Patents Assigned to KOKI COMPANY LIMITED
  • Publication number: 20230103270
    Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
    Type: Application
    Filed: April 27, 2019
    Publication date: March 30, 2023
    Applicant: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Noriyoshi Uchida
  • Patent number: 11607752
    Abstract: A solder alloy is used for soldering, and its chemical composition in mass % includes: 2.0 to 4.0% of Ag; 0.6 to 1.2% of Cu; 2.0 to 5.0% of Sb; 1.1 to 3.5% of In; 0 to 0.20% of Ni; 0 to 0.20% of Co; 0 to 0.05% of Ge; and balance of Sn, and impurities.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: March 21, 2023
    Assignee: KOKI Company Limited
    Inventor: Takehiro Wada
  • Patent number: 11541485
    Abstract: A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: January 3, 2023
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Motohide Sasaki
  • Patent number: 11517985
    Abstract: Provided is a solder composition including a flux, a solder alloy, and a silicone oil. The solder composition can have a kinematic viscosity at 25° C. of 5000 mm2/s or more and 200,000 mm2/s or less. The silicone oil can be at least one member selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, methylhydrogen silicone oil, reactive silicone oil, and non-reactive silicone oil.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: December 6, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Noriyoshi Uchida, Duck-Soo Jang, Ju-Heung Kim, Ho-Won Seok
  • Patent number: 11447626
    Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: September 20, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Takeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
  • Patent number: 11446752
    Abstract: A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure P1 lower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P2 lower than the first pressure P1.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: September 20, 2022
    Assignee: KOKI Company Limited
    Inventors: Satoshi Ootani, Mitsuyasu Furusawa
  • Patent number: 11425825
    Abstract: Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: August 23, 2022
    Assignee: KOKI Company Limited
    Inventors: Yuki Yamamoto, Satoshi Ootani, Mitsuyasu Furusawa
  • Patent number: 11407069
    Abstract: A flux containing terpene phenolic resin and having an acid value of 120 mgKOH/g or more is provided. The acid value can be 250 mgKOH/g or less. The terpene phenolic resin can be contained by 0.05 mass % or more and 30 mass % or less. The flux can contain the terpene phenolic resin and another resin component as a rosin component, and an amount of the terpene phenolic resin contained in the rosin component can be 0.1 mass % or more and 80 mass % or less.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: August 9, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Yuri Misumi, Takeshi Yahagi, Motohide Sasaki, Tatsuya Baba, Kazuma Karube
  • Publication number: 20210086317
    Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
    Type: Application
    Filed: April 27, 2019
    Publication date: March 25, 2021
    Applicant: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Noriyoshi Uchida
  • Patent number: 10933495
    Abstract: Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: March 2, 2021
    Assignee: KOKI COMPANY LIMITED
    Inventors: Motohide Sasaki, Takeshi Yahagi, Noriyoshi Uchida
  • Patent number: 10888960
    Abstract: Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 12, 2021
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Mitsuyasu Furusawa, Kimiaki Mori
  • Patent number: 10864606
    Abstract: It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration. Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: December 15, 2020
    Assignee: KOKI COMPANY LIMITED
    Inventor: Noriyoshi Uchida
  • Publication number: 20200325326
    Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
    Type: Application
    Filed: November 1, 2018
    Publication date: October 15, 2020
    Applicant: KOKI COMPANY LIMITED
    Inventors: Takeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
  • Patent number: 10702956
    Abstract: Provided is a flux activator containing a halogen compound represented by formula 1 below: where X1 and X2 represent different halogen atoms, R1 and R2 are each a group represented by any one of formulas —OH, —O—R3, —O—C(?O)—R4, and —O—C(?O)—NH—R5, R1 and R2 optionally represent the same group or different groups, R3, R4, and R5 are each an aromatic hydrocarbon group having 1 to 18 carbon atoms or an aliphatic hydrocarbon group having 1 to 18 carbon atoms, and R3, R4, and R5 optionally represent the same group or different groups.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: July 7, 2020
    Assignee: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Yuusuke Sato, Junichi Aoki, Mitsuyasu Furusawa, Kimiaki Mori
  • Publication number: 20200187363
    Abstract: A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.
    Type: Application
    Filed: October 2, 2017
    Publication date: June 11, 2020
    Applicant: KOKI Company Limited
    Inventor: Mitsuyasu FURUSAWA
  • Patent number: 10610981
    Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: April 7, 2020
    Assignees: ORIGIN COMPANY, LIMITED, KOKI COMPANY LIMITED
    Inventors: Yukiko Hayashi, Arisa Shiraishi, Naoto Ozawa, Takayuki Suzuki, Takeshi Shirai, Noriyoshi Uchida, Mitsuyasu Furusawa
  • Patent number: 9764430
    Abstract: Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: September 19, 2017
    Assignee: KOKI Company Limited
    Inventors: Atsushi Irisawa, Rie Wada
  • Patent number: 9609762
    Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: March 28, 2017
    Assignee: KOKI Company Limited
    Inventors: Kenji Arai, Mitsuyasu Furusawa, Junichi Aoki, Mayumi Takada, Munehiko Nakatsuma
  • Patent number: 9421646
    Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at ?40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at ?40° C. to 150° C. is obtained.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: August 23, 2016
    Assignees: KOKI COMPANY LIMITED, PANASONIC CORPORATION
    Inventors: Atsushi Irisawa, Masashi Kashiwabara, Kenji Kondo, Masahito Hidaka
  • Publication number: 20130186519
    Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at ?40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at ?40° C. to 150° C. is obtained.
    Type: Application
    Filed: March 9, 2011
    Publication date: July 25, 2013
    Applicants: PANASONIC CORPORATION, KOKI COMPANY LIMITED
    Inventors: Atsushi Irisawa, Masashi Kashiwabara, Kenji Kondo, Masahito Hidaka