Abstract: A method of producing a solder material is provided. The method includes mixing a flux containing a solvent, a rosin-based resin, and an activator, with aggregated cellulose. The aggregated cellulose includes massive cellulose in which fibrous cellulose having a length of from 1 ?m or more to less than 1 mm, and fibrous cellulose having a length of from 1 nm or more to less than 1 ?m. The resulting mixture is mixed with a solder alloy to produce a solder material.

Abstract: An aggregated cellulose is provided that includes massive cellulose and fibrous cellulose mixed together. The massive cellulose is fibrous and has a length of from 1 ?m or more to less than 1 mm. The fibrous cellulose has a length of from 1 nm or more to less than 1 ?m. The aggregated cellulose can contain from 400 ppm or more to 10,000 ppm or less of the massive cellulose. The aggregated cellulose can contain a solvent, a rosin-based resin, and an activator.

Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.

Abstract: A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.

Abstract: A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.

Abstract: A flux according to the present invention is a halogen-free flux used for soldering that includes: a thixotropic agent a polyamide compound in which one endothermic peak or all of endothermic peaks obtained by differential thermal analysis are observed within a range of 130 to 200° C.; and an activator comprising an isocyanuric acid derivative, in which a content of the isocyanuric acid derivative is 5.0 mass % or less based on the entire flux.

Abstract: A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.

Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.

Abstract: A solder alloy is used for soldering, and its chemical composition in mass % includes: 2.0 to 4.0% of Ag; 0.6 to 1.2% of Cu; 2.0 to 5.0% of Sb; 1.1 to 3.5% of In; 0 to 0.20% of Ni; 0 to 0.20% of Co; 0 to 0.05% of Ge; and balance of Sn, and impurities.

Abstract: A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.

Abstract: Provided is a solder composition including a flux, a solder alloy, and a silicone oil. The solder composition can have a kinematic viscosity at 25° C. of 5000 mm2/s or more and 200,000 mm2/s or less. The silicone oil can be at least one member selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, methylhydrogen silicone oil, reactive silicone oil, and non-reactive silicone oil.

Abstract: A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure P1 lower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P2 lower than the first pressure P1.

Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.

Abstract: Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.

Abstract: A flux containing terpene phenolic resin and having an acid value of 120 mgKOH/g or more is provided. The acid value can be 250 mgKOH/g or less. The terpene phenolic resin can be contained by 0.05 mass % or more and 30 mass % or less. The flux can contain the terpene phenolic resin and another resin component as a rosin component, and an amount of the terpene phenolic resin contained in the rosin component can be 0.1 mass % or more and 80 mass % or less.

Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.

Abstract: Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.

Abstract: Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.

Abstract: It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration. Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.

Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.