Abstract: Method and apparatus for supplying a protective cover gas during ball formation on a wire bonding machine to permit the use of wire formed from metals which may react with air, such as copper or aluminum.

Abstract: A method and apparatus for monitoring the presence of a bonding wire in a wire bonding machine. The apparatus generates an AC signal which is coupled to the bonding tool. A sensor senses a current of the AC signal flowing to the bonding tool and a current of the AC signal returned from the bonding tool. The current flows are compared to one another to determine the presence or absence of the bonding wire in the bonding tool.

Abstract: A bond head for use with a bonding machine. The bond head has an arm assembly; and a linkage coupled between the arm assembly and the frame of the bonding machine. The linkage forms a virtual pivot point below a lower surface of the arm assembly.

Abstract: A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a sensor for determining a speed of a blade of the dicing saw. A monitor determines a load placed on the blade by the substrate, where the monitor measures at least one of a feedback control current and a feedback control voltage output from the dicing saw. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.

Abstract: Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns at the first positions can match with a reference pattern at the first positions. Then, the two imaging equipment are moved to positions for imaging patterns at second positions at the outer circumference of the wafer to image the patterns at the second positions. The controller drives the drive mechanisms to align the wafer in such a way that current image patterns at the second positions can match with a reference pattern at the second positions.

Abstract: A method of assembling a plurality of semiconductor chips is provided. A portion of a semiconductor wafer containing the plurality of chips is provided. Each of the plurality of chips has a contact pattern area including a pattern of contacts on a surface of the chip. A respective section of a dielectric interposer is assembled to each respective one of the plurality of chips individually, without detaching the plurality of chips from the portion of the semiconductor wafer. Each section of interposer has a plurality of bonding pads near an outer periphery of the section, so that each bonding pad lies near the contact pattern area of the corresponding one of the plurality of chips. Each bonding pad is wire bonded to a respective one of the contacts on the front surface of the corresponding one of the plurality of chips.

Abstract: A bonding tool for use with an ultrasonic horn comprising an orifice at a first end of the ultrasonic horn and a capillary having a first tapered end coupled, the first tapered end to the orifice of the ultrasonic horn.

Abstract: A method and apparatus for making small ball size ratio air balls for use with fine pitch bonding tools includes programming an automatic wire bonder to make a predetermined diameter ball on a fine wire. The predetermined ball size, the diameter of the wire to be used is entered as input data in the wire bonder which makes a calculation of the time required to melt the volume of a fine wire tail necessary to create a spherical ball of predetermined size. The free end of the wire tail to be melted is positioned above an aperture in an EFO electrode wand. A predetermined current is applied across the gap between the aperture in the EFO wand to generate a ball on the end of the wire tail. If the ball size deviates from the preselected ball size, the ball may be increased or decreased by an incremental percentage to effect even greater ball size accuracy. Further, the spring force in the wire loop may be adjusted and/or controlled while maintaining the preselected ball size.

Abstract: A method and apparatus for monitoring the presence of a bonding wire in a wire bonding machine. The apparatus generates an AC signal which is coupled to the bonding tool. A sensor senses a current of the AC signal flowing to the bonding tool and a current of the AC signal returned from the bonding tool. The current flows are compared to one another to determine the presence or absence of the bonding wire in the bonding tool.

Abstract: A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a spindle motor with a blade attached to the spindle motor. A spindle driver is coupled the spindle to drive the spindle at a predetermined rotation rate. A sensor is connected to the spindle motor to determine the rotation rate of the spindle. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.

Abstract: The present invention relates to post manufacturing operations for improving the working life of known bonding tools such as capillaries, wedges and single point TAB tools of the type used in the semiconductor industry to make fine wire or TAB finger interconnections. After the desired bonding tool is manufactured to predetermined specifications, dimensions and tolerances, it is placed in a sputtering chamber with hard target material with an ionizing gas. A controlled volume of sputtered hard material is generated at high temperature by plasma ion bombardment and deposited onto the working face of the bonding tool while the tool is held at a temperature that prevents distortion. A very thin amorphous hard layer is bonded onto the working face of the bonding tool which increases the working life of most tools by an order of magnitude and there is no requirement for additional processing.

Abstract: An ultra low mass wire clamp for operating at a very high speed where acceleration and deceleration forces exceeding thirty times the forces of gravity includes a wire clamp body portion having a machined recess therein for mounting a first fixed jaw in an exact reference position. A cantilever arm connected to and extending from the body portion has a second machine recess therein for receiving and mounting a second movable jaw in an exact position juxtaposed the fixed jaw so that the faces of the jaws are in exact parallel when mounted in their respective recesses. There is further provided an adjustment screw which engages the movable jaw or the movable actuator so as to adjust the fail safe zero voltage clamping force between jaws which is designed to maintain a clamping force on a wire under power failure conditions.

Abstract: A novel low mass transducer for bonding machines comprises a transducer generator which mounts on or is coupled to a bonding tool of the type used for ball bonding, wedge bonding and TAB bonding. The preferred embodiment transducer comprises a magnetostrictive or piezoelectric element which mount on the outside surface of the bonding tools used in a bonding operation, thus eliminating convention transducers which also serve as a bonding tool holder. The present invention bonding tool serves as the base or mount for a transducer made in the form of a sleeve or tube which mounts on or couples to the bonding tool. The novel transducer/bonding tool or transducers also serve as a sensor which can monitor the quality of a bond while it is being made.

Abstract: The present invention includes a multi-frequency ultrasonic generator coupled to a multi-resonance frequency transducer capable of operating at a plurality of usable resonance frequencies. A controller is coupled to a power amplifier that drives the ultrasonic transducer and is capable of applying power, voltage or current profiles for each of the resonance frequencies to be used during a bonding operation independent of the others.

Abstract: A fine pitch capillary bonding tool for making ball bonds having a consistent bonded ball size even though the air balls may vary in diameter is provided. The convential shaped bonding tool is provided with a novel ball constraining recess in the working tip. When an air ball is bonded it is forced into the constraining recess which has a shoulder portion for exerting a downward bonding force. The ball being bonded extrudes vertically into the constraining recess without laterial extrusion which would create mashed balls of varying diameter.

Abstract: A low cost highly efficient cooling system for a closely coupled linear motor includes a moving coil mounted for movement on a stator core. The moving coil comprises a plurality of conductive turns wound on a frame wherein the outer surface of the turns are exposed. A nozzle comprising a base member and a cover plate is mounted on one end of the moving coil for producing a pair of high velocity sheets of air which are directed horizontally over the surface of the exposed turns so as to rapidly cool and stabilize the temperature of the coils wound on the moving coil frame within a very short period of time.

Abstract: A digital programmable ultrasonic generator for driving an ultrasonic transducer includes a computer for receiving and storing a plurality of selectable programs. The programs are indicative of different modes of operation. A profile generator is coupled to the computer to receive programs and to produce a digital reference voltage indicative of a voltage profile to be generated for the mode selected. A digital frequency controller is coupled to a direct digital synthesizer for producing a predetermined frequency in response to a programmed frequency command from the computer. A process controller receives the output of the direct digital synthesizer as a voltage signal having the desired frequency and modifies the voltage depending on the mode of operation and voltage desired before driving a power amplifier coupled to the transducer to be driven.

Abstract: The present invention concerns a self locking system for holding a wire bonding tool in a wire bonding transducer and comprises an unitary cam key rotatably mounted in a cam key aperture extending through an anti-node end of an ultrasonic transducer. A cam surface on the cam key is operable to lock a bonding tool mounted in a substantially vertical bonding tool aperture when rotated less than 360.degree. in said cam key aperture.

Abstract: A novel container is provided for holding fragile wire bonding capillaries which comprises two parts, one being a resilient cap and the other being a cover which allows the capillary to be transported therein. The resilient cap comprises a first outer connector on the base for receiving a cover and comprises a second inner connector for receiving a capillary therein. The inner connector is further provided with a gage surface for mounting the capillary in a transducer at a proper working height without removing the capillary from the container cap. Further, the novel cap is provided with vertical slots in the inner and the outer connectors which permits the cap to be moved horizontally to remove the capillary from the cap without harming the fragile tip of the capillary.