Abstract: A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece.
Type:
Grant
Filed:
June 9, 2000
Date of Patent:
February 8, 2005
Assignee:
LSP Technologies Inc.
Inventors:
Steven M. Toller, Allan H. Clauer, Jeff L. Dulaney
Abstract: A method of controlling the application of laser peening overlays on the surface of a workpiece to reduce the variability of shock waves generated therein, comprises applying an energy-absorbing overlay to a portion of the surface of a workpiece, measuring the thickness of the energy-absorbing overlay in at least one location on the energy-absorbing overlay, applying a transparent overlay material over the energy-absorbing overlay, measuring the thickness of the transparent overlay in at least one location on the transparent overlay, determining if the measured values for each overlay is within a specified range, and directing a pulse of coherent energy to the workpiece to create a shock wave therein when the measured values are within the specified range.
Type:
Grant
Filed:
February 21, 2003
Date of Patent:
January 11, 2005
Assignee:
LSP Technologies Inc.
Inventors:
Steven E. Dykes, Allan H. Clauer, Jeff L. Dulaney, David F. Lahrman, Mark O'Loughlin