore, it is possible to compensate the distortion and set precisely the inspection area.

Abstract: In order to inspect a substrate, an image information of a substrate before applying solder is displayed. Then, at least one inspection region on the substrate is image-captured to obtain an image of the inspection region that is image-captured. Then, image information that is to be displayed is renewed and the renewed image information is displayed. And, in order to inspect a foreign substance, obtained image of the inspection region is compared with a reference image of the substrate. Therefore, an operator can easily catch a region corresponding to a specific region of the image that is displayed, and easily detect a foreign substance on the substrate.

Abstract: The present disclosure provides an optical tracking system for tracking a location and a posture of a marker. The marker is attachable to a target and configured so that a pattern surface formed inside the marker is visible through an optical system formed in an aperture. The system includes a processor configured to determine the posture of the marker based on a first image in which a part of the pattern surface viewed through the aperture is captured at an infinite focal length, and to determine the location of the marker based on a second image and a third image in which outgoing lights emitted through the aperture in different directions are captured at a focal length shorter than the infinite focal length.

Abstract: A printed circuit board inspection apparatus obtains measurement shape information about each of a plurality of solder pastes printed on a first printed circuit board through a plurality of apertures and aperture shape information about each of the plurality of apertures, obtains probability values that a first solder paste printed through a first aperture of the plurality of apertures and each of a plurality of second solder pastes printed through second apertures other than the first aperture of the plurality of apertures have the measurement shape information when the first solder paste and the plurality of second solder pastes are printed on the first printed circuit board, by applying the measurement shape information and the aperture shape information to a machine-learning based model, and detects whether an anomaly in the first solder paste occurred based on the probability values.

Abstract: A printed circuit board inspection apparatus generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.