Patents Assigned to Littelfuse Electronics (Shanghai) Co., Ltd.
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Patent number: 11881337Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.Type: GrantFiled: November 23, 2018Date of Patent: January 23, 2024Assignee: Littelfuse Electronics (Shanghai) Co., Ltd.Inventors: Jianhua Chen, Chun-Kwan Tsang, Zhiyong Zhou, Yingsong Fu, Edward W. Rutter, Jr.
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Patent number: 11854723Abstract: Approaches provided herein include a protection device assembly having a protection component and a first electrode layer extending along a first main side of the protection component. The first electrode layer may include a first section separated from a second section by a first gap. The assembly may further include a second electrode layer extending along a second main side of the protection component, the second electrode layer including a third section separated from a fourth section by a second gap, wherein the first gap is aligned with the second gap. The assembly may further include a first insulation layer disposed over the first electrode layer, and a second insulation layer disposed over the second electrode layer. The assembly may further include a solder pad extending around an end of the protection component, the solder pad further extending over the first insulation layer and the second insulation layer.Type: GrantFiled: March 22, 2019Date of Patent: December 26, 2023Assignee: LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Jianhua Chen, Bing Wang, Pinghong Li, Cheng Hu
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Patent number: 11303188Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.Type: GrantFiled: August 20, 2019Date of Patent: April 12, 2022Assignees: LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD., LITTELFUSE FRANCE SASInventors: Werner Johler, Philippe Di Fulvio
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Publication number: 20220013259Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.Type: ApplicationFiled: November 23, 2018Publication date: January 13, 2022Applicant: Littelfuse Electronics (Shanghai) Co., Ltd.Inventors: Jianhua Chen, Chun-Kwan Tsang, Zhiyong Zhou, Yingsong Fu, Edward W. Rutter, Jr.
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Publication number: 20210202138Abstract: Approaches provided herein include a protection device assembly having a protection component and a first electrode layer extending along a first main side of the protection component. The first electrode layer may include a first section separated from a second section by a first gap. The assembly may further include a second electrode layer extending along a second main side of the protection component, the second electrode layer including a third section separated from a fourth section by a second gap, wherein the first gap is aligned with the second gap. The assembly may further include a first insulation layer disposed over the first electrode layer, and a second insulation layer disposed over the second electrode layer. The assembly may further include a solder pad extending around an end of the protection component, the solder pad further extending over the first insulation layer and the second insulation layer.Type: ApplicationFiled: March 22, 2019Publication date: July 1, 2021Applicant: Littelfuse Electronics (Shanghai) Co., Ltd.Inventors: Jianhua Chen, Bing Wang, Pinghong LI, Cheng HU
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Publication number: 20190379259Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.Type: ApplicationFiled: August 20, 2019Publication date: December 12, 2019Applicants: Littelfuse Electronics (Shanghai) Co., Ltd., Littelfuse France SASInventors: Werner Johler, Philippe Di Fulvio
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Patent number: 10447117Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.Type: GrantFiled: October 21, 2016Date of Patent: October 15, 2019Assignees: Littelfuse Electronics (Shanghai) Co., Ltd., Littelfuse France SASInventors: Werner Johler, Philippe Di Fulvio
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Patent number: 10280279Abstract: The present invention provides a conductive polymer composition, a conductive polymer sheet, an electrical device, and their preparation methods. The conductive polymer composition of the present invention includes a polymer and a conductive powder at a volume ratio of 35:65 to 65:35. The polymer includes at least one semicrystalline polymer selected from polyolefin, a copolymer of at least one olefin and at least one non-olefinic monomer copolymerizable therewith, and a thermoformable fluorine-containing polymer. The stated conductive powder includes at least one powder of a transition metal carbide, a transition metal carbon silicide, a transition metal carbon aluminide, and a transition metal carbon stannide. And the stated size distribution of the conductive powder satisfies: 20>D100/D50>6, where D50 denotes a corresponding particle size when a cumulative particle-size distribution percent in the conductive powder reaches 50%, and D100 denotes a maximum particle size.Type: GrantFiled: June 30, 2016Date of Patent: May 7, 2019Assignees: LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD, LITTELFUSE, INC.Inventors: Yingsong Fu, Jianhua Chen, Mingjun Jin, Zhiyong Zhou, Wei Zheng, Cheng Hu
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Patent number: 10199632Abstract: A method of protecting a battery pack in which first and second battery cells, each having a positive electrode, a negative electrode, and an edge are aligned so that the positive electrodes of the first and second battery cells are adjacent. An electrically conductive busbar configured to be positioned on an edge of the first and second battery cells electrically connects the positive electrode of the first battery cell to a first protection device, the positive electrode of the second battery cell to a second protection device, the first protection device to the second protection device, and the negative electrode of the first battery cell to the negative electrode of the second battery cell. Also provided is a battery pack protection assembly.Type: GrantFiled: February 26, 2016Date of Patent: February 5, 2019Assignees: LITTELFUSE, INC., LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Werner Johler, Jianhua Chen
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Patent number: 10181368Abstract: A circuit protection device including a PTC device and a diode. A first insulation layer is formed between first electrode surfaces of the diode and the PTC device. Vias for thermally and electrically connecting the first electrode surfaces of the diode and the PTC device are formed in the first insulation layer. First, second, and third external electrode pads are provided on a second insulation layer formed on the second electrode surface of the PTC device. The second electrode surface of the PTC device is electrically connected to the first external electrode pad. The first electrode surface of the diode and the first electrode surface of the PTC device are electrically connected to the second external electrode pad. A second electrode surface of the diode is electrically connected to the third external electrode pad.Type: GrantFiled: August 12, 2015Date of Patent: January 15, 2019Assignee: Littelfuse Electronics (Shanghai) Co., Ltd.Inventors: Jianzhe Ye, Bin Wang, Hui Hu, Tao Guo, Jianyong Liu