Abstract: The present invention provides: an adhesive composition comprising a diene-based rubber (A) that includes a radiation-curable functional group, a cured adhesive layer having a thickness of 60 ?m that is formed by curing the adhesive composition having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 30 g/(m2·day) or less; an adhesive sheet comprising a curable adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition.

Abstract: The present invention provides an adhesive composition comprising a diene-based rubber (A) that includes a carboxylic acid-based functional group, and a crosslinking agent (B), an adhesive layer having a thickness of 60 ?m that is obtained by crosslinking the adhesive composition having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 60 g/(m2·day) or less; an adhesive sheet comprising an adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition, or the adhesive sheet.

Abstract: The present invention provides: a curable polysilsesquioxane compound comprising at least one structural unit represented by R1SiO3/2 (wherein R1 is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group), a 29Si nuclear magnetic resonance spectrum of the curable polysilsesquioxane compound having a first peak top within a range of ?65 ppm or more and less than ?55 ppm, having a second peak top within a range of ?73 ppm or more and less than ?65 ppm, and having a third peak top within a range of ?82 ppm or more and less than ?73 ppm, and the ratio of an integral value (P1) of a first peak to the total of the integral value (P1) of the first peak, an integral value (P2) of a second peak, and an integral value (P3) of a third peak being more than 0% and less than 10%; a method for producing the same; a curable composition; a cured product; and a method for using curable composition or the like as an optical device-securing material.

Abstract: The present invention provides: an adhesive composition comprising an isobutylene-based polymer (A), a diene-based rubber (B) that includes a hydroxyl group, and a crosslinking agent (C); an adhesive sheet comprising an adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition, or the adhesive. According the present invention, provided are; an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability, and exhibits adhesion and holding power in a well-balanced manner; an adhesive sheet that includes an adhesive layer that is formed using the adhesive composition; and an electronic device that includes a sealing material that is formed using the adhesive composition.

Abstract: The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m2/day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like.

Abstract: An electronic device having, arranged in the following order, a cathodic layer, a conductive layer, a photoelectric conversion layer, and an anodic layer. The conductive layer contains a conductive adhesive composition which contains: (A) a water-soluble polyvinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound.

Abstract: Provided is a flame retardant adhesive sheet having an adhesive agent layer on at least one surface of a base material, which even when the adhesive agent layer does not contain a flame retardant agent, has both excellent flame retardant properties and adhesive properties. The present invention is concerned with a flame retardant adhesive sheet including an adhesive agent layer on at least one surface of abase material, wherein the base material has flame retardant properties adapted to VTM-0 in a test according to the UL94 standard; a thickness per surface of the adhesive agent layer is 0.6 ?m or more, and a total thickness of the adhesive agent layer is not more than 2.2 ?m; the adhesive agent constituting the adhesive agent layer does not contain a flame retardant agent but contains (A) an acrylic copolymer and (B) a specified urethane resin.

Abstract: The present invention relates to an adhesive sheet including a substrate sheet and an adhesive layer, wherein the substrate sheet has a void containing layer capable of the air permeability from the surface contacting with the adhesive layer, the air permeability measured by specific test method is 1×103 to 3×105 seconds. The present invention can provide an adhesive sheet which is capable of efficiently preventing the occurrence of the swelling or the floating (that is the occurrence of a blister) even if the time passes when adhered to the surface of the various plastic moldings. In addition, the present invention can provide the adhesive sheet capable of exhibiting excellent blister resistance to any adhesive agent.

Abstract: The present invention relates to a back grinding sheet (BG sheet) (1a, 1b, 1c) having an unevenness-absorbing layer (12) on a substrate (11), in which the unevenness-absorbing layer is a layer formed of a film-forming composition containing (A) a urethane (meth)acrylate and (B) a polymerizable monomer except component (A) and the layer satisfies the following requirements (a) to (c): (a) a loss tangent at 70° C. measured at a frequency of 1 Hz is 1.5 or more, (b) a relaxation rate 300 seconds after a square (1 cm×1 cm) of the unevenness-absorbing layer is compressed at 25° C. and a compressive load of 10 N is 30% or less, and (c) a storage elastic modulus at 25° C. measured at a frequency of 1 Hz is 1.0 to 10.0 MPa.

Abstract: Provided is an adhesive sheet comprising a support substrate, an adhesive agent layer (X), a continuous void-containing layer composed of a composition containing an adhesive agent and silica particles, and an adhesive agent layer (Y) that are laminated in this order, wherein the adhesive sheet that has a content by mass of the silica particles in the continuous void-containing layer of 25 to 60%; and when affixed to a surface of various plastic molded articles, the adhesive sheet prevents swelling or lifting, in other words, blistering after a lapse of time, to allow the surface of its support substrate to be smooth and to have an excellent appearance, wherein the adhesive sheet can exhibit excellent blister resistance regardless of the type of adhesive agent, and is furthermore easy to manufacture.

Abstract: A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing a polyisobutylene-based resin (A) having a mass-average molecular weight of 20000 or more, a styrene-based copolymer (B), and a tackifier (C) having a softening point of 135° C. or less, wherein the component (B) is one or more selected from the group consisting of a styrene-butadiene-styrene triblock copolymer (SBS), a styrene-block-(ethylene-co-butylene)-block-styrene triblock copolymer (SEBS), a styrene-isobutylene diblock copolymer (SIB), and a styrene-isobutylene-styrene triblock copolymer (SIBS), has excellent adhesive force, excels in a suppressing effect on moisture intrusion, and has good transparency.

Abstract: [Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.

Abstract: The present invention provides a thermoelectric conversion material capable of being produced in a simplified manner and at a low cost and excellent in thermoelectric conversion characteristics and flexibility, and provides a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid comprises a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.

Abstract: Provided is a curable resin composition comprising a thermoplastic resin (A) that includes a cyclic structure in its main chain, and has a glass transition temperature (Tg) of 140° C. or more, and a monofunctional curable monomer (B). The present invention provides: a cured resin formed article that has heat resistance and low birefringence, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.

Abstract: The disclosed ion implantation apparatus has a vacuum chamber 11, a roller electrode 13 having a portion of an outer circumferential part on which a film 3 is wound, voltage application unit 23 for applying a voltage to the roller electrode, and. a gas introduction unit having a. gas supply outlet for supplying an ion implantation gas into the vacuum chamber, wherein the gas introduction unit and a gas discharge outlet are disposed, so as to be opposite each other along the axial direction of the roller electrode, the roller electrode intervening therebetween.

Abstract: A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer made of a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin (A) and a conductive material (B), wherein a value of van der Waals force component ?sd of surface free energy of the pressure-sensitive adhesive composition excluding the conductive material (B) is 26.0 or less, has excellent adhesive force, and excels in an antistatic property and a conductive property because of low surface resistivity of the pressure-sensitive adhesive layer.

Abstract: A method for sticking a formed product of an adhesive composition to an adherend composed of a metal, which includes: (a) holding the formed product to the adherend with a magnetic force, (b) heating the resultant formed article at 110° C. to 200° C. to decrease the magnetic force and to generate adhesion, thereby sticking the formed product to the adherend by the adhesion, wherein the adhesive composition comprises a mixture of a hot-melt adhesive and a ferromagnetic material, the adhesive composition exhibiting a surface magnetic force of not less than 20 mT to be operable to be held to the adherend having a surface magnetic force of less than 5 mT after a heating at 50° C. for 40 minutes, and the adhesive composition having a shear force of not less than 20 N after a hot bonding at 150° C. for 10 minutes.

Abstract: A method is provided forming a predetermined irregular-surface pattern on a substrate. The method includes carrying out a plasma-etching process using a partly oxidized metal salt film having fine irregular-surface as a resist. In a first step, a metal salt film is formed on the substrate by coating a liquid material containing a metal salt. In a second step, a fine irregular-surface is formed on the metal salt film, and the metal salt film was converted into the resist by the partial oxidization. In a third step, a predetermined irregular-surface is formed on the substrate by carrying out the plasma-etching process to the substrate with the resist.

Abstract: An antenna circuit which includes a substrate and a planar circuit with a circuit line of a conductive material formed on a surface of the substrate, and at least one conductive pad (notch-forming part) electrically connected with the circuit line of the planar circuit. Cutting lines, such as perforations, are provided in the substrate around an outer periphery of the notch-forming part and extend into the notch-forming part on either side of connection points where the circuit line connects with the notch-forming part, The cutting lines approach each other in the notch-forming part to form a section (notch port). The antenna circuit can be destroyed even if an IC tag provided with the antenna circuit is peeled off from various directions, and the destruction rate of the circuit can be increased stably.

Abstract: A protective sheet for a solar cell module that includes a cycloolefin resin layer laminated to one surface of a substrate film with a polyolefin resin layer disposed therebetween, wherein the polyolefin resin layer and the cycloolefin resin layer are formed by co-extrusion molding.