Patents Assigned to Lintec Corporation
  • Publication number: 20220180773
    Abstract: The present invention relates to a peel detection label that is a laminate having a backing, a pattern layer formed on a part of a surface of the backing, and a pressure sensitive adhesive laminate in this order, the pressure sensitive adhesive laminate having at least an intermediate layer and a pressure sensitive adhesive layer, wherein a tensile modulus Et at 23° C. of the backing is 50 MPa or greater and 1000 MPa or less.
    Type: Application
    Filed: March 19, 2020
    Publication date: June 9, 2022
    Applicant: LINTEC CORPORATION
    Inventors: Yumiko AMINO, Naoki TAYA
  • Publication number: 20220146719
    Abstract: A reflective display body configured such that the up-down direction of display content on a display surface can be changed. The reflective display body includes a light diffusion control layer, a display device, and a reflective layer. The light diffusion control layer has a diffusion angle width of 5° or more and 80° or less in which a haze value (%) is 90% or more as measured when one surface of the light diffusion control layer is irradiated with light rays at an incident angle of ?70° to 70° with respect to the normal direction of the one surface being 0°. The light diffusion control layer has an acute angle of 7° or more and 83° or less.
    Type: Application
    Filed: November 10, 2021
    Publication date: May 12, 2022
    Applicant: LINTEC CORPORATION
    Inventors: Baku KATAGIRI, Tatsuki KURAMOTO, Tetsuya ARAZOE, Kentaro KUSAMA
  • Patent number: 11328631
    Abstract: In various embodiments, the present invention is directed to an interior-light-utilizing display obtained by laminating a reflection structure and a light diffusion film, in which the light diffusion film has an internal structure including a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index in the film. The interior-light-utilizing display provides improved luminance and is capable of stably maintaining constant display characteristics even where the incident angle of the external light changes.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: May 10, 2022
    Assignee: LINTEC Corporation
    Inventors: Kentaro Kusama, Tatsuki Kuramoto
  • Patent number: 11322385
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: May 3, 2022
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Patent number: 11315899
    Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2??(a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m?n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: April 26, 2022
    Assignees: LINTEC CORPORATION, NICHIA CORPORATION
    Inventors: Akiko Umeda, Manabu Miyawaki, Hidekazu Nakayama, Hiroki Inoue, Toshifumi Imura
  • Patent number: 11307611
    Abstract: A reflective display body includes a light diffusion control layer and a reflective layer. The light diffusion control layer has a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The regions having the relatively high refractive index extend from one surface side toward the other surface side of the light diffusion control layer, and a straight line parallel to the extending direction is tilted with respect to the thickness direction of the light diffusion control layer. When a vector C is obtained by projecting a vector, which is parallel to the extending direction and directed from the surface side distal to the display surface of the reflective display body toward the display surface side, onto the display surface, the smallest angle among three angles between vector C and vectors D1 to D3 is more than 0° and 45° or less.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: April 19, 2022
    Assignee: LINTEC CORPORATION
    Inventors: Baku Katagiri, Kentaro Kusama, Tatsuki Kuramoto
  • Patent number: 11285536
    Abstract: A film-shaped fired material of the present invention is a film-shaped fired material 1 which contains sinterable metal particles 10 and a binder component 20, in which a time (A1) after the start of a temperature increase, at which a negative gradient is the highest, in a thermogravimetric curve (TG curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere and a maximum peak time (B1) in a time range of 0 seconds to 2160 seconds after the start of a temperature increase in a differential thermal analysis curve (DTA curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere using alumina particles as a reference sample satisfy a relationship of “A1<B1<A1+200 seconds” and a relationship of “A1<2000 seconds”.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: March 29, 2022
    Assignee: LINTEC Corporation
    Inventors: Isao Ichikawa, Hidekazu Nakayama
  • Patent number: 11279512
    Abstract: A sheet pasting device EA which pastes an adhesive sheet AS on a work WK includes: a feeding unit 10 which feeds the adhesive sheet AS; a holding unit 20 which holds the adhesive sheet AS fed by the feeding unit 10, on a holding surface 21A of a holding member 21; a press unit 30 which moves the holding unit 20 holding the adhesive sheet AS and presses the adhesive sheet AS against an attachment surface WK1 of the work WK to paste the adhesive sheet AS; and an attachment surface posture detecting unit 40 which detects at least one of the direction and the position of the attachment surface WK1 of the work WK moving relative to the sheet pasting device EA.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: March 22, 2022
    Assignee: LINTEC CORPORATION
    Inventor: Toshihiro Fujita
  • Patent number: 11267992
    Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: March 8, 2022
    Assignee: LINTEC Corporation
    Inventors: Isao Ichikawa, Hidekazu Nakayama, Akinori Sato
  • Publication number: 20220045258
    Abstract: A method for producing an intermediate for thermoelectric conversion modules may avoid a supporting substrate, enabling annealing of a thermoelectric semiconductor material in a form avoiding a joint to an electrode, and enabling annealing of a thermoelectric semiconductor material at an optimum temperature. Such methods may produce an intermediate for thermoelectric conversion modules containing a P-type thermoelectric and an N-type thermoelectric element layer of a thermoelectric semiconductor composition, and include (A) forming the P-type thermoelectric element layer and the N-type thermoelectric element layer on a substrate; (B) annealing the P-type and N-type thermoelectric element layer formed in (A); (C) forming a sealant layer containing a curable resin or a cured product thereof, on the P-type and N-type thermoelectric element layer annealed in (B); and (D) peeling the P-type and the N-type thermoelectric element layer and also the sealant layer formed in (B) and (C) from the substrate.
    Type: Application
    Filed: October 2, 2019
    Publication date: February 10, 2022
    Applicant: LINTEC CORPORATION
    Inventors: Yuta SEKI, Kunihisa KATO, Tsuyoshi MUTO, Yuma KATSUTA
  • Publication number: 20220033600
    Abstract: A writing feel improving sheet comprising a base material and a writing feel improving layer with which a touch pen is brought into contact, wherein when a touch pen having a pen tip of 0.5 mm diameter is used to bring the pen tip into contact with a surface of the writing feel improving layer with which the touch pen is brought into contact and the touch pen is then linearly slid at a speed of 1.6 mm/second while applying a load of 200 g to the touch pen and maintaining an angle formed between the touch pen and the surface at 45°, a difference between a maximum value and a minimum value of frictional force generated between the pen tip and the surface is 80 mN or more and 300 mN or less, wherein the frictional force is measured between a point at which a sliding distance is 10 mm and a point at which the sliding distance is 100 mm. The writing feel improving sheet makes it possible to well reproduce the writing feel experienced when writing on paper with a ballpoint pen.
    Type: Application
    Filed: December 12, 2019
    Publication date: February 3, 2022
    Applicant: LINTEC CORPORATION
    Inventors: Hiroki HOSHINO, Tomoo ORUI
  • Patent number: 11219946
    Abstract: The present invention provides a film-shaped firing composition with excellent printability, a method of producing a film-shaped firing material obtained by using the firing material composition, and a method of producing a film-shaped firing material with a support sheet. A paste-like firing material composition is provided, including sinterable metal particles (10), a binder component (20), and a solvent having a relative evaporation rate of 4.0 or less with respect to butyl acetate, in which a content of the solvent is in a range of 12% to 50% by mass with respect to a total mass of the firing material composition.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: January 11, 2022
    Assignee: LINTEC CORPORATION
    Inventors: Takeshi Mori, Hidekazu Nakayama, Isao Ichikawa, Yukiharu Nose
  • Patent number: 11220091
    Abstract: A roll and a method for producing a roll which are capable of effectively preventing tunneling are provided. A roll includes a core having a tubular shape and a laminate wound around the core. The laminate includes a process film, a surface coat layer, a substrate layer, an adhesive layer, and a release liner, in this order, in a laminating direction. The process film is formed from at least one member selected from polyethylene terephthalate (PET), polyolefins, and polyvinyl chloride (PVC). The surface coat layer is formed from a fluorine resin. The release liner is formed from polyethylene terephthalate (PET). The core is formed from an acrylonitrile-butadiene-styrene copolymer resin (ABS) or polypropylene (PP).
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: January 11, 2022
    Assignee: LINTEC Corporation
    Inventors: Toshimitsu Kanda, Mayu Kaneko
  • Publication number: 20210391523
    Abstract: A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.
    Type: Application
    Filed: October 2, 2019
    Publication date: December 16, 2021
    Applicant: LINTEC CORPORATION
    Inventors: Tsuyoshi MUTO, Kunihisa KATO, Taku NEMOTO, Wataru MORITA, Yuta SEKI
  • Publication number: 20210376218
    Abstract: Provided are: a method for producing a chip of a thermoelectric conversion material that enables annealing treatment of a thermoelectric conversion material in the form not having a junction with an electrode, and enables annealing of a thermoelectric semiconductor material at an optimum annealing temperature; and a method for producing a thermoelectric conversion module using the chip (13).
    Type: Application
    Filed: August 27, 2019
    Publication date: December 2, 2021
    Applicant: LINTEC CORPORATION
    Inventors: Masaya TODAKA, Kunihisa KATO, Tsuyoshi MUTO, Yuma KATSUTA
  • Patent number: 11183416
    Abstract: The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E60) of 20-1000 MPa at 60° C.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: November 23, 2021
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda, Katsuhiko Horigome
  • Patent number: 11167985
    Abstract: A drawing apparatus includes a support for supporting a part of the grown form and a drive unit for causing a relative movement of the support and the grown form. The support includes a plurality of support units arranged in a width direction of the grown form orthogonal to a drawing direction of a plurality of extended forms, the plurality of support drawing the plurality of extended forms from the single grown form.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: November 9, 2021
    Assignee: LINTEC CORPORATION
    Inventor: Kazuhisa Yamaguchi
  • Publication number: 20210340411
    Abstract: A release liner which makes it difficult for an adhesive layer to impair slidability and makes it easy to exhibit an adhesive force suitably, a method of producing a release liner, an adhesive sheet, and a method of producing an adhesive sheet. A release liner has a surface provided with a ridge portion extending linearly, and on the surface, a plurality of recesses having different depths are randomly formed in a surface direction and are continuously connected.
    Type: Application
    Filed: September 4, 2019
    Publication date: November 4, 2021
    Applicant: LINTEC Corporation
    Inventors: Takuma OKUBO, Kenji OHATA, Akihito YAMADA
  • Patent number: 11162003
    Abstract: Disclosed is an adhesive composition having components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst. Also provided is a sealing sheet composed of two release films and an adhesive layer sandwiched between the release films, wherein the adhesive layer is made by using the adhesive composition and has a thermosetting property. Also disclosed is a sealed body obtained by sealing a seal subject with the sealing sheet. The adhesive composition has excellent adhesion strength, a sealing sheet made by using the adhesive composition and having an adhesive layer is excellent in sealing performance, and a sealed body obtained by sealing a seal subject with the sealing sheet.
    Type: Grant
    Filed: November 24, 2016
    Date of Patent: November 2, 2021
    Assignee: LINTEC CORPORATION
    Inventors: Kenta Nishijima, Tatsuki Hasegawa
  • Publication number: 20210328124
    Abstract: The present invention is to provide a method of producing a thermoelectric conversion device having a thermoelectric element layer with excellent shape controllability and capable of being highly integrated. The present invention relates to a method of producing a thermoelectric conversion device including a thermoelectric element layer formed of a thermoelectric semiconductor composition containing a thermoelectric semiconductor material on a substrate, the method including a step of providing a pattern frame having openings on a substrate; a step of filling the thermoelectric semiconductor composition in the openings; a step of drying the thermoelectric semiconductor composition filled in the openings, to form a thermoelectric element layer; and a step of releasing the pattern frame from the substrate.
    Type: Application
    Filed: August 27, 2019
    Publication date: October 21, 2021
    Applicant: LINTEC CORPORATION
    Inventors: Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTO, Yuma KATSUTA