Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.

Abstract: Provided is a flux activator containing a halogen compound represented by formula 1 below: where X1 and X2 represent different halogen atoms, R1 and R2 are each a group represented by any one of formulas —OH, —O—R3, —O—C(?O)—R4, and —O—C(?O)—NH—R5, R1 and R2 optionally represent the same group or different groups, R3, R4, and R5 are each an aromatic hydrocarbon group having 1 to 18 carbon atoms or an aliphatic hydrocarbon group having 1 to 18 carbon atoms, and R3, R4, and R5 optionally represent the same group or different groups.

Abstract: A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.

Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

Abstract: Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.

Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.

Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at ?40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at ?40° C. to 150° C. is obtained.

Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at ?40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at ?40° C. to 150° C. is obtained.

Abstract: A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.

Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.

Abstract: [PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material. [MEANS FOR SOLVING] 0.1 to 1.5% by weight of Cu, 0.01% by weight or more and less than 0.05% by weight of Co, 0.05 to 0.25% by weight of Ag, 0.001 to 0.008% by weight of Ge, and the remainder being Sn. This low silver lead-free solder alloy is blended with a pasty flux or molded in a liner form by using a solid or pasty flux as a core. [SELECTED FIGURE] FIG.

Abstract: The present invention is a wheel conveyor comprising side frames, plate-shaped stays provided with wheel unit attachment grooves at an upper surface, and wheel units having fixed projections capable of being inserted into the wheel unit attachment grooves provided on an upper surface of the plate-shaped stays, the wheel units comprising two wheel attachment bodies, and a wheel rotatably provided between the two wheel attachment bodies, wherein, on plate-shaped stays provided spanning in a longitudinal direction across the side frames, one or a plurality of wheel units are detatchably attached in a line arrangement in a longitudinal direction of the side frames, and one or a plurality are detatchably attached in a line or interleaved arrangement in a widthwise direction.

Abstract: In a factory that uses a large number of containers, it is necessary to ensure an installation location for a container washing device that is absolutely necessary as a preprocess for a container drying device. A container washing and centrifugal drying device has an exterior section having a door section, and having a container washing and centrifugal drying unit that comprises a turntable on which tacked containers are placed inside the exterior section, each of two columns erected at opposing position the same distance from the rotational center of the turntable on an upper part of the turntable, a clamp opening and closing cylinder for opening and closing clamp sections, and a plurality of washing tubes provided in a vertical direction at substantially equal intervals in a circumferential direction on the outer periphery spaced apart from the turntable, each of the washing tubes being provided with a plurality of washing nozzles at equal intervals in the vertical direction facing inwards.

Abstract: To simplify repair and maintenance of a link conveyor and link section by providing a link conveyor that can be freely attached and detached to a link section of a drive conveyor.

Abstract: The present invention is a wheel conveyor comprising side frames, plate-shaped stays provided with wheel unit attachment grooves at an upper surface, and wheel units having fixed projections capable of being inserted into the wheel unit attachment grooves provided on an upper surface of the plate-shaped stays, the wheel units comprising two wheel attachment bodies, and a wheel rotatably provided between the two wheel attachment bodies, wherein, on plate-shaped stays provided spanning in a longitudinal direction across the side frames, one or a plurality of wheel units are detatchably attached in a line arrangement in a longitudinal direction of the side frames, and one or a plurality are detatchably attached in a line or interleaved arrangement in a widthwise direction.

Abstract: Two guide members cooperatively constitute a chuck portion for holding a screw head. Opening and closing of the chuck portion is regulated depending on a mutual position between a machine body and a member into which a screw is driven. Guide pin portions of respective guide members engage with a stopper portion of a push lever until a screw is driven to a predetermined depth. The chuck potion tightly holds the screw head until a screw fastening operation is substantially finished, thereby suppressing the lifting of a machine body.

Abstract: In a conventional container centrifugal drying device, a problem exists in that a member is easily corroded by a detergent in use for a long period, and a rotating portion is heavy in weight so that energy at accelerating and decelerating times is large.

Abstract: In an image forming apparatus, the developing unit includes two developing rollers whose rotational directions are different from each other, and a bias potential of the developing roller (first developing roller) located upstream in the rotational direction of the photosensitive member is selected to be a potential, which is in value between a bias potential of the developing roller (second developing roller) located downstream in the same direction and a background potential.

Abstract: There are disposed optical sensors (S1, S2, S3,S4, S5, and S6) outside sheet trays (1, 2, 3). The optical axes of the optical sensors are respectively set in such a manner that they are parallel to their associated up-down tables (1a, 2a, and 3a) and pass upwardly of contact positions (A, B and C) between sheets (P) and sheet supply rollers (20, 21, and 22).