Patents Assigned to Konishi Co., Ltd.
  • Patent number: 6908654
    Abstract: A laminate with a peelable top layer is provided. The laminate comprises a substrate such as a porous board, the top layer such as a plastic top layer or a decorated metal plate, and a bonding layer between the top layer and the substrate. At least one of the substrate and the top layer is porous. An adhesive for forming the bonding layer comprises (A) an aqueous dispersion containing a polymer, which demonstrates properties that a dried film of the aqueous dispersion has a tensile strength of 1 to 28 MPa and a percentage elongation of 100 to 2000%, and (B) a water-based adhesive composition containing microspheres with thermal expansion capability, each of which is composed of a polymer shell encapsulating a gas. By use of this adhesive, the bonding layer provides a high bonding strength between the top layer and the substrate. When irradiating the laminate with ultraviolet or far infrared, while heating, the top layer can be easily peeled off from the laminate.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: June 21, 2005
    Assignees: Matsushita Electric Works, Ltd., Konishi Co., Ltd.
    Inventors: Hiroyuki Ishikawa, Sumiya Shimotsuma, Shinichiro Matsushita, Keiichi Hamada
  • Publication number: 20050003131
    Abstract: A laminate with a peelable top layer is provided. The laminate comprises a substrate such as a porous board, the top layer such as a plastic top layer or a decorated metal plate, and a bonding layer between the top layer and the substrate. At least one of the substrate and the top layer is porous. An adhesive for forming the bonding layer comprises (A) an aqueous dispersion containing a polymer, which demonstrates properties that a dried film of the aqueous dispersion has a tensile strength of 1 to 28 MPa and a percentage elongation of 100 to 2000%, and (B) a water-based adhesive composition containing microspheres with thermal expansion capability, each of which is composed of a polymer shell encapsulating a gas. By use of this adhesive, the bonding layer provides a high bonding strength between the top layer and the substrate. When irradiating the laminate with ultraviolet or far infrared, while heating, the top layer can be easily peeled off from the laminate.
    Type: Application
    Filed: July 8, 2004
    Publication date: January 6, 2005
    Applicants: Matsushita Electric Works, Ltd., Konishi Co., Ltd.
    Inventors: Hiroyuki Ishikawa, Sumiya Shimotsuma, Shinichiro Matsushita, Keiichi Hamada
  • Patent number: 6495628
    Abstract: A process of the invention produces a vinyl acetate polymer based emulsion by seed polymerization of vinyl acetate in an ethylene-vinyl acetate copolymer based emulsion. This process includes a step of performing seed polymerization while adding vinyl acetate to a system, and, prior to or subsequent to the step, a step of adding a polymerizable unsaturated monomer other than vinyl acetate to the system. The amount of the polymerizable unsaturated monomer other than vinyl acetate is, for example, about 0.05 to 10 parts by weight relative to 100 parts by weight of vinyl acetate. At least one monomer selected from acrylic esters, methacrylic esters, vinyl esters, and vinyl ethers can be used as the polymerizable unsaturated monomer other than vinyl acetate.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: December 17, 2002
    Assignee: Konishi Co. Ltd.
    Inventors: Toshiki Origuchi, Shintaro Ogawa
  • Patent number: 5977242
    Abstract: Disclosed is a two-part adhesive comprising: (A) an aqueous emulsion liquid having a polymer component and an emulsifier component, in which at least one of the polymer component and the emulsifier component contains an anion radical; and (B) a solution having an amino-radical-containing acrylic copolymer. The amount of the polymer component in the aqueous emulsion liquid is within a range of from about 20% to about 80% by weight. When the aqueous emulsion liquid (A) contacts the solution (B) on an adherend surface, they form sticky gel adhesive.
    Type: Grant
    Filed: November 27, 1996
    Date of Patent: November 2, 1999
    Assignee: Konishi Co., Ltd.
    Inventors: Toshiki Origuchi, Yukiharu Hayashi
  • Patent number: 5889079
    Abstract: An antislipping composition for a fastener having a head portion, comprising a crosslinked polymer prepared by the polymerization of an olefinic unsaturated carboxylic acid and a compound represented by a general formula (1) given below ##STR1## where R is a hydrogen atom or a methyl group, and the sum of 1, m and n is larger than 0 and not larger than 500, except that where R is a hydrogen atom and n is zero, l+m is not 1, a liquid medium containing at least one compound selected from the group consisting of glycol ethers and glycerin, and silicon carbide particles having acute corner portions.
    Type: Grant
    Filed: November 21, 1997
    Date of Patent: March 30, 1999
    Assignee: Konishi Co., Ltd.
    Inventors: Kenji Idemoto, Shigeru Nagasawa, Kenji Ueji, Kunihiko Asano, Toshiyuki Uenoyama
  • Patent number: 5753727
    Abstract: Disclosed is a chloropren rubber adhesive composition. The adhesive composition contains a chloroprene rubber; a tackifier resin; a chlorinated polyolefin; a solvent; and a component which is selected from the group consisting of components (A) and (B). The component (A) is combination of an epoxy resin and a curing agent, and the curing agent is selected from dicyandiamide, imidazole, imidazole derivative, onium compound, ketimine compound represented by the formula (I) or a ketimine derivative. The component (B) is a silane compound having at least two reactive groups, and the reactive group is selected from an epoxy group, a vinyl group, a hydroxy group, an acryloxy group, a methacryloxy group and alkoxy groups.
    Type: Grant
    Filed: March 18, 1996
    Date of Patent: May 19, 1998
    Assignee: Konishi Co., Ltd.
    Inventors: Shinichi Sato, Kunihiro Onishi, Kazuya Fujimoto
  • Patent number: 5681891
    Abstract: A method for producing a polychloroprene latex, which comprises copolymerizing chloroprene and an ethylenically unsaturated carboxylic acid in the presence of a polyvinyl alcohol, wherein a glycol ether is also present during the copolymerization.
    Type: Grant
    Filed: January 19, 1996
    Date of Patent: October 28, 1997
    Assignees: Denki Kagaku Kogyo Kabushiki Kaisha, Konishi Co., Ltd.
    Inventors: Mikitoshi Satoh, Masao Koga, Shigeru Nagasawa, Kunihiko Asano, Toshiyuki Uenoyama, Kunihiro Onishi
  • Patent number: 5661205
    Abstract: A method for producing a polychloroprene latex, which comprises copolymerizing chloroprene and an ethylenically unsaturated carboxylic acid in the presence of a polyvinyl alcohol, wherein a glycol ether is also present during the copolymerization.
    Type: Grant
    Filed: January 18, 1996
    Date of Patent: August 26, 1997
    Assignees: Denki Kagaku Kogyo Kabushiki Kaisha, Konishi Co., Ltd.
    Inventors: Mikitoshi Satoh, Masao Koga, Shigeru Nagasawa, Kunihiko Asano, Toshiyuki Uenoyama, Kunihiro Onishi
  • Patent number: 5612433
    Abstract: Disclosed is a water repellent for fibers, comprising an acryl-silicone graft copolymer which is prepared by a radical copolymerization reaction of an organopolysiloxane compound containing one radical polymerizable group with radical polymerizable monomers including an acrylate, a methacrylate or a mixture thereof as a main member.
    Type: Grant
    Filed: November 14, 1995
    Date of Patent: March 18, 1997
    Assignees: Shin-Etsu Chemical Co., Ltd., Konishi Co., Ltd.
    Inventors: Ichiro Ono, Kenichi Isobe, Hironori Tsukada, Kenji Ueji, Masakazu Komemushi
  • Patent number: 5411345
    Abstract: Disclosed is a felt-tipped pen type adhesive applier comprising: a container for adhesive; valve mechanism provided on the container for controllably supplying the adhesive from the container; and a server for receiving the adhesive supplied through the valve mechanism in order to serve the adhesive. The server comprises: a holder covering the outside of the valve mechanism; a member permeable to the adhesive and extending from the inside of the holder to the outside thereof and being axially slidably and fittingly supported by the holder, the permeable member cooperating with the valve mechanism to operate the valve mechanism in response to axial movement of the permeable member; a support for slidably and fittingly supporting the permeable member inside of the holder to facilitate transportation of the adhesive from the valve mechanism to the permeable member; and mechanism for preventing the adhesive from leaking out of the server due to pressure change inside the server.
    Type: Grant
    Filed: October 28, 1993
    Date of Patent: May 2, 1995
    Assignee: Konishi Co., Ltd.
    Inventors: Kenji Ueji, Kiichi Ito, Masakazu Komemushi
  • Patent number: 5310830
    Abstract: Disclosed is a heat-resistant resin composition prepared by mixing a resin composition (A) and polyamine (B), followed by heating the mixture for the hardening, said composition (A) being prepared by heating a mixture of (a) polymaleimide resin represented by a general formula: ##STR1## where R.sub.1 is an organic group having a valency of n, Xa and Xb are the same or different monovalent atoms or groups selected from the group consisting of hydrogen atom, halogen atom and organic group, and n is an integer of 1 to 4, (b) an epoxy resin having at least two epoxy groups in the molecule, and (c) a compound having one alcoholic or phenolic OH group and at least one epoxy group in the molecule.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: May 10, 1994
    Assignee: Konishi Co., Ltd.
    Inventors: Toshinao Okitsu, Shinichi Sato
  • Patent number: 5108011
    Abstract: An adhesive injector has a piston inserted in a cylinder which is forwardly movable therein by a compressive force, the cylinder having a nozzle projecting from a front end portion thereof. The injector includes: a pair of holes defined adjacent each other in a rear end portion of the cylinder, a slit formed in the cylinder between the holes, a pin insertable through the holes, and cutout portions formed in the piston for engagement with the pin.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: April 28, 1992
    Assignees: Konishi Co., Ltd., Sunkit Co., Ltd.
    Inventors: Toshikatsu Kobayashi, Makoto Kita, Tsutom Matsuo, Yoji Tokuda, Hidehiro Fujioka
  • Patent number: 4963611
    Abstract: Vinyl acetate resin emulsion composition produced by the addition of a water soluble compound having alcoholic OH group during emulsion-polymerization or emulsion-copolymerization reaction to vinyl acetate resin emulsion which is obtained by emulsion-polymerization or emulsion-copolymerization of vinyl acetate under the presence of polyvinyl alcohol.
    Type: Grant
    Filed: January 9, 1990
    Date of Patent: October 16, 1990
    Assignee: Konishi Co., Ltd.
    Inventors: Shigeru Nagasawa, Hisao Noziri, Yoshizumi Nakai, Yasuaki Araki, Eizo Sakamoto, Masao Yagasaki, Mutsumi Kozima
  • Patent number: 4861401
    Abstract: A method of injecting adhesives (7) into cracks (2) of structures (1) for sealing the cracks, involves affixing injection pipes (4) on non-sealed surface portions of the structures at the cracks and connecting an adhesives injection device (10) to each one of the injection pipes. The injection devices are comprised of transparent cylinders having scales thereon graduated toward injection, nozzles (17) thereof, and of pistons (13) which can move linearly in both directions in the cylinders. The nozzles are respectively connected to the injection pipes after adhesives are drawn into the cylinders, and the pistons are moved toward the nozzles by compression, or pushing pressure, of rubber or springs to inject the adhesives into the cracks.
    Type: Grant
    Filed: December 15, 1987
    Date of Patent: August 29, 1989
    Assignees: Konishi Co., Ltd., Sunkit Co., Ltd.
    Inventors: Ryuichi Miura, Toshinobu Nakao
  • Patent number: 4431757
    Abstract: The invention provides an adhesive composition of the two-part separate application type comprising solutions A and B. The solution A is an aqueous solution of a high polymer having an amide bond or an imide bond within the molecule, or an aqueous dispersion obtained by adding a rubber latex and/or synthetic resin emulsion to the aqueous solution of the high polymer. The solution B is an aqueous solution of a dialdehyde compound, or an aqueous solution or dispersion obtained by adding a crosslinking agent for crosslinking the high polymer of the solution A to the aqueous solution of the dialdehyde compound.
    Type: Grant
    Filed: July 19, 1982
    Date of Patent: February 14, 1984
    Assignee: Konishi Co., Ltd.
    Inventors: Toshinao Okitsu, Tomio Uchida
  • Patent number: 4075830
    Abstract: An adhesive composition which is in a wax-like or jelly-like state at room temperature comprising:(a) a water soluble or water dispersible polymer having adhesive properties;(b) an N-fatty acid acylated amino acid or a salt thereof; and(c) water or a mixture of water and one or more organic solvent(s) and/or plasticizer(s).
    Type: Grant
    Filed: April 26, 1976
    Date of Patent: February 28, 1978
    Assignee: Konishi Co., Ltd.
    Inventors: Shigeru Nagasawa, Toshinao Okitsu
  • Patent number: 4073756
    Abstract: An adhesive composition which is in a wax-like or jelly-like state at room temperature comprising:(a) an N-fatty acid acylated amino acid or an alkali metal salt, ammonium salt or amine salt of the acid;(b) a compound having in its molecule a polyoxyalkylene structure containing at least four oxyalkylene units;(c) a water soluble or water dispersible polymer having adhesive properties; and(d) water or a mixture of water and one or more organic solvent(s) and/or one or more plasticizer(s).
    Type: Grant
    Filed: April 26, 1976
    Date of Patent: February 14, 1978
    Assignee: Konishi Co., Ltd.
    Inventors: Yoshihiko Yotsuyanagi, Naganori Araki, Shigeru Nagasawa, Toshinao Okitsu