Abstract: The present invention is to provide a thermoelectric conversion module capable of maintaining a thermoelectric performance and revealing excellent insulation properties and a method of producing the same. Provided are a thermoelectric conversion module including a heat dissipation layer via an insulating layer on at least one face of a thermoelectric element layer being one in which a p-type thermoelectric element layer and an n-type thermoelectric element layer are alternately arranged to be adjacent to each other in the in-plane direction and disposed in series, wherein the insulating layer has an elastic modulus at 23° C. of 0.1 to 500 GPa, and a method of producing the same.

Abstract: A discrete piece forming device EA that forms discrete pieces CP by dividing a work WF includes: a modified part forming unit 10 which forms modified parts MT in the work WF having a pre-pasted adhesive sheet AS containing swell grains SG that are swollen by the application of predetermined energy IR, to form, in the work WF, predefined discrete piece areas WFP each surrounded by the modified parts MT; and a dividing unit 20 which divides the work WF into pieces by forming, in the work WF, cracks CK starting from the modified parts MT by applying external force to the work WF, to form the discrete pieces CP. The dividing unit 20 applies the energy IR to parts of the adhesive sheet AS to swell the swell grains SG contained in adhesive sheet parts ASP to which the energy IR has been applied, thereby displacing the predefined discrete piece areas WFP pasted on the adhesive sheet parts ASP to form the discrete pieces CP.

Abstract: A discrete piece manufacturing method capable of simplifying a discrete piece manufacturing process includes: a sheet pasting step PC1 of pasting, on a work WF, an adhesive sheet AS containing swell grains SG that swell when predetermined energy IR is applied; a modified part forming step PC2 of, on a subsequent stage of the sheet pasting step PC1, forming modified parts MT in the work WF to form, in the work WF, predefined discrete piece areas WFP each surrounded by the modified parts MT; and an adhesion reducing step PC3 of reducing adhesion of the adhesive sheet AS to the work WF.

Abstract: The present invention relates to a substrate for release sheet including a support, an adhesion layer (X1), and a resin layer (Y1) containing polyethylene having a density of 930 kg/m3 or more and 960 kg/m3 or less in this order, wherein convex portions are present on the surface of the resin layer (Y1), and a difference in height of the convex portions is 0.5 ?m or more.

Abstract: A drawing apparatus, which draws carbon nanotubes from a grown form produced by growing carbon nanotubes, includes a holder for holding a part of the grown form by a holding member and a drive unit for causing a relative movement of the grown form and the holder. The holder includes a winding unit for winding a part of the grown form around the holding member.

Abstract: The present invention relates to a peel detection label that is a laminate including a backing, a pattern layer formed in a part of the surface of the backing, and a pressure sensitive adhesive laminate having at least a pressure sensitive adhesive layer (X) and a substrate layer (Y) laminated in this order thereon, and satisfying the following requirement (1), wherein an elastic modulus of the substrate layer (Y) is 10 MPa or more and 800 MPa or less: Requirement (1): On attaching the peel detection label onto an adherend and then peeling it from the adherend, interfacial peeling occurs between the backing and the pattern layer, whereby the presence or absence of peeling of the peel detection label from the adherend becomes visually detectable.

Abstract: The pressure sensitive adhesive tape for semiconductor processing of the present invention is a pressure sensitive adhesive tape for semiconductor processing, which, in a step of grinding a back face of a semiconductor wafer having a groove formed on a front face thereof or having a modified region formed therein to singulate the semiconductor wafer into semiconductor chips, is stuck on the front face of the semiconductor wafer and used, the pressure sensitive adhesive tape for semiconductor processing including a base, a buffer layer provided on one face of the base, and a pressure sensitive adhesive layer provided on the other face of the base, and having a ratio (D2/D1) of a thickness (D2) of the buffer layer to a thickness (D1) of the base of 0.7 or less and an indentation depth (X) of the front face on the buffer layer side of 2.5 ?m or less.

Abstract: The present invention relates to a liquid-repellent composition containing a tetrafunctional silane-based compound having a specified structure and a trifunctional silane-based compound having a specified structure as well as a metal catalyst and satisfying a formula (I): 12?x?64, x represents a ratio of a molar amount of the component (A) to a molar amount of the component (B) (molar ratio), a liquid-repellent sheet including a liquid-repellent layer formed of the foregoing liquid-repellent composition, and production methods of the same.

Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.

Abstract: [Problems] An object is to provide a pressure sensitive adhesive composition, a pressure sensitive adhesive sheet for batteries, and a lithium-ion battery in which good adhesive strength is exhibited to an adherend and the pressure sensitive adhesive is less likely to dissolve into an electrolyte solution even when the pressure sensitive adhesive sheet is in contact with the electrolyte solution.

Abstract: The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.

Abstract: [Object] To provide a semiconductor protective film capable of suppressing a warpage of a semiconductor chip without impairing productivity and reliability, a semiconductor device including this, and a composite sheet. [Solving Means] A semiconductor protective film 10 according to an embodiment of the present invention includes a protective layer 11 formed of a non-conductive inorganic material and an adhesive layer 12 provided on one surface of the protective layer 11. The protective layer 11 includes at least a vitreous material and is typically formed of plate glass. Accordingly, a warpage of a semiconductor element as a protection target can be suppressed effectively.

Abstract: [Problems] An object is to provide a pressure sensitive adhesive composition, a pressure sensitive adhesive sheet for batteries, and a lithium-ion battery in which the pressure sensitive adhesive is less likely to dissolve into an electrolyte solution even when the pressure sensitive adhesive sheet is in contact with the electrolyte solution. [Solution] A battery (2) comprising a pressure sensitive adhesive sheet (1), wherein: the pressure sensitive adhesive sheet is used at a site in the battery at which there is a possibility of contact with an electrolyte solution; the pressure sensitive adhesive sheet comprises a base material (11) and a pressure sensitive adhesive layer (13) laminated at one side of the base material; and the pressure sensitive adhesive layer is formed of a pressure sensitive adhesive composition comprising: a (meth)acrylic ester polymer containing a monomer having a carboxy group in a molecule as a monomer unit that constitutes the polymer; and a metal chelate-based crosslinker.

Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2 ??(a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m-n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].

Abstract: A laminate includes: a carbon nanotube sheet including a plurality of carbon nanotubes aligned preferentially in one direction within a plane of the sheet; and a first protection material having a surface in contact with the carbon nanotube sheet, the surface having a surface roughness Ra1 of 0.05 ?m or more.

Abstract: A cover film for testing which can be well fixed to a substrate having a groove and with which a material that constitutes an adhesive layer does not invade into the groove and a specimen can be easily stored in the groove, providing a testing member including the cover film for testing, and providing a method of manufacturing the cover film for testing. The cover film for testing comprises a base material, a hydrophilic coating layer laminated on a surface of the base material, and an adhesive layer partially laminated on a surface of the hydrophilic coating layer opposite to the base material, whereby the cover film for testing has a region in which the adhesive layer is absent and the hydrophilic coating layer is exposed.

Abstract: Provided is a release sheet including a substrate and a release layer, wherein the release layer is composed of a crosslinked product of a resin composition containing a polyolefin resin having a reactive functional group and a crosslinking agent; and the content of the polyolefin resin having a reactive functional group is from 50 to 90% by mass, and the content of the crosslinking agent is from 7 to 45% by mass, relative to the whole amount of the resin composition.

Abstract: L1 is a maximum distance across a non-contacting section between intersection points of a straight line crossing the non-contacting section in parallel with an alignment direction of a carbon nanotubes in a plan view of a mounting section with a border between the non-contacting section and a contacting section. L2 is a maximum distance across the non-contacting section between intersection points of a straight line crossing the non-contacting section and intersecting the alignment direction of the carbon nanotubes in the plan view of the mounting section with the border between the non-contacting section and the contacting section. When L1 is larger than L2, at least L2 is more than 0 mm and less than 10 mm. When smaller, at least L1 is more than 0 mm and less than 10 mm. When equal, L1 and L2 are each more than 0 mm and less than 10 mm.

Abstract: The present invention is: a curable composition comprising a component (A), a component (B), and a component (C), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:50, the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1), R1SiO3/2??(a-1) wherein R1 is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group, the component (B) being fine particles having an average primary particle size of 5 to 40 nm, and the component (C) being a silane coupling agent that comprises an acid anhydride structure in its molecule.

Abstract: A light diffusion film having an internal structure in the film. The internal structure includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The light diffusion film has an indentation elastic modulus of 30 MPa or more at 23° C.