Abstract: A composition for light diffusion film in which the angle of aperture of diffused light in a light diffusion film obtainable therefrom can be expanded effectively, and a light diffusion film obtainable by the composition for light diffusion film are provided.

Abstract: Provided is an antifouling sheet having an interlayer (X) containing a (poly)silazane compound and having an antifouling layer (Y) layered on the surface of the interlayer (X), wherein the layer (Y) is formed of an antifouling layer-forming composition containing a specific tetrafunctional silane compound (A) and a specific trifunctional silane compound (B), the content of the component (B) in the antifouling layer-forming composition is 8 to 90 mol % relative to 100 mol % of the component (A). The antifouling sheet is provided with an antifouling layer having good surface state and curability, has a large slip acceleration for water droplets, thereby having excellent water repellency that makes water droplets slip off instantly, and has excellent interlayer adhesiveness.

Abstract: The present invention is a long gas barrier laminate including a base, a functional layer, a smoothing layer, and a gas barrier layer, the functional layer being stacked on one side of the base, the smoothing layer and the gas barrier layer being sequentially stacked on the other side of the base, and a coefficient of static friction between a surface of the functional layer that is situated opposite to the base and a surface of the gas barrier layer that is situated opposite to the base being 0.35 to 0.80; and a method for producing the long gas barrier laminate.

Abstract: Provided is an antifouling sheet having an antifouling layer formed of an antifouling layer-forming composition containing a specific tetrafunctional silane compound (A) and a specific trifunctional silane compound (B) wherein the content of the component (B) is 8 to 90 mol % relative to 100 mol % of the component (A), and the antifouling layer is a layer formed by drying and curing a coating film formed of the antifouling layer-forming composition, in an ammonia atmosphere. Also provided is a method for producing the antifouling sheet. The antifouling sheet is provided with an antifouling layer having good surface state and curability, has a large slip acceleration for water droppings, thereby having excellent water repellency that makes water droplets slip off instantly, and has excellent interlayer adhesiveness.

Abstract: The present invention provides a thermoelectric conversion material of which the structure is controlled to have nano-order microscopic pores and which has a low thermal conductivity and has an improved thermoelectric performance index. In the thermoelectric conversion material having a thermoelectric semiconductor layer formed on a block copolymer substrate that comprises a block copolymer having microscopic pores, wherein the block copolymer comprises a polymer unit (A) formed of a monomer capable of forming a homopolymer having a glass transition temperature of 50° C. or higher, and a polymer unit (B) formed of a conjugated dienic polymer.

Abstract: Disclosed is a formed article comprising a layer obtained by implanting ions of a hydrocarbon compound into a polyorganosiloxane compound-containing layer. Also disclosed are: a method of producing the formed article, the method comprising implanting ions of a hydrocarbon compound into a surface of a polyorganosiloxane compound-containing layer of a formed body that includes the polyorganosiloxane compound-containing layer in its surface; an electronic device member that includes the formed article; and an electronic device that includes the electronic device member. The present invention provides; a formed article which exhibits an excellent gas barrier capability, transparency, bendability, antistatic performance, and surface flatness; a method of producing the formed article, an electronic device member, and an electronic device.

Abstract: Disclosed is a gas barrier film, which demonstrates superior gas barrier properties and surface flatness, demonstrates a high degree of adhesion between layers and is resistant to cracking when bent, and an electronic device provided therewith. A gas barrier film (10) of the present invention has a base (11), and a polyorganosiloxane layer (12) and an inorganic material layer (13) sequentially provided on at least one side of the base (11), and the inorganic material layer (13) is deposited by dynamic ion mixing method.

Abstract: The present invention is a gas barrier laminate comprising a base unit that comprises a base and a modification-promoting layer, and a gas barrier layer that is formed on a side of the modification-promoting layer with respect to the base unit, the modification-promoting layer having a modulus of elasticity at 23° C. of less than 30 GPa, the base unit having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 1.0 g/(m2·day) or less, and the gas barrier layer being a layer formed by applying a modification treatment to a surface of a layer that comprises a polysilazane-based compound and is formed on the side of the modification-promoting layer with respect to the base unit, and a method for producing the gas barrier laminat, and an electronic device member comprising the gas barrier laminate, and an electronic device comprising the electronic device member.

Abstract: The invention provides a thermoelectric conversion material having a low thermal conductivity and an improved figure of merit and a production method for the material, and also provides a thermoelectric conversion module. The thermoelectric conversion material has, on a porous substrate having microscopic pores, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the porous substrate has a polymer layer (B) on a plastic film (A) and the microscopic pores are formed in the polymer layer (B) and in a part of the plastic film (A). The production method for the thermoelectric conversion material comprises a substrate formation step of forming a porous substrate including a step 1, a step 2 and a step 3, and comprises a film formation step of forming a thermoelectric semiconductor layer through film formation of a thermoelectric semiconductor material on the porous substrate. The thermoelectric conversion module uses the thermoelectric conversion material.

Abstract: The present invention is a curable polysilsesquioxane compound comprising at least one structural unit represented by CHR1X0-D-SiO3/2, the curable polysilsesquioxane compound having a 29Si nuclear magnetic resonance spectrum that has a first peak top within a range of ?73 ppm or more and less than ?65 ppm, has a second peak top within a range of ?82 ppm or more and less than ?73 ppm, and substantially does not have a peak within a range of ?65 ppm or more and less than ?55 ppm, and a method for producing the curable polysilsesquioxane compound, and a curable composition comprising the curable polysilsesquioxane compound and a silane coupling agent, and a cured product obtained by heating the curable composition, and a method for using the curable polysilsesquioxane compound or the curable composition, as an optical device-securing material.

Abstract: The present invention is a curable polysilsesquioxane compound comprising one structural unit or two or more structural units represented by R1SiO3/2, the curable polysilsesquioxane compound having a 29Si nuclear magnetic resonance spectrum that has a first peak top within a range of ?60 ppm or more and less than ?54 ppm, has a second peak top within a range of ?70 ppm or more and less than ?61 ppm, and substantially does not have a peak within a range of ?53 ppm or more and less than ?45 ppm, and a method for producing the curable polysilsesquioxane compound, and a curable composition comprising the curable polysilsesquioxane compound and a silane coupling agent, and a cured product obtained by heating the curable composition, and a method for using the curable polysilsesquioxane compound or the curable composition, as an optical device-securing material.

Abstract: Provided is a gas barrier pressure-sensitive adhesive sheet having at least one gas barrier layer and at least one pressure-sensitive adhesive layer, the at least one pressure-sensitive adhesive layer having a storage modulus at 23° C. of 1.5×104 to 1.0×107 Pa, and the gas barrier pressure-sensitive adhesive sheet not including a base layer.

Abstract: Provided are an organic electronic element equipped with a sealing layer having excellent gas barrier properties, transparency and the like, and a method for efficiently manufacturing such an organic electronic element. Disclosed are an organic electronic element including, on a substrate, a first electrode and a second electrode facing each other, with at least one organic functional layer being interposed therebetween, and a method for manufacturing such an organic electronic element, characterized in that a sealing layer is directly provided along the top surface and the lateral surface of the organic electronic element, and the sealing layer is obtained by implanting plasma ions into a coating film containing a silicon compound as a main component.

Abstract: A sheet sticking apparatus 10 includes holding means 13 provided so as to be capable of holding an adhesive sheet S, and sticking means 12 that sticks the adhesive sheet S to an adherend surface W0 of an adherend W. The sticking means 12 includes a first sticking portion 15 capable of sticking a part of the adhesive sheet S held by the holding means 13 to a first sticking surface by pressure, and a second sticking portion 16 that sticks portions of the adhesive sheet S that have not yet been stuck by using the first sticking portion 15 to second sticking surfaces by pressure.

Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

Abstract: A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object without imparting physical energy, such as electron beam or ? ray. The base film for a dicing sheet comprises a resin layer. The resin layer comprises: a norbornene-based resin that is a thermoplastic resin having a norbornene-based compound as at least one type of monomer; and an olefin-based thermoplastic resin other than the norbornene-based resin. The norbornene-based resin in the resin layer has a content of more than 3.0 mass %. A dicing sheet is also provided which comprises: the base film for a dicing sheet; and a pressure-sensitive adhesive layer placed on a surface of the film at the resin layer side.

Abstract: The invention is a formed article including a gas barrier layer, the gas barrier layer including a surface layer part that is formed of a material that includes at least a carbon atom, an oxygen atom, and a silicon atom, the surface layer part having a carbon atom content rate of more than 0 and not more than 70%, an oxygen atom content rate of 10 to 70%, a nitrogen atom content rate of 0 to 35%, and a silicon atom content rate of 20 to 55%, based on a total content rate of carbon atoms, oxygen atoms, nitrogen atoms, and silicon atoms; a method for producing the formed article; an electronic device member including the formed article; and an electronic device comprising the electronic device member. The formed article of the invention exhibits an excellent gas barrier capability, excellent transparency, and excellent bending resistance. The method for producing a formed article of the invention can efficiently, safely, and conveniently produce the formed article of the invention.

Abstract: To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

Abstract: A laminated sheet for sealing electronic elements is configured to comprise: a first long release sheet; a plurality of sealing materials that are laminated on the first release sheet within a central area in the width direction and at different positions in the longitudinal direction; protection materials that are laminated on the first release sheet at both side portions in the width direction; and a second long release sheet that is laminated on the sealing materials and the protection materials at the opposite sides to the first release sheet. According to such a laminated sheet for sealing electronic elements, highly reliable electronic devices can be produced in an efficient manner.

Abstract: A substrate for back grind tape of the present invention includes a substrate film having a Young's modulus of 600 MPa or more; and a buffer layer provided on one face of the substrate film, the buffer layer formed of a urethane-containing cured material and having a peak temperature of tan 6 of 60° C. or lower.