Patents Assigned to Littelfuse Electronics (Shanghai) Co., Ltd.
  • Patent number: 11881337
    Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: January 23, 2024
    Assignee: Littelfuse Electronics (Shanghai) Co., Ltd.
    Inventors: Jianhua Chen, Chun-Kwan Tsang, Zhiyong Zhou, Yingsong Fu, Edward W. Rutter, Jr.
  • Patent number: 11854723
    Abstract: Approaches provided herein include a protection device assembly having a protection component and a first electrode layer extending along a first main side of the protection component. The first electrode layer may include a first section separated from a second section by a first gap. The assembly may further include a second electrode layer extending along a second main side of the protection component, the second electrode layer including a third section separated from a fourth section by a second gap, wherein the first gap is aligned with the second gap. The assembly may further include a first insulation layer disposed over the first electrode layer, and a second insulation layer disposed over the second electrode layer. The assembly may further include a solder pad extending around an end of the protection component, the solder pad further extending over the first insulation layer and the second insulation layer.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: December 26, 2023
    Assignee: LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Jianhua Chen, Bing Wang, Pinghong Li, Cheng Hu
  • Patent number: 11303188
    Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: April 12, 2022
    Assignees: LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD., LITTELFUSE FRANCE SAS
    Inventors: Werner Johler, Philippe Di Fulvio
  • Publication number: 20220013259
    Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.
    Type: Application
    Filed: November 23, 2018
    Publication date: January 13, 2022
    Applicant: Littelfuse Electronics (Shanghai) Co., Ltd.
    Inventors: Jianhua Chen, Chun-Kwan Tsang, Zhiyong Zhou, Yingsong Fu, Edward W. Rutter, Jr.
  • Publication number: 20210202138
    Abstract: Approaches provided herein include a protection device assembly having a protection component and a first electrode layer extending along a first main side of the protection component. The first electrode layer may include a first section separated from a second section by a first gap. The assembly may further include a second electrode layer extending along a second main side of the protection component, the second electrode layer including a third section separated from a fourth section by a second gap, wherein the first gap is aligned with the second gap. The assembly may further include a first insulation layer disposed over the first electrode layer, and a second insulation layer disposed over the second electrode layer. The assembly may further include a solder pad extending around an end of the protection component, the solder pad further extending over the first insulation layer and the second insulation layer.
    Type: Application
    Filed: March 22, 2019
    Publication date: July 1, 2021
    Applicant: Littelfuse Electronics (Shanghai) Co., Ltd.
    Inventors: Jianhua Chen, Bing Wang, Pinghong LI, Cheng HU
  • Publication number: 20190379259
    Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.
    Type: Application
    Filed: August 20, 2019
    Publication date: December 12, 2019
    Applicants: Littelfuse Electronics (Shanghai) Co., Ltd., Littelfuse France SAS
    Inventors: Werner Johler, Philippe Di Fulvio
  • Patent number: 10447117
    Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: October 15, 2019
    Assignees: Littelfuse Electronics (Shanghai) Co., Ltd., Littelfuse France SAS
    Inventors: Werner Johler, Philippe Di Fulvio
  • Patent number: 10280279
    Abstract: The present invention provides a conductive polymer composition, a conductive polymer sheet, an electrical device, and their preparation methods. The conductive polymer composition of the present invention includes a polymer and a conductive powder at a volume ratio of 35:65 to 65:35. The polymer includes at least one semicrystalline polymer selected from polyolefin, a copolymer of at least one olefin and at least one non-olefinic monomer copolymerizable therewith, and a thermoformable fluorine-containing polymer. The stated conductive powder includes at least one powder of a transition metal carbide, a transition metal carbon silicide, a transition metal carbon aluminide, and a transition metal carbon stannide. And the stated size distribution of the conductive powder satisfies: 20>D100/D50>6, where D50 denotes a corresponding particle size when a cumulative particle-size distribution percent in the conductive powder reaches 50%, and D100 denotes a maximum particle size.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: May 7, 2019
    Assignees: LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD, LITTELFUSE, INC.
    Inventors: Yingsong Fu, Jianhua Chen, Mingjun Jin, Zhiyong Zhou, Wei Zheng, Cheng Hu
  • Patent number: 10199632
    Abstract: A method of protecting a battery pack in which first and second battery cells, each having a positive electrode, a negative electrode, and an edge are aligned so that the positive electrodes of the first and second battery cells are adjacent. An electrically conductive busbar configured to be positioned on an edge of the first and second battery cells electrically connects the positive electrode of the first battery cell to a first protection device, the positive electrode of the second battery cell to a second protection device, the first protection device to the second protection device, and the negative electrode of the first battery cell to the negative electrode of the second battery cell. Also provided is a battery pack protection assembly.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: February 5, 2019
    Assignees: LITTELFUSE, INC., LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Werner Johler, Jianhua Chen
  • Patent number: 10181368
    Abstract: A circuit protection device including a PTC device and a diode. A first insulation layer is formed between first electrode surfaces of the diode and the PTC device. Vias for thermally and electrically connecting the first electrode surfaces of the diode and the PTC device are formed in the first insulation layer. First, second, and third external electrode pads are provided on a second insulation layer formed on the second electrode surface of the PTC device. The second electrode surface of the PTC device is electrically connected to the first external electrode pad. The first electrode surface of the diode and the first electrode surface of the PTC device are electrically connected to the second external electrode pad. A second electrode surface of the diode is electrically connected to the third external electrode pad.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: January 15, 2019
    Assignee: Littelfuse Electronics (Shanghai) Co., Ltd.
    Inventors: Jianzhe Ye, Bin Wang, Hui Hu, Tao Guo, Jianyong Liu