Abstract: Provided are: a method for producing a chip of a thermoelectric conversion material that enables annealing treatment of a thermoelectric conversion material in the form not having a junction with an electrode, and enables annealing of a thermoelectric semiconductor material at an optimum annealing temperature; and a method for producing a thermoelectric conversion module using the chip (13).

Abstract: A writing feel improving sheet comprising a base material and a writing feel improving layer with which a touch pen is brought into contact, wherein when a touch pen having a pen tip of 0.5 mm diameter is used to bring the pen tip into contact with a surface of the writing feel improving layer with which the touch pen is brought into contact and the touch pen is then linearly slid at a speed of 1.6 mm/second while applying a load of 200 g to the touch pen and maintaining an angle formed between the touch pen and the surface at 45°, a difference between a maximum value and a minimum value of frictional force generated between the pen tip and the surface is 80 mN or more and 300 mN or less, wherein the frictional force is measured between a point at which a sliding distance is 10 mm and a point at which the sliding distance is 100 mm. The writing feel improving sheet makes it possible to well reproduce the writing feel experienced when writing on paper with a ballpoint pen.

Abstract: A thermoelectric conversion module having a further improved thermoelectric performance is provided. The thermoelectric conversion module includes: a base material; and a thermoelectric element layer including a thermoelectric semiconductor composition, wherein the thermoelectric semiconductor composition includes a thermoelectric semiconductor material, a heat resistant resin A, and an ionic liquid and/or inorganic ionic compound, and wherein the base material has a thermal resistance of 0.35 K/W or less.

Abstract: Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the

Abstract: A device EA that manufactures a projection-bearing body CB in which projections CV are formed comprises: a material support unit 20 that executes a material support step of supporting a base material BM, by a support member 22 having a support surface 22A in which recesses 22B corresponding to the projections CV are formed; a press unit 30 that executes a pressing step of pressing the base material BM in a direction toward the support surface 22A to fill the plastic material PM in the recesses 22B and forming the projections CV from the plastic material to form the projection-bearing body CB; and a separating unit 60 that executes a separating step of separating the projection-bearing body CB from the support member 22. The support member 22 has a structure dividable into a plurality of support members, and the separating unit 60 includes an individually separating unit 63 that separates the divided first and second support member 22?, 22? individually from the projection-bearing body CB.

Abstract: A viewing angle control film having an incident light diffusion angle region, wherein when the viewing angle control film is installed vertically to a ground surface, the incident light diffusion angle region in an up-down direction does not include a front face 0° in a horizontal direction with respect to the ground surface, and a total luminous transmittance at the front face 0° is 85% or more and 100% or less. The viewing angle control film preferably has a louver-shaped internal structure including a plurality of regions having a relatively high refractive index (plate-like high refractive index regions) in a region having a relatively low refractive index (low refractive index region).

Abstract: A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.

Abstract: A pressure sensitive adhesive sheet for batteries that includes a base material, a vapor-deposition insulating film provided on one surface side of the base material, and a pressure sensitive adhesive layer provided on a surface side of the vapor-deposition insulating film opposite to the base material.

Abstract: Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric

Abstract: Provided are a conductive structure having low contact resistance, the conductive structure including a cured layer formed by curing a curable composition, a conductive linear body fixed by the cured layer, and a pair of electrodes placed so as to directly contact the conductive linear body, wherein the curable composition contains a cationic polymerizable compound and a photocationic polymerization initiator, and the cured layer fixes the electrodes; a manufacturing method for the conductive structure; and article including the conductive structure; and a manufacturing method for the article.

Abstract: A curable resin film of the present invention forms a first protective film (1a) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 ?m, an average diameter of 60 to 500 ?m, and an average pitch of 100 to 800 ?m, heating the attached curable resin film at 100° C. to 200° C. for 0.

Abstract: The present invention is a gas barrier laminate comprising a base unit that comprises a base and a modification-promoting layer, and a gas barrier layer that is formed on a side of the modification-promoting layer with respect to the base unit, the modification-promoting layer having a modulus of elasticity at 23° C. of less than 30 GPa, the base unit having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 1.0 g/(m2·day) or less, and the gas barrier layer being a layer formed by applying a modification treatment to a surface of a layer that comprises a polysilazane-based compound and is formed on the side of the modification-promoting layer with respect to the base unit, and a method for producing the gas barrier laminat, and an electronic device member comprising the gas barrier laminate, and an electronic device comprising the electronic device member.

Abstract: An object is to provide a film for latex ink having a latex ink-receiving layer containing an acrylic resin, the latex ink-receiving layer having excellent adhesion to both a printed portion using latex ink and a base material. Then, the object is achieved by the following: a film for latex ink having a laminate structure in which a latex ink-receiving layer (X) and a base material (Y) are stacked, in which the latex ink-receiving layer (X) is formed of a resin composition (x1) containing an acrylic resin (A) having a cross-linkable functional group and a cross-linking agent (B), and the cross-linking agent (B) contains an isocyanurate compound (B1) and a modified product (B2) of the isocyanurate compound.

Abstract: An adhesive sheet (1) comprising an adhesive layer (11) composed of an adhesive having active energy ray curability and ultraviolet ray absorbability, wherein when one surface of the adhesive layer (11) is irradiated with ultraviolet rays having a light amount of 2000 mJ/cm2 to cure the adhesive layer (11) and an infrared absorption spectrum is then measured by a total reflection measurement method for each of an irradiated surface and a non-irradiated surface, the maximum value of the absolute value of absorbance is 0.0001 to 0.

Abstract: An external light use type display body including: a light diffusion control layer; a display layer; and a reflective layer. The light diffusion control layer has a regular internal structure that comprises a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The reflective layer has a patterned indented structure when at least one cross section cut in a thickness direction is viewed. When the entrance plane is irradiated with light rays that travel on the light ray traveling plane with a predetermined incident angle while being scanned along an intersection line of the light ray traveling plane and the entrance plane, the ratio of the light rays satisfying the following Formula (1) or Formula (2) is 50% or more.

Abstract: A laminate used under an environment irradiated with external light includes a light diffusion control film having an internal structure in the film. The internal structure includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The laminate further includes an ultraviolet absorbing layer located further on the external light incident side than the light diffusion control film. The light diffusion control film contains a weakly basic hindered amine-based compound having a carbonate skeleton.

Abstract: An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment.

Abstract: A pressure sensitive adhesive composition that includes: a (meth)acrylic ester polymer (A) containing, as a monomer unit constituting the polymer, an ethylene carbonate-containing monomer having an ethylene carbonate structure represented by Formula (1) below; and an ionic compound (B).

Abstract: This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.

Abstract: A thermoelectric conversion module including, a first substrate having a first electrode, a second substrate having a second electrode, a chip of a thermoelectric conversion material made from a thermoelectric semiconductor composition, a first bonding material layer made from a first bonding material and bonding one surface of the chip of the thermoelectric conversion material and the first electrode, and a second bonding material layer made from a second bonding material and bonding another surface of the chip of the thermoelectric conversion material and the second electrode. A melting point of the second bonding material is lower than a melting point of the first bonding material, or the melting point of the second bonding material is lower than a curing temperature of the first bonding material.