Abstract: A vibratory tube-to-tube transfer system for transferring the contents of an input tube to an output tube is disclosed. The system includes an alignment fixture having an input section for receiving an input tube loaded with ICs and an output section for receiving an empty output tube. A support plate supports the alignment fixture and a directional vibrator is affixed to the support plate for vibrating the alignment fixture and effecting the transfer of the contents of the input tube to the output tube. An equal number of input tubes and output tubes, such as eight of each, are accommodated by the transfer system.

Abstract: A high-speed receiver/latch is implemented by incorporating a differential amplifier/comparator directly into the feedback loop of a latch function. Both transparent and edge-triggered variants are possible. The resulting circuit is capable of extremely high-speed operation by virtue of very small setup time and small propagation delay.

Abstract: A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be applied to the preformed planar structure in order that flux is selectively applied to the solder balls (pads) on the chip and the substrate. The preformed planar structure may be provided with through holes in registration with the solder balls on the chip(s) and the substrate. In this case, liquid flux selectively fills the through holes for delivery to the solder balls during soldering. The through holes also aid in maintaining registration of the chip(s) and the substrate. The through holes may be sized to establish a predetermined mechanical structure of solder joints formed by the solder balls when fused together. The preformed planar structure has a planar core and opposing planar faces.