Abstract: According to various aspects, exemplary embodiments are disclosed of devices, systems, and methods related to tracking location of operator control units for locomotives. In an exemplary embodiment, an operator control unit includes a user interface configured to receive one or more commands from an operator for controlling a locomotive. The operator control unit also includes a global positioning system (GPS) receiver configured to receive location information of the operator control unit, and a wireless communication device. The wireless communication device is configured to transmit command data corresponding to the one or more commands and location data corresponding to the location information to a machine control unit on the locomotive.

Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.

Abstract: An antenna assembly generally includes an antenna module mountable to a vehicle body wall. The antenna base module may include a base, an inner (e.g., environmental protective cover, etc.) cover coupled to the base, at least one antenna element disposed within an enclosure defined by the inner cover and the base, and one or more latching members. An outer (e.g., cosmetic, styled, and/or aerodynamic, etc.) cover may include one or more snap clip members engageable with the one or more latching members when the outer cover is positioned over the inner cover. The snap clip members may include curved portions and flex points.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

Abstract: An exemplary embodiment of an multiband antenna assembly includes a printed circuit board having a plurality of elements thereon. The plurality of elements may include a radiating element, a matching element, a feed element configured to be operable as a feeding point for the multiband antenna assembly, and a shorting element configured to be operable for electrically shorting the radiating element to ground. The antenna assembly may be operable within at least a first frequency range and a second frequency range different than the first frequency range without requiring any matching lump components coupled to the printed circuit board.

Abstract: According to various aspects, exemplary embodiments are disclosed of antenna assemblies. In an exemplary embodiment, an antenna assembly generally includes a feed network and a ground plane. Radiating dipoles or dipole radiating elements are along or on opposite sides of the feed network and the ground plane. The radiating dipoles or dipole radiating elements may be operable simultaneously and may co-locate radio frequency currents for a first frequency band and a second frequency band.

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.

Abstract: Exemplary embodiments are provided of telematics devices and exemplary corresponding methods. In an exemplary embodiment, a telematics device generally includes a controller, a wireless communication module to transmit ignition information to a remote station, a power input terminal to sense a voltage of the battery, and an ignition input terminal to couple to an ignition line of the vehicle. The controller determines whether the ignition input terminal is coupled to an ignition line of the vehicle, and when the terminal is coupled to an ignition line, the controller determines vehicle ignition turn on and ignition turn off events by detecting voltage changes on the ignition line. When the ignition input terminal is not coupled to an ignition line of the vehicle, the controller senses the voltage of the battery of the vehicle to determine vehicle ignition turn on and turn off events based on sensed voltage changes of the battery.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields that include film and/or foil (e.g., electrically-conductive plastic film, metallized or metal plated film, metal foil, reinforced foil, poly-foil, etc.) covers or lids. Also disclosed are exemplary embodiments of methods relating to making EMI shielding apparatus or assemblies. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: Exemplary embodiments are provided of telematics devices and exemplary corresponding methods. In an exemplary embodiment, a telematics device generally includes a controller and a wireless communication module for transmitting data to a remote station. The controller is configured to periodically obtain the speed of a vehicle, determine when the speed of the vehicle has exceeded a first speed threshold, store the monitored speed as a max speed value, and compare each successive monitoring interval speed to a previous monitoring interval speed. When the successive monitoring interval speed is greater than the max speed value, the max speed value is updated. A speeding event occurs when each successive monitoring interval speed is above the first speed threshold for a speed duration, and/or when any successive monitoring interval speed exceeds a second speed threshold.

Abstract: A thermoelectric assembly is disclosed, the assembly having a cold side and a hot side, where the hot side comprises a single fan sink and the cold side comprises dual fan sinks. Thermoelectric modules may be between the hot side and cold side and arranged in one circuit or multiple parallel circuits, and in direct thermal contact with both the hot side and the cold side. The assembly may include one or more moisture barrier measures, including a wire seal, a series of screw O-rings, and a sealing layer.

Abstract: Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields. In an exemplary embodiment, a board level shield (BLS) includes a fence and a lid. The fence is solderable to a printed circuit board (PCB). When the lid is engaged to the fence that has been soldered to the PCB, the BLS provides substantial electromagnetic interference (EMI) shielding protection to the components covered by the BLS. The lid may be constructed of a frame and a cover. The cover may be a film or foil. The lid may attach to the fence via a one way directional latching mechanism, which may be enhanced by the use of one or more interior downward tabs on the lid that meet one or more inward protrusions from the fence to create pressure on the lid and fence.

Abstract: Disclosed are exemplary embodiments of multiband MIMO vehicular antenna assemblies. In an exemplary embodiment, a multiband MIMO vehicular antenna assembly generally includes a chassis and an outer cover or radome. The outer cover is coupled to the chassis such that an interior enclosure is collectively defined by the outer cover and the chassis. An antenna carrier or inner radome is within the interior enclosure. The antenna carrier has inner and outer surfaces spaced apart from the chassis and the outer cover. One or more antenna elements are along and/or in conformance with the outer surface of the antenna carrier so as to generally follow the contour of a corresponding portion of the antenna carrier.

Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

Abstract: Example embodiments of the present disclosure generally relate to automatic wireless mode switching in wireless communication devices and systems, and methods of automatic wireless mode switching. In one example embodiment, a wireless communication device generally includes a wireless communication interface configured to transmit data to a remote device via wireless communication, and a controller configured to control a mode of operation of the wireless communication device and to automatically switch the mode of operation of the wireless communication device between at least a first mode of operation and a second mode of operation. The first mode of operation is one of a client mode of operation, an access point mode of operation, an ad hoc mode of operation, a dual mode operation and a tri-mode operation. The second mode of operation is one of a dual mode operation and a tri-mode operation.

Abstract: Exemplary embodiments are disclosed of multifunctional components for electronic devices. In an exemplary embodiment, a multifunctional component generally includes a base component, such as a smart phone case (e.g., a back cover, etc.), an inner plate (e.g., a screenplate, a mid-plate, etc.). A heat spreader may be disposed on the base component. Thermal interface material and electromagnetic interference shielding may be disposed on area(s) of the heat spreader. The area(s) may correspond in mirror image relation to component(s) of a circuit board with which the multifunctional component is configured to be joined. During operation of the electronic device, the multifunctional component may draw waste heat from one area and transfer/spread the waste heat to one or more other areas of the electronic device, which may increase a temperature of these one or more other areas. This, in turn, may make device temperature more uniform.

Abstract: Disclosed are exemplary embodiments of omnidirectional broadband antennas. In an exemplary embodiment, an antenna generally includes a ground element, an antenna element, and an annular patch element. The antenna element may be electrically isolated from the ground element. The antenna element may include at least one portion that is substantially conical, substantially pyramidal, and/or that tapers in a longitudinal direction. The annular patch element is electrically grounded to the ground element. The annular patch element surrounds at least a portion of the antenna element and is parasitically coupled to the antenna element.