Patents Assigned to Laird Technologies, Inc.
  • Patent number: 10212863
    Abstract: An electromagnetic interference (EMI) shielding gasket is disclosed, the gasket having a series of slots thereon. The gasket may include an electrically-conductive outer layer adhered to a resiliently compressible core, and may further include a pressure sensitive adhesive thereon for adhering the gasket to a substrate. Each slot is a portion of the gasket that has been removed from the gasket by, for example, cutting a portion of the outer layer and core and removing a substantial majority of the core and all but the base of the gasket, thereby leaving a strip of electrically-conductive outer layer in each slot.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: February 19, 2019
    Assignee: Laird Technologies Inc.
    Inventor: Shelby Ball
  • Patent number: 10205241
    Abstract: Disclosed are exemplary embodiments of a low profile wideband and/or multiband omnidirectional antennas. In an exemplary embodiment, an antenna generally includes a radiator and a ground plane. The ground plane may include a slanted surface along or defining an edge portion of the ground plane. The slanted surface may be configured to be operable for reducing null at azimuth plane to thereby allow the antenna to have more omnidirectional radiation patterns for the azimuth plane. In another exemplary embodiment, an antenna generally includes a substrate, a radiator along the substrate, and electrically-conductive tape or foil defining at least part of a ground plane. The electrically-conductive tape or foil is coupled to a ground of the radiator via proximity coupling and electrically insulated by masking of the substrate.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: February 12, 2019
    Assignee: Laird Technology, Inc.
    Inventors: Kok Jiunn Ng, Choon Chung Su, Chit Yong Hang
  • Patent number: 10172265
    Abstract: A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: January 1, 2019
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: Timothy M. Wrona, Gerald R. English, Daniel Jacklinski
  • Patent number: 10151582
    Abstract: According to various aspects, exemplary embodiments are disclosed of systems and methods for monitoring locomotive wheel size. In an exemplary embodiment, a system generally includes at least one distance measurement device coupled to a locomotive and configured to measure a distance to a rail when a locomotive wheel is positioned on the rail. The system is configured to use the distance to the rail as measured by the at least one distance measurement device to determine a diameter of the locomotive wheel.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: December 11, 2018
    Assignee: Laird Technologies, Inc.
    Inventor: Jeremy Jovenall
  • Patent number: 10154580
    Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields. In an exemplary embodiment, a board level shield generally includes a cover (or lid) and a fence (or frame or base). The cover is attachable to the fence in a plurality of different positions.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: December 11, 2018
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: Paul W. Crotty, Jr., Mark Fucci, Kenneth M. Robinson
  • Patent number: 10116063
    Abstract: Exemplary embodiments are provided of internally fed directional folded Yagi antenna assemblies. In an exemplary embodiment, an antenna assembly generally includes a boom, a cable assembly, and a plurality of dipole elements spaced apart along the boom. The dipole elements include a folded dipole element. The feed cable assembly is internally fed inside the boom and a first section of the folded dipole element.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: October 30, 2018
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: Rafael Haro, Alejandro Manuel Mascorro, Sajid Ali Safvi, Benjamin Peter Hoffman
  • Patent number: 10108164
    Abstract: A crane control system for controlling a plurality of cranes is provided. The crane control system in some embodiments includes a master controller unit, at least one computer readable memory for storing a plurality of tokens, each token from the plurality of tokens associated with a respective crane from the plurality of cranes, and a processing unit responsive to commands inputable by an operator of the master controller unit to send the commands to individual cranes from the plurality of cranes, wherein the processing unit associates the commands with respective tokens to control the cranes associated with those tokens. The crane control system in some embodiments also includes a processing unit that is responsive to a signal indicative of a synchronization loss to issue a command to bring the plurality of cranes into a safe condition, such as an emergency stop, or a corrective action.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: October 23, 2018
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: David Stagg, Paul-André Corbeil, Pierre Montreuil, Luc Ethier
  • Patent number: 10104496
    Abstract: Exemplary embodiments are provided of telematics devices and exemplary corresponding methods. In an exemplary embodiment, a telematics device generally includes at least one hub device having a wireless network interface and a BLUETOOTH interface, and one or more peripheral devices. Each peripheral device includes a BLUETOOTH device in wireless communication with the hub device and/or at least one other peripheral device. Each of the one or more peripheral devices includes a peripheral device identifier and is configured to periodically broadcast peripheral device information including the peripheral device identifier to be received by the hub device. The hub device is configured to analyze received peripheral device information and transmit a report based on the analyzed peripheral device information to a remote station. Other exemplary embodiments include a camera interface for a telematics device, a smart lock assembly for a trailer, and a trailer tracking system.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: October 16, 2018
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventor: Pranav Kumar
  • Patent number: 10096893
    Abstract: According to various aspects, exemplary embodiments are disclosed herein of patch antennas, stacked patch antenna assemblies, and vehicular antenna assemblies including the same. In exemplary embodiments, a patch antenna generally includes a dielectric substrate having a bottom, a top, and sides extending generally between the top and bottom of the dielectric substrate. A ground is along the bottom of the dielectric substrate. An antenna structure is along the top of the dielectric substrate. The antenna structure also extends at least partially along one or more sides of the dielectric substrate.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: October 9, 2018
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventor: Ahmed A. H. Ameri
  • Patent number: 10092259
    Abstract: According to various aspects, exemplary embodiments are disclosed of systems that may be used for cooling objects, such as X-ray tubes and detectors, etc. Also disclosed are exemplary embodiments of methods for cooling objects, such as X-ray tubes and detectors, etc. For example, an exemplary embodiment includes a system that can be used to cool an X-ray tube and detector with one chiller. As another example, an exemplary embodiment of a method includes using one chiller to cool an X-ray tube and detector.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: October 9, 2018
    Assignee: Laird Technologies, Inc.
    Inventor: Dan Martin Gustav Karlstedt
  • Patent number: 10087351
    Abstract: Materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a material includes at least one filler in a thermally reversible gel.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: October 2, 2018
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: Karen J. Bruzda, Jason L. Strader
  • Patent number: 10074909
    Abstract: Disclosed are exemplary embodiments of omnidirectional single-input single-output (SISO) multiband/broadband antennas. In an exemplary embodiment, an omnidirectional SISO multiband/broadband antenna generally includes a radiator element having a single piece construction with a stamped cone shape defined by multiple stamped portions.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: September 11, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: Choon Chung Su, Athanasios Petropoulos, Kok Jiunn Ng
  • Patent number: 10058015
    Abstract: According to various aspects, exemplary embodiments are disclosed of a two-piece metallic board level shield (BLS). In an exemplary embodiment, the BLS is solderable to a printed circuit board (PCB). The BLS includes a lid or cover and a fence or frame. The lid and fence are complementary in shape. The lid may be mounted onto the fence via a locking mechanism in a first position and a compressed second position, where the locking mechanism provides resistance against internal upward forces when the BLS has been compressed into a second position. The BLS may be soldered to the PCB while in the first position, and subsequently compressed into the second position after the solder has hardened.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: August 21, 2018
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: Kenneth M. Robinson, Paul W. Crotty
  • Patent number: 10023210
    Abstract: According to various aspects, exemplary embodiments are disclosed of devices, systems, and methods related to tracking location of operator control units for locomotives. In an exemplary embodiment, an operator control unit includes a user interface configured to receive one or more commands from an operator for controlling a locomotive. The operator control unit also includes a global positioning system (GPS) receiver configured to receive location information of the operator control unit, and a wireless communication device. The wireless communication device is configured to transmit command data corresponding to the one or more commands and location data corresponding to the location information to a machine control unit on the locomotive.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: July 17, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: André Brousseau, Jeremy Jovenall
  • Patent number: 10021817
    Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 10, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: Kenneth M. Robinson, Mark Fucci, Paul W. Crotty, Jr.
  • Patent number: 10008767
    Abstract: An antenna assembly generally includes an antenna module mountable to a vehicle body wall. The antenna base module may include a base, an inner (e.g., environmental protective cover, etc.) cover coupled to the base, at least one antenna element disposed within an enclosure defined by the inner cover and the base, and one or more latching members. An outer (e.g., cosmetic, styled, and/or aerodynamic, etc.) cover may include one or more snap clip members engageable with the one or more latching members when the outer cover is positioned over the inner cover. The snap clip members may include curved portions and flex points.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: June 26, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: Hasan Yasin, Hela Loudhaief
  • Patent number: 9999121
    Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: June 12, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: Mohammadali Khorrami, Paul Francis Dixon, George William Rhyne
  • Patent number: 9999122
    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: June 12, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: John Song, George William Rhyne
  • Patent number: 9979086
    Abstract: An exemplary embodiment of an multiband antenna assembly includes a printed circuit board having a plurality of elements thereon. The plurality of elements may include a radiating element, a matching element, a feed element configured to be operable as a feeding point for the multiband antenna assembly, and a shorting element configured to be operable for electrically shorting the radiating element to ground. The antenna assembly may be operable within at least a first frequency range and a second frequency range different than the first frequency range without requiring any matching lump components coupled to the printed circuit board.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: May 22, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: Kok Jiunn Ng, Tze Yuen Ng, Ting Hee Lee, Joshua Ooi Tze Meng, Ee Wei Sim, En Chi Lee, Chee Seong Por
  • Patent number: D839244
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: January 29, 2019
    Assignee: Laird Technologies, Inc.
    Inventor: Shawn Wayne Johnson