Patents Assigned to Kollmorgen Technologies Corporation
  • Process for the catalytic sensitization of non-metallic surfaces for subsequent electroless metallization
    Patent number: 4020197
    Abstract: The present invention provides copper (I) ion compound bath solutions for the catalytic sensitization and metallization by electroless metal deposition of non-metallic surfaces, as well as processes for the application and re-claiming of said solutions.
    Type: Grant
    Filed: February 5, 1975
    Date of Patent: April 26, 1977
    Assignee: Kollmorgen Technologies Corporation
    Inventor: Horst Steffen