Patents Assigned to Kulite Semiconductor Products
  • Patent number: 10436662
    Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: October 8, 2019
    Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Alexander A. Ned, Leo Geras, Sorin Stefanescu
  • Patent number: 10387352
    Abstract: Certain implementations of the disclosed technology may include systems and methods for multibit code communications that can provide more than one bit per input port. In an example implementation, a method is provided that can include measuring an input voltage at an input port in communication with a device. The method can include comparing the measured input voltage with a plurality of predetermined reference voltage levels, and determining, based on the comparing, a device ID. The method can further include outputting the device ID. Certain implementations may further include compensating a signal associated with the device based on the identified device ID.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: August 20, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Wolf Landmann
  • Patent number: 10371590
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having thermal gradients. In one embodiment, a system may comprise a sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header, wherein the first transducer is configured to measure a first pressure to generate a first pressure signal; a second transducer coupled to the second header, wherein the second transducer is configured to measure a second pressure to generate a second pressure signal; and wherein the first transducer and the second transducer are positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: August 6, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Richard Martin
  • Patent number: 10330553
    Abstract: The disclosed technology includes a transducer assembly having a first transducer element. The transducer assembly includes a first filter element adjacent to least of portion of the first transducer element such that a first cavity is defined between the first filter element and the first transducer element. The first filter element includes a plurality of machined passageways in communication with the first cavity. The transducer assembly also includes an inlet passage having a first end in communication with a first external portion of the transducer assembly and a second end in communication with the plurality of machined passageways.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: June 25, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Robert Gardner, Louis DeRosa
  • Patent number: 10309850
    Abstract: Certain implementations of the disclosed technology may include systems, methods, and apparatus for a sealed transducer with an adjustment port. The sealed transducer may include one or more terminals. A first terminal may include electrical connections for connecting to an input voltage source, a ground, and for providing a transducer output signal. A second terminal, for example, may include an electrical port for connecting to an external and separately sealed adjustment network. In one example implementation, the adjustment network can include one or more components configured to couple with internal circuitry of the transducer to alter a response of the transducer.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: June 4, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Wolf Landmann
  • Patent number: 10302516
    Abstract: A tunable pressure transducer assembly that comprises a sensing element disposed within a housing, wherein the sensing element is adapted to output a signal substantially indicative of an applied pressure, and a filter assembly also disposed within the housing. In one example embodiment, a method includes receiving, at a filter assembly having a tube, a cap and a cavity defined by a housing, a pressure, wherein the cap is positioned to set a predetermined volume of the cavity and the tube is associated with an application of the pressure to the cavity, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the tube and the cavity, at least a portion of the dynamic pressure component of the pressure to obtain a filtered pressure; outputting, from the filter assembly, the filtered pressure; and wherein the filtered pressure is used to determine the static pressure component of the pressure.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: May 28, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner
  • Patent number: 10295426
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having a front seal. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; a screen joined to an adaptor and coupled to the housing, wherein a first gap separates the adaptor and the sensing element and a second gap separates the adaptor and the header; and wherein a stress applied at a front surface of the adaptor is transferred to the housing, and the first gap is used to isolate the sensing element from the stress and the second gap is used to isolate the header from the stress.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 21, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Joseph VanDeWeert, Adam Hurst
  • Patent number: 10256138
    Abstract: A method for fabricating silicon-on-insulator (SOI) semiconductor devices, wherein the piezoresistive pattern is defined within a blanket doped layer after fusion bonding. This new method of fabricating SOI semiconductor devices is more suitable for simpler large scale fabrication as it provides the flexibility to select the device pattern/type at the latest stages of fabrication.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: April 9, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Sorin Stefanescu, Joseph R. VanDeWeert
  • Patent number: 10228387
    Abstract: This disclosure provides systems and methods for a two-dimensional material-based accelerometer. In one embodiment, an accelerometer comprises a substrate; a membrane suspended over an opening in the substrate to form a suspended membrane, wherein the membrane is composed of a two-dimensional material; a mass structure coupled to the suspended membrane; and wherein the mass structure distorts the suspended membrane about a first axis in response to an applied acceleration providing a first change in a conductance of the suspended membrane so that the applied acceleration along the first axis can be detected.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: March 12, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Adam Hurst, Sunwoo Lee, James Hone
  • Patent number: 10215651
    Abstract: Systems and methods are disclosed herein for selectively configuring an impedance of a transducer. A configurable transducer system is provided that can include a first region configured for receiving an applied stress and one or more sensing branches in communication with the first region. Each sensing branch can include an active piezoresistive area; three or more conduction paths configured in electrical communication with the active piezoresistive area; one or more trimmable links configured in parallel communication with at least two of the three or more conduction paths; and two or more connection terminals in electrical communication with the three or more conduction paths. The trimmable links are configured to be selectively opened to set a value of nominal impedance associated with the active piezoresistive area based on a desired impedance of the configurable transducer.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: February 26, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: John P. Hilton
  • Patent number: 10215656
    Abstract: Certain implementations of the disclosed technology may include systems and methods for dynamic pressure testing of transducers in communication with a liquid. A method is provided that can include dynamically pressurizing a liquid in a cavity associated with a housing. While dynamically pressurizing the liquid, the method includes simultaneously measuring: a change in volume of the liquid; a test frequency response, by a test transducer in communication with the liquid; and a reference frequency response, by a reference transducer in communication with the liquid. The method may further determine a normalized frequency response of the test transducer, based at least in part on the test frequency response and the reference frequency response. The method may further provide an indication of the normalized frequency response of the test transducer and an indication of the bulk modulus of the liquid.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: February 26, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Adam Hurst
  • Patent number: 10197458
    Abstract: The invention is an improved header and corresponding port associated with a transducer assembly. The header and port define mating threaded portions, thread stop portions, and a weld gap region. The thread stop portions are configured to mate and maintain a pre-loading tension between the threaded portions during and after applying a weld in the weld gap region. The weld gap region is configured to have a predetermined gap distance such that the weld seals the transducer without stress in the weld. The mating of the first and second thread stops are configured to maintain at least a portion of the pre-loading tension.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 5, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Dominic Catalano, Sergio Radossi, Robert Gardner
  • Patent number: 10184853
    Abstract: The present invention provides a self-heated pressure sensor assembly and method of utilizing the same. The self-heated pressure sensor assembly regulates and maintains the temperature of the pressure sensor, regardless of the external temperature environment, without an external heater as in prior art embodiments. Exemplary embodiments of the pressure sensor assembly incorporate a resistance heater that is built into the sensing chip of the pressure sensor assembly. The pressure sensor assembly also utilizes the resistance of the pressure sensing elements to monitor the temperature of the assembly, which works alongside the resistance heater to maintain a stable temperature within the pressure sensor assembly.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: January 22, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Wolf S. Landmann, Joseph R. VanDeWeert
  • Patent number: 10153242
    Abstract: Systems and methods are disclosed for providing an interconnection for extending high-temperature use in sensors and other electronic devices. The interconnection includes a semiconductor layer; an ohmic contact layer disposed on a first region of the semiconductor layer; an insulating layer disposed on a second region of the semiconductor layer, where the second region differs from the first region; a metal layer disposed above at least the insulating layer and the ohmic contact layer; and a connecting conductive region disposed on the metal layer and in vertical alignment with a third region of the semiconductor layer. The third region differs from the first region and is offset from the ohmic contact layer at the first region. The offset is configured to extend an operational lifetime of the interconnection apparatus, particularly when the interconnection apparatus is exposed to high temperature environments.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: December 11, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Sorin Stefanescu
  • Patent number: 10132705
    Abstract: Systems and methods are disclosed for a pressure sensor device. The pressure sensor device includes a header that defines an interior cavity including one or more tether connecting regions. The header further defines an outer portion in communication with the interior cavity; the outer portion includes a plurality of through bores in communication with an exterior portion of the header for insertion of header pins through the header. The pressure sensor device includes a pressure sensor chip disposed within the interior cavity of the header. One or more anchoring tethers are attached to the corresponding one or more tether connecting regions. The pressure sensor chip is free to move within the interior cavity of the header, and the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: November 20, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Sorin Stefanescu, Alexander A. Ned, Joseph R. VanDeWeert, Andrew Bemis
  • Patent number: 10119877
    Abstract: Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: November 6, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander Ned, Sorin Stefanescu, Scott Goodman
  • Patent number: 10101233
    Abstract: Systems and methods are disclosed for a switched, multiple range sensor system including multiple transducers. In one embodiment, a method is provided that includes receiving and measuring at a first transducer and a second transducer, a pressure to generate a respective first and second pressure signal; amplifying the first and second pressure signals with corresponding first and second fixed-gain amplifier to generate first and second amplified pressure signals; selecting for monitoring, the first or second amplified pressure signal; converting the selected amplified pressure signal to an intermediate digital pressure signal; measuring, at a thermal sensor associated with the selected amplified pressure signal, a temperature; compensating, based on the measured temperature, the intermediate digital pressure signal to generate a compensated digital pressure output signal; and outputting the compensated digital pressure output signal.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: October 16, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Joseph VanDeWeert, Haig Norian
  • Patent number: 10048139
    Abstract: A flexible transducer structure suitable for attaching to a curved surface such as the leading edge of an aircraft wing is provided. In one example embodiment, a method may include receiving, at a sensor disposed on a flexible sheet, a pressure, wherein the sensor is electrically coupled to a conductive trace disposed on the flexible sheet; measuring, by the sensor, the pressure to generate a pressure signal; outputting, by the sensor, to the conductive trace, the pressure signal, wherein the conductive trace extends away from the sensor on the flexible sheet; and wherein the flexible sheet is adaptable to conform to a contour of a curved surface.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: August 14, 2018
    Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventor: Nora Kurtz
  • Patent number: 9964460
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having a front seal. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; a screen joined to an adaptor and coupled to the housing, wherein a first gap separates the adapter and the sensing element and a second gap separates the adapter and the header; and wherein a stress applied at a front surface of the adapter is transferred to the housing, and the first gap is used to isolate the sensing element from the stress and the second gap is used to isolate the header from the stress.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: May 8, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Joseph VanDeWeert, Adam Hurst
  • Patent number: 9952067
    Abstract: The disclosed technology may include systems, methods, and apparatus for optical measurements. A method is provided that includes receiving, by first and second Extrinsic Fabry-Perot Interferometer (EFPI) sensors, respective portions of interrogation light. The first EFPI sensor is responsive to a measurement stimulus and both the first EFPI sensor and the second EFPI sensor are responsive to a common mode stimulus. The method includes detecting a measurement signal and a first common-mode signal responsive to receiving altered interrogation light from the first EFPI sensor, the measurement signal corresponding to the measurement stimulus. The method includes detecting a second common mode signal responsive to receiving altered light from the second EFPI sensor.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: April 24, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Martin A. Sanzari