Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.

Abstract: A communication interface comprises a male connector interface and a female connector interface. The male connector interface includes at least one male connector. The female connector interface includes at least one female connector pluggable into the male connector of the male connector interface. An open channel and/or a gap for signal transmission is in the male connector interface and/or the female connector interface. Each of the male connector and the female connector includes a communication line structure, a guiding structure, a support structure, and a protection structure, at least one of which includes a wave absorbing portion configured to absorb an electromagnetic leakage from the male connector interface and/or the female connector interface via the open channel and/or the gap. The communication interface can effectively solve the problem of the leakage of electromagnetic energy inside the communication interface.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shield (BLS) frames or fences including pickup members with pickup areas. In exemplary embodiments, the pickup member may be configured such that the pickup area is allowed to rotate in place when the pickup member is drawn to raise the pickup area.

Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder.

Abstract: A low dielectric, low loss radome comprising microspheres integrated into a matrix. The microspheres reduce overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome.

Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.

Abstract: According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

Abstract: The present application provides a female connector and a connector assembly. The female connector is used to connect to a PCB board internally provided with a signal layer and a drilling hole penetrating the signal layer, the female connector including: a female terminal having two ends, one end being a connecting end for mating with a male connector or a gold finger circuit board, and the other end forming a crimping pin to be inserted into a drilling hole and connected with the signal layer; a high-frequency radiation area being formed in the vicinity of a connection between the crimping pin and the drilling hole when the connecting end is mated with the male connector or the gold finger circuit board; and a wave-absorbing material is disposed in a spatial scope covered by the high-frequency radiation area.

Abstract: The present disclosure provides a female connector and a connector combination. The female connector includes: a female terminal having a first end for mating with a male connector or a gold finger circuit board, and a second end for connection with a PCB board, the female terminal being formed with at least one shape abruptly-changed portion between the first end and the second end, and a high-frequency radiation area being formed in the vicinity of the shape abruptly-changed portion when the first end is mated with the male connector or the gold finger circuit board; and a wave-absorbing material disposed in a spatial range covered by the high-frequency radiation area. By selectively disposing the wave-absorbing material in an area where a high-frequency radiation is easily generated during the use of the connector, crosstalk signals are absorbed, while normally transmitted electrical signals are retained, and an overall weight of the connector is light.

Abstract: Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.

Abstract: According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies including detachable or severable pickup members. Also disclosed are exemplary embodiments of shielding assemblies (e.g., board level shields, etc.) including the same.

Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.