Abstract: A laminate used under an environment irradiated with external light includes a light diffusion control film having an internal structure in the film. The internal structure includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The laminate further includes an ultraviolet absorbing layer located further on the external light incident side than the light diffusion control film. The light diffusion control film contains a hindered amine-based compound.

Abstract: A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E?04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

Abstract: A pressure sensitive adhesive composition containing: a (meth)acrylic ester polymer (A) including an alkyl (meth)acrylate monomer (a1) and a reactive functional group-containing monomer (b) as monomer units that constitute the polymer; and an inorganic filler (C), wherein the carbon number of an alkyl group in the alkyl (meth)acrylate monomer (a1) is 6 or more and the alkyl group is linear. In the pressure sensitive adhesive composition, the inorganic filler can be uniformly dispersed in a short time even when a dispersant is not contained.

Abstract: A thermoelectric conversion module having a further improved thermoelectric performance is provided. The thermoelectric conversion module includes: a base material; and a thermoelectric element layer including a thermoelectric semiconductor composition, wherein the thermoelectric semiconductor composition includes a thermoelectric semiconductor material, a heat resistant resin A, and an ionic liquid and/or inorganic ionic compound, and wherein the base material has a thermal resistance of 0.35 K/W or less.

Abstract: A release liner which makes it difficult for an adhesive layer to impair slidability and makes it easy to exhibit an adhesive force suitably, a method of producing a release liner, an adhesive sheet, and a method of producing an adhesive sheet. A release liner has a surface provided with a ridge portion extending linearly, and on the surface, a plurality of recesses having different depths are randomly formed in a surface direction and are continuously connected.

Abstract: A sheet pasting device EA includes: a sheet feed unit 10 that feeds an adhesive sheet AS; and a press unit 20 that has a press roller 25 for pressing the adhesive sheet AS against a work WK and that pastes the adhesive sheet AS on the work WK by pressing the adhesive sheet AS against the work WK moving relative to the press roller 25, the press unit 20 bringing the press roller 25 into contact with an attachment surface WK1 of the work WK to displace the press roller 25 and rotating the press roller 25 on the attachment surface WK1, at a stage before pressing the adhesive sheet AS against the work WK using the press roller 25.

Abstract: A pressure sensitive adhesive composition containing: a (meth)acrylic ester polymer including butyl methacrylate and a reactive functional group-containing monomer as monomer units that constitute the polymer; and an inorganic filler, a pressure sensitive adhesive obtained by crosslinking the pressure sensitive adhesive composition, and a pressure sensitive adhesive sheet comprising at least a pressure sensitive adhesive layer that is formed from the above pressure sensitive adhesive composition. The above pressure sensitive adhesive composition allows the inorganic filler to be uniformly dispersed in a short time even when a dispersant is not contained. Moreover, in the above pressure sensitive adhesive and the pressure sensitive adhesive layer of the pressure sensitive adhesive sheet, the inorganic filler is uniformly dispersed.

Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: A method for producing a chip of a thermoelectric conversion material formed of a thermoelectric semiconductor composition, including a step of forming a sacrificial layer on a substrate, (B) a step of forming a thermoelectric conversion material layer of a thermoelectric semiconductor composition on the sacrificial layer, (C) a step of annealing the thermoelectric conversion material layer, (D) a step of transferring the annealed thermoelectric conversion material layer to a pressure-sensitive adhesive layer, (E) a step of individualizing the thermoelectric conversion material layer into individual chips of a thermoelectric conversion material, and (F) a step of peeling the individualized chips of a thermoelectric conversion material; and a method for producing a thermoelectric conversion module using the chip produced according to the production method.

Abstract: A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.

Abstract: The present invention is to provide a method of producing a thermoelectric conversion device having a thermoelectric element layer with excellent shape controllability and capable of being highly integrated. The present invention relates to a method of producing a thermoelectric conversion device including a thermoelectric element layer formed of a thermoelectric semiconductor composition containing a thermoelectric semiconductor material on a substrate, the method including a step of providing a pattern frame having openings on a substrate; a step of filling the thermoelectric semiconductor composition in the openings; a step of drying the thermoelectric semiconductor composition filled in the openings, to form a thermoelectric element layer; and a step of releasing the pattern frame from the substrate.

Abstract: A light diffusion control member includes a first light diffusion control layer and a second light diffusion control layer. The first light diffusion control layer and the second light diffusion control layer each has a regular internal structure that includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The first light diffusion control layer and the second light diffusion control layer are laminated so that an angle between two respective vectors determined based on the regular internal structure in the first light diffusion control layer and the second light diffusion control layer is more than 0° and 90° or less.

Abstract: A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

Abstract: A high-frequency dielectric heating adhesive sheet requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.

Abstract: The present disclosure provides an electrically conductive sheet for use in three-dimensional molding including: a pseudo-sheet structure in which plural electrically conductive linear bodies extending unidirectionally are arranged spaced apart from each other; and a resin protective layer provided on a surface of the pseudo-sheet structure. In the above mentioned electrically conductive sheet, each of the electrically conductive linear bodies in the pseudo-sheet structure includes: a first portion formed in a wave pattern having a wavelength ?1 and an amplitude A1; and a second portion formed in a wave pattern having a wavelength ?2 and an amplitude A2, at least one of which is different from the wavelength ?1 or the amplitude A1 of the first portion.

Abstract: Provided is a roll body capable of effectively suppressing the occurrence of a telescope phenomenon even if the ambient temperature during transportation and storage of the roll body becomes higher than that during production of the roll body. A roll body RB according to the present invention configured by winding a belt-shaped web around a winding core that thermally expands or contracts due to an influence of a surrounding environment is characterized in that a linear expansion coefficient of the web in a thickness direction is in a range of 60 to 150 times a linear expansion coefficient of the web in a longitudinal direction, and the winding core has a linear expansion coefficient in a range of 20×10?6/K to 100×10?6/K and a Young's modulus in a range of 0.2 GPa to 0.5 GPa.

Abstract: The invention provides a method of dismantling an adhesion structure including a pair of adherends made of the same material or different materials and a dielectric adhesive sheet interposed between the pair of adherends and bonding the pair of adherends to each other. The method includes: a first step of heating the dielectric adhesive sheet by dielectric heating; and a second step of applying an external force to at least one of the pair of adherends or the dielectric adhesive sheet to separate the pair of adherends from the dielectric adhesive sheet.

Abstract: The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.

Abstract: A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

Abstract: This gas barrier laminate comprises a base layer; a gas barrier layer laminated on one surface (A) of the base layer, directly or with another layer sandwiched therebetween; a protective film (?) laminated directly on the gas barrier layer; and a protective film (?) laminated on a surface (B) opposite to the surface (A) of the base layer, directly or with another layer sandwiched therebetween, wherein the gas barrier layer contains a specific inorganic compound, and an adhesion at the time of peeling the protective film (?) and an adhesion at the time of peeling the protective film (?) under specific conditions are both less than or equal to specific values.