Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder.

Abstract: The present disclosure provides a female connector and a connector combination. The female connector includes: a female terminal having a first end for mating with a male connector or a gold finger circuit board, and a second end for connection with a PCB board, the female terminal being formed with at least one shape abruptly-changed portion between the first end and the second end, and a high-frequency radiation area being formed in the vicinity of the shape abruptly-changed portion when the first end is mated with the male connector or the gold finger circuit board; and a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area. By selectively disposing the wave-absorbing material in an area where a high-frequency radiation is easily generated during the use of the connector, crosstalk signals are absorbed, while normally transmitted electrical signals are retained, and an overall weight of the connector is light.

Abstract: This application discloses electromagnetic energy mitigation assemblies and automotive vehicle components comprising the electromagnetic energy mitigation assemblies. An electromagnetic energy mitigation assembly includes a first electrically conductive layer and a second electrically conductive layer. First and second permalloy layers are along respective first and second opposite sides of the first electrically conductive layer. Third and fourth permalloy layers are along respective third and fourth opposite sides of the second electrically conductive layer. An electromagnetic noise suppression layer is sandwiched between the second and third permalloy layers. An automotive vehicle component includes an electromagnetic energy mitigation assembly configured to be positioned relative to one or more batteries of an automotive vehicle for providing electromagnetic shielding for the one or more batteries. The electromagnetic energy mitigation assembly includes a first electrically conductive layer.

Abstract: An electrically and thermally conductive gasket includes a resilient core including a plurality of sides, a heat spreader disposed along at least two sides of the plurality of sides of the resilient core, and an electrically conductive layer disposed along and/or covering at least a portion of the heat spreader, such that the portion of the heat spreader is between the resilient core and the electrically conductive layer. The gasket is positionable and/or compressible between first and second surfaces to thereby define an electrically conductive path and a thermally conductive path between the first and second surfaces.

Abstract: The present application provides a female connector, a male connector and a connector assembly. The female connector includes: a plurality of female terminals, ends of which are radially expanded outward to form trumpet-shaped guide heads for blind mating with a male connector or a gold finger circuit board; a cantilever section of the female terminal being bent at at least one position to form an elastic pressing portion for an interference fit contact with the male connector or the gold finger circuit board; a first high-frequency radiation area being formed in the vicinity of the trumpet-shaped guide head when the female terminals are mated with the male connector or the gold finger circuit board; and a first wave-absorbing material is disposed in a spatial scope covered by the first high-frequency radiation area.

Abstract: The present application provides a female connector and a connector assembly. The female connector is used to connect to a PCB board internally provided with a signal layer and a drilling hole penetrating the signal layer, the female connector including: a female terminal having two ends, one end being a connecting end for mating with a male connector or a gold finger circuit board, and the other end forming a crimping pin to be inserted into a drilling hole and connected with the signal layer; a high-frequency radiation area being formed in the vicinity of a connection between the crimping pin and the drilling hole when the connecting end is mated with the male connector or the gold finger circuit board; and a wave-absorbing material is disposed in a spatial scope covered by the high-frequency radiation area.

Abstract: A female connector is connected to a PCB board internally provided with a signal layer and a ground layer. A surface of the PCB board includes conductive pads connected to the signal layer and the ground layer. The female connector includes a female terminal having first and second ends. The second end includes differential signal pairs arranged at intervals and ground pins each located between an adjacent two of the differential signal pairs. The differential signal pairs are connectable to the signal layer through the conductive pads. The ground pins are connectable to the ground layer through the conductive pads. A high-frequency radiation area is in the vicinity of a joint between the differential signal pair and the conductive pad when the first end is mated with a male connector or circuit board. A wave-absorbing material is disposed in a spatial range covered by the high-frequency radiation area.

Abstract: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.

Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

Abstract: Disclosed are exemplary embodiments of patterned electromagnetic interference (EMI) mitigation materials (e.g., EMI absorbers, thermally-conductive EMI absorbers, etc.) including carbon nanotubes. The carbon nanotubes may comprise single-walled carbon nanotubes, multi-walled carbon nanotubes, and/or carbon nanostructures comprising a branched network of crosslinked carbon nanotube structures. For example, an EMI mitigation material may comprise a filled dielectric including a pattern of EMI absorbers. The filled dielectric comprises carbon nanotubes.

Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.

Abstract: A communication interface comprises a male connector interface and a female connector interface. The male connector interface includes at least one male connector. The female connector interface includes at least one female connector pluggable into the male connector of the male connector interface. An open channel and/or a gap for signal transmission is in the male connector interface and/or the female connector interface. Each of the male connector and the female connector includes a communication line structure, a guiding structure, a support structure, and a protection structure, at least one of which includes a wave absorbing portion configured to absorb an electromagnetic leakage from the male connector interface and/or the female connector interface via the open channel and/or the gap. The communication interface can effectively solve the problem of the leakage of electromagnetic energy inside the communication interface.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shield (BLS) frames or fences including pickup members with pickup areas. In exemplary embodiments, the pickup member may be configured such that the pickup area is allowed to rotate in place when the pickup member is drawn to raise the pickup area.

Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder.

Abstract: A low dielectric, low loss radome comprising microspheres integrated into a matrix. The microspheres reduce overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome.

Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.