Abstract: According to various aspects, exemplary embodiments are disclosed of antenna assemblies. In an exemplary embodiment, an antenna assembly generally includes a feed network and a ground plane. Radiating dipoles or dipole radiating elements are along or on opposite sides of the feed network and the ground plane. The radiating dipoles or dipole radiating elements may be operable simultaneously and may co-locate radio frequency currents for a first frequency band and a second frequency band.

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields that include film and/or foil (e.g., electrically-conductive plastic film, metallized or metal plated film, metal foil, reinforced foil, poly-foil, etc.) covers or lids. Also disclosed are exemplary embodiments of methods relating to making EMI shielding apparatus or assemblies. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: Exemplary embodiments are provided of telematics devices and exemplary corresponding methods. In an exemplary embodiment, a telematics device generally includes a controller, a wireless communication module to transmit ignition information to a remote station, a power input terminal to sense a voltage of the battery, and an ignition input terminal to couple to an ignition line of the vehicle. The controller determines whether the ignition input terminal is coupled to an ignition line of the vehicle, and when the terminal is coupled to an ignition line, the controller determines vehicle ignition turn on and ignition turn off events by detecting voltage changes on the ignition line. When the ignition input terminal is not coupled to an ignition line of the vehicle, the controller senses the voltage of the battery of the vehicle to determine vehicle ignition turn on and turn off events based on sensed voltage changes of the battery.

Abstract: Exemplary embodiments are provided of telematics devices and exemplary corresponding methods. In an exemplary embodiment, a telematics device generally includes a controller and a wireless communication module for transmitting data to a remote station. The controller is configured to periodically obtain the speed of a vehicle, determine when the speed of the vehicle has exceeded a first speed threshold, store the monitored speed as a max speed value, and compare each successive monitoring interval speed to a previous monitoring interval speed. When the successive monitoring interval speed is greater than the max speed value, the max speed value is updated. A speeding event occurs when each successive monitoring interval speed is above the first speed threshold for a speed duration, and/or when any successive monitoring interval speed exceeds a second speed threshold.

Abstract: A thermoelectric assembly is disclosed, the assembly having a cold side and a hot side, where the hot side comprises a single fan sink and the cold side comprises dual fan sinks. Thermoelectric modules may be between the hot side and cold side and arranged in one circuit or multiple parallel circuits, and in direct thermal contact with both the hot side and the cold side. The assembly may include one or more moisture barrier measures, including a wire seal, a series of screw O-rings, and a sealing layer.

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields. In an exemplary embodiment, a board level shield (BLS) includes a fence and a lid. The fence is solderable to a printed circuit board (PCB). When the lid is engaged to the fence that has been soldered to the PCB, the BLS provides substantial electromagnetic interference (EMI) shielding protection to the components covered by the BLS. The lid may be constructed of a frame and a cover. The cover may be a film or foil. The lid may attach to the fence via a one way directional latching mechanism, which may be enhanced by the use of one or more interior downward tabs on the lid that meet one or more inward protrusions from the fence to create pressure on the lid and fence.

Abstract: Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.

Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

Abstract: Disclosed are exemplary embodiments of multiband MIMO vehicular antenna assemblies. In an exemplary embodiment, a multiband MIMO vehicular antenna assembly generally includes a chassis and an outer cover or radome. The outer cover is coupled to the chassis such that an interior enclosure is collectively defined by the outer cover and the chassis. An antenna carrier or inner radome is within the interior enclosure. The antenna carrier has inner and outer surfaces spaced apart from the chassis and the outer cover. One or more antenna elements are along and/or in conformance with the outer surface of the antenna carrier so as to generally follow the contour of a corresponding portion of the antenna carrier.

Abstract: Example embodiments of the present disclosure generally relate to automatic wireless mode switching in wireless communication devices and systems, and methods of automatic wireless mode switching. In one example embodiment, a wireless communication device generally includes a wireless communication interface configured to transmit data to a remote device via wireless communication, and a controller configured to control a mode of operation of the wireless communication device and to automatically switch the mode of operation of the wireless communication device between at least a first mode of operation and a second mode of operation. The first mode of operation is one of a client mode of operation, an access point mode of operation, an ad hoc mode of operation, a dual mode operation and a tri-mode operation. The second mode of operation is one of a dual mode operation and a tri-mode operation.

Abstract: Exemplary embodiments are disclosed of multifunctional components for electronic devices. In an exemplary embodiment, a multifunctional component generally includes a base component, such as a smart phone case (e.g., a back cover, etc.), an inner plate (e.g., a screenplate, a mid-plate, etc.). A heat spreader may be disposed on the base component. Thermal interface material and electromagnetic interference shielding may be disposed on area(s) of the heat spreader. The area(s) may correspond in mirror image relation to component(s) of a circuit board with which the multifunctional component is configured to be joined. During operation of the electronic device, the multifunctional component may draw waste heat from one area and transfer/spread the waste heat to one or more other areas of the electronic device, which may increase a temperature of these one or more other areas. This, in turn, may make device temperature more uniform.

Abstract: Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel.

Abstract: Disclosed are exemplary embodiments of omnidirectional broadband antennas. In an exemplary embodiment, an antenna generally includes a ground element, an antenna element, and an annular patch element. The antenna element may be electrically isolated from the ground element. The antenna element may include at least one portion that is substantially conical, substantially pyramidal, and/or that tapers in a longitudinal direction. The annular patch element is electrically grounded to the ground element. The annular patch element surrounds at least a portion of the antenna element and is parasitically coupled to the antenna element.

Abstract: Exemplary embodiments are provided of antennas and antenna systems including the same. In an exemplary embodiment, an antenna generally includes a radiating patch element having an annular rectangular shape. An antenna ground plane is spaced apart from the radiating patch element. A feeding element electrically coupled to the radiating patch element via proximity coupling. The antenna also includes at least two shorting elements electrically coupling the radiating patch element to the antenna ground plane. In other exemplary embodiments, the antenna systems include at least one active GPS antenna, at least one passive antenna, and an isolator.

Abstract: According to various aspects, exemplary embodiments are disclosed of systems that may be used for cooling objects, such as X-ray tubes and detectors, etc. Also disclosed are exemplary embodiments of methods for cooling objects, such as X-ray tubes and detectors, etc. For example, an exemplary embodiment includes a system that can be used to cool an X-ray tube and detector with one chiller. As another example, an exemplary embodiment of a method includes using one chiller to cool an X-ray tube and detector.

Abstract: Disclosed herein are exemplary embodiments of multilayer printed circuit board assemblies (PCBAs) that integrally define or include patch antenna radiating elements. The radiating elements may be defined or formed from electrically-conductive layers of the PCBAs. Also disclosed herein are exemplary embodiments of antenna assemblies, systems, or modules comprising such multilayer PCBAs.

Abstract: Disclosed are exemplary embodiments of omnidirectional broadband antennas and capacitively grounded cable brackets. In an exemplary embodiment, an omnidirectional broadband antenna generally includes a ground element, an antenna element, an annular element, and a cable bracket capacitively grounded to the ground element. The cable bracket is configured to allow soldering of a cable braid to the cable bracket for feeding the antenna element without direct galvanic contact between the cable braid and the ground element.

Abstract: An antenna generally includes at least two feeds and at least one open side defined between the at least two feeds. A feed point is between and/or connected to the at least two feeds. The antenna also includes shorting legs for mechanical support and electrically coupling to a ground plane.