Abstract: A solid electrolyte contains: a copolymer having a constituent unit represented by a formula (1) below and a constituent unit represented by a formula (2) below; and a metal salt. In the formula (1), m is 2 or 3, and R1 each independently represent a hydrogen atom or a methyl group. In the formula (2), n is 2 or 3, and R2 each independently represent a hydrogen atom or a methyl group.

Abstract: The invention is a curable composition comprising the following component (A), component (B) and component (C), Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1) R1SiO3/2??(a-1) Component (B): a particulate having an average primary particle diameter of 5 to 40 nm Component (C): a particulate having an average primary particle diameter of larger than 0.04 ?m to 8 ?m, and a method for producing the curable composition, and a cured product obtained by curing the curable composition, and a method for using the curable composition as an adhesive for an optical element-fixing material, and a method for using the curable composition as a sealant for an optical element-fixing material. One aspect of the curable composition according to the invention can provide a cured product excellent in adhesiveness, peeling resistance and heat resistance, and a curable composition excellent in workability in coating process.

Abstract: The invention is a laminate comprising at least a base layer, a gas barrier layer, and a layer composed of a cured product of an energy-curable resin, wherein: the gas barrier layer is laminated directly or via another layer on one side of the base layer; and the layer composed of the cured product of the energy-curable resin is laminated directly or via another layer on a side opposite to the gas barrier layer of the base layer. According to the present invention, there are provided a laminate excellent in gas barrier properties and unlike to cause a curl and a thermal contraction even when a thermal history is given so as to be suitably applicable to a sticking process to electronic devices, a member for electronic devices composed of the laminate, and an electronic device equipped with the member for electronic devices.

Abstract: This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI1) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index (YI2) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: A composite including a heat conformable polymer and a nanofiber sheet is disclosed. The heat conformable polymer can be a hot melt adhesive, and the combination can provide an electrically conductive hot melt adhesive composite. The nanofiber layer is protected and the composite is conformable and/or can be adhered to a variety of surfaces.

Abstract: An electrically peelable pressure sensitive adhesive sheet has a pressure sensitive adhesive layer formed of an electrically peelable pressure sensitive adhesive composition comprising an acrylic copolymer (A) comprising 1 to 99 mass % of a constituent unit (a1) derived from a compound represented by the following general formula (a1), and a surfactant (B). The electrically peelable pressure sensitive adhesive sheet has high adhesion before voltage application, but the adhesion can be effectively decreased by voltage application for a short time. wherein R1 represents a hydrogen atom or a methyl group, R2 represents an alkylene group having 1 to 5 carbon atoms that is unsubstituted or has a substituent, and R3 represents an alkyl group having 1 to 8 carbon atoms that is unsubstituted or has a substituent; and a value of n is an integer of 1 or more.

Abstract: Provided is a pressure sensitive adhesive sheet including a resin layer that is a multilayer structure containing at least a layer (X?), a layer (Y1), and a layer (X?) laminated in this order, a surface (?) of the layer (X?) of the resin layer having pressure sensitive adhesiveness, at least a constitutional component contained in the layer (Y1) being different from constitutional components contained in the layer (X?) and the layer (X?), on the prescribed cross section (P1) of the pressure sensitive adhesive sheet, in a range of 250 ?m in a horizontal direction freely-selected, a difference between a maximum value and a minimum value of the layer (X?) being 3.00 ?m or more, and a difference between a maximum value and a minimum value of the layer (Y1) being 5.00 ?m or more.

Abstract: [Problems] Objects include providing a cover film for testing which can be well fixed to a substrate having a groove and in which a pressure sensitive adhesive does not invade into the groove, providing a testing member comprising the cover film for testing, and providing a method of manufacturing the cover film for testing. [Solution] The cover film for testing (1, 2) comprises a base material (10) and a pressure sensitive adhesive layer (20) laminated on one surface side of the base material (10). The cover film for testing (1, 2) has a region in which the pressure sensitive adhesive layer (20) does not exist in the plan view.

Abstract: Provided are a pressure sensitive adhesive sheet including, on a substrate, a resin layer containing a resin which is a resin layer containing a resin part (X) containing a resin as a main component and a particle part (Y) consisting of fine particles, at least a surface (?) of the resin layer on the side opposite to the side thereof on which the substrate is provided, having pressure sensitive adhesiveness, wherein a bending stress coefficient k in the MD direction of the substrate is 20 N·mm or less, a 10% elongation strength in the MD direction thereof is 260 N/15 mm or less, and concave portions satisfying specified requirements are included on the surface (?) of the resin layer; and a method for producing the pressure sensitive adhesive sheet.

Abstract: A pressure sensitive adhesive sheet including, on a substrate or a release material, a resin layer, at least a surface (?) of the resin layer on the opposite to the side on which the substrate or release material is provided having pressure sensitive adhesiveness, wherein a concave portion and a flat face exist on the surface (?) of the resin layer, and a width of the concave portion observed from the side of the surface (?) is non-uniform, and in a region (D) of 8 mm in length×10 mm in width as freely-selected on the surface (?), a concave portion having an area of 70 to 99.99% relative to 100% of a total area of the concave portions existing in the region (D) exists.

Abstract: The present invention provides: a gas barrier laminate comprising a base, a primer layer, and a gas barrier layer, the primer layer and the gas barrier layer being sequentially stacked on at least one side of the base, the primer layer having a modulus of elasticity at 90° C. of 1.6 GPa or more, and a coefficient of static friction between a surface of one side of the gas barrier laminate and a surface of the other side of the gas barrier laminate being 0.35 to 0.8; a method for producing the gas barrier laminate; an electronic device member comprising the gas barrier laminate; and an electronic device.

Abstract: Provided is a pressure sensitive adhesive sheet including a resin layer on a substrate or a release material, at least a surface (?) of the resin layer on the side opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein a concave portion and plural flat faces having an irregular shape exist in a region (Dc) surrounded by an arbitrarily predetermined circle on the surface (?) of the resin layer; and with respect to one or more flat faces (S) among the plural flat faces, the one or more flat faces (S) excluding flat faces having a cumulative relative frequency of 30% or less determined by adding the relative frequency from the respective flat faces with a smaller area, an rMAX value of the flat faces (S) calculated from specified operations is 0.60 or less.

Abstract: Provided is a pressure sensitive adhesive sheet for tires that enables continuous and efficient labeling on tires using a labeling apparatus. The pressure sensitive adhesive sheet includes a release material (C), a first pressure sensitive adhesive layer (B1), a first substrate (A1), a second pressure sensitive adhesive layer (B2), and a second substrate (A2), in this order, and satisfies Requirement (1): in a planar view of the pressure sensitive adhesive sheet for tires, the outline of the first pressure sensitive adhesive layer (B1) exists inside the outline of the second substrate (A2), and Requirement (2): the shortest distance (X) between the outline of the second substrate (A2) and the outline of the second pressure sensitive adhesive layer (B2) is 0.35 mm or more.

Abstract: Provided are an electrode material for thermoelectric conversion modules capable of preventing cracking and peeling of electrodes that may occur at the bonding parts of a thermoelectric element and an electrode under high-temperature conditions to thereby maintain a low resistance at the bonding parts, and a thermoelectric conversion module using the material.

Abstract: The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

Abstract: A pressure sensitive adhesive sheet is provided which comprises a base material having insulation properties, an inorganic filler-containing resin layer provided at least at one side of the base material and containing an insulating inorganic filler, and a pressure sensitive adhesive layer provided as an outermost layer of at least one surface. According to such a pressure sensitive adhesive sheet, insulation properties can be ensured even when the base material undergoes carbonization and/or combustion/decomposition due to high temperatures and insulation breakdown occurs in the base material.

Abstract: An actuator which is formed of a fibrous polymer material configured with a polymer, and includes a twist mark on an outermost surface of the fibrous polymer material, in which an angle x at which the twist mark is inclined with respect to a fiber axis of the fibrous polymer material, and an angle y at which the twist mark inclined with respect to a fiber axis of a fiber at the time of twisting the fiber configured with the polymer configuring the fibrous polymer material by adding a tensile stress of an tensile elastic modulus of the fiber×4.5×10?3 under an environment of 25° C. up to a limitation on which coiling occurs or a limitation on which a breakage occurs have a relationship of x>y+0.5.

Abstract: A pressure sensitive adhesive sheet, containing a resin layer provided on a substrate or a release material. The resin layer includes a resin part (X) containing as a main component a hydrocarbon resin, and a particle part (Y) consisting of fine particles containing silica particles. At least a surface (?) of the resin layer opposite to the side of the substrate or the release material has pressure sensitive adhesiveness. The resin layer contains a multilayer structure having a layer (X?) and a layer (Y1) in this order in the thickness direction from the side of the surface (?). An intensity ratio in the layer (X?) is less than 0.10, and an intensity ratio in the layer (Y1) is 0.10 or more. The surface (?) has concave portions of irregular shapes.

Abstract: A base film for sheets for semiconductor wafer processing, comprising a resin layer (A) and a resin layer (B) laminated on one surface of the resin layer (A), wherein one surface of the base film for sheets for semiconductor wafer processing comprises a surface of the resin layer (B), the resin layer (A) contains a thermoplastic elastomer having a Vicat softening point of 50° C. or higher and 87° C. or lower, the resin layer (B) contains a thermoplastic elastomer having a Vicat softening point of 91° C. or higher and 220° C. or lower, and a thickness t of the base film for sheets for semiconductor wafer processing and a thickness tA of the resin layer (A) satisfy the Formulae (1) t?150 ?m and (2) tA/t?78%.

Abstract: An electrically peelable pressure sensitive adhesive composition, which contains an acrylic polymer (A), a (poly)alkylene polyol (B) having a number average molecular weight of no greater than 2000, and an ammonium salt (C), has a high adhesiveness before voltage application, but the adhesiveness can decrease effectively by voltage application for a short time.