Patents Assigned to LSP Technologies Inc.
  • Publication number: 20230330772
    Abstract: An apparatus for directing a laser beam to a workpiece surface includes a housing having a laser beam exit aperture. The apparatus further includes an output optical device configured to emit a converging laser beam. The converging laser beam is centered on an axis and is directed outward from the housing through the exit aperture toward a workpiece surface. A water nozzle outlet is arranged to discharge a stream of overlay water toward the workpiece surface. An air nozzle outlet is arranged to discharge a stream of air in a direction transverse to the axis at a location axially between the water nozzle and the exit aperture.
    Type: Application
    Filed: January 19, 2023
    Publication date: October 19, 2023
    Applicant: LSP Technologies, Inc.
    Inventors: Gary A. Walzer, Jeffrey A. Jewell, Devin R. Hilty, Erich Zelmer, Daniel Merrifield, Michael Snethen, Mark Bloomberg, Keith Glover, Avery Calhoun, Adam Hinerman, Roger S. Weikel, Tim Gorman
  • Publication number: 20230098272
    Abstract: An apparatus is provided, the apparatus comprising: (i) a diode-pumped solid-state laser oscillator configured to generate a pulsed laser beam having predefined beam characteristics corresponding to a current setting selection of a controller; and (ii) an amplifier configured to amplify an energy and modify a beam profile of the pulse laser beam. A beam detector is coupled to the generated beam to monitor a combination of: (i) a beam pulse width; (ii) a beam diameter; and (iii) an energy level, and generates an error signal to be sent back as a feedback signal to the controller. The controller configures the current source to output a correction current to tune the DPSSL oscillator, the wave plate, and the first polarizer to rotate a correction polarization angle and adjust the energy amplification or temporal profile to within a defined performance tolerance.
    Type: Application
    Filed: March 7, 2021
    Publication date: March 30, 2023
    Applicant: LSP Technologies, Inc.
    Inventors: Tianyi Michael Yao, Jeff L Dulaney, Keith Glover, Daniel Merrifield, Mark E. O'Loughlin
  • Patent number: 11433476
    Abstract: A laser shock peening apparatus is provided for use with a workpiece having a cavity. The apparatus includes a tubular body configured for insertion longitudinally inward of the cavity. The tubular body has a peripheral wall bounding a laser delivery channel, and has an aperture reaching outward from the laser delivery channel through the peripheral wall. An optical device is located in the laser delivery channel. The optical device is configured to direct a laser beam outward through the aperture. Additionally, the peripheral wall has internal surfaces defining a water delivery channel configured to convey a stream of overlay water to the aperture.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 6, 2022
    Assignee: LSP Technologies, Inc.
    Inventors: Jeff Dulaney, Gary Grossenbacher
  • Publication number: 20220205060
    Abstract: A method for imparting a predetermined surface contour to a part is provided, the method comprising: identifying a compressive residual stress profile for providing the part with the predetermined surface contour; and laser peening a surface of the part in a treatment mode predetermined with reference to the identified compressive residual stress profile, thereby inducing plastic deformation in the part and thereby imparting a predetermined surface contour to the part that is a different surface contour than the part had prior to the laser peening.
    Type: Application
    Filed: March 15, 2022
    Publication date: June 30, 2022
    Applicant: LSP Technologies, inc.
    Inventors: Stanley C. Bovid, David F. Lahrman, Jeff L. Dulaney
  • Patent number: 11273521
    Abstract: Ballistic failure resistance is imparted to metallic ballistic armor plate by identifying a compressive residual stress profile for mitigating a predetermined ballistic failure mode in a metallic ballistic armor plate component, and imparting the identified compressive residual stress profile to the component by laser peening the component in a treatment mode predetermined with reference to the identified compressive residual stress profile.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: March 15, 2022
    Assignee: LSP Technologies, Inc.
    Inventors: Jeff L. Dulaney, David F. Lahrman, Daniel Ryan Georgiadis, Richard Daniel Hepburn
  • Publication number: 20210372881
    Abstract: Systems, methods and device provided for combining or splitting laser beams, including a plurality of optical fibers for providing laser beams, an image relay lens for each of the plurality of optical fibers, positioning a prism beam combiner or splitter after the image relay lenses for combining or splitting the laser beams. According to another aspect, the a prism beam combiner or splitter may include a flattened tip to transmit a portion of an input laser beam, a position sensitive detector to receive the transmitted portion of the input laser beam to track a beam axis motion and provide feedback alignment error signals based on the beam axis motion, and a driver to receive the feedback alignment error signals and to drive a motor or piezo actuated beam steering minor based on the feedback alignment error signals, wherein a laser bond inspection method implements the described systems and methods.
    Type: Application
    Filed: October 1, 2019
    Publication date: December 2, 2021
    Applicant: LSP Technologies, inc.
    Inventors: Craig T. Walters, David Sokol
  • Publication number: 20210083446
    Abstract: An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5J to about 10 J, an average power (defined as energy (J)×frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.
    Type: Application
    Filed: September 21, 2020
    Publication date: March 18, 2021
    Applicant: LSP Technologies, Inc.
    Inventors: Jeff Dulaney, David W. Sokol, Mark E. O'Loughlin, Keith Glover, Gary May
  • Patent number: 10819079
    Abstract: An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5 J to about 10 J, an average power (defined as energy (J)×frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: October 27, 2020
    Assignee: LSP Technologies, Inc.
    Inventors: Jeff Dulaney, David Sokol, Mark E. O'Loughlin, Keith Glover, Gary May
  • Patent number: 10365479
    Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: July 30, 2019
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, David Sokol, Mark E. O'Loughlin, Jeff L. Dulaney
  • Patent number: 10232470
    Abstract: Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser shock peening applications. In one embodiment, a system for temporal pulse shaping of a laser beam used for laser shock peening comprises a laser; a modulator; a high voltage driver, a waveform generator, a polarizer, and an optical amplifier.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: March 19, 2019
    Assignee: LSP Technologies, Inc.
    Inventors: David Sokol, Jeff Dulaney, Allan Clauer
  • Patent number: 9525261
    Abstract: Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser bond inspection applications.
    Type: Grant
    Filed: May 23, 2015
    Date of Patent: December 20, 2016
    Assignee: LSP Technologies, Inc.
    Inventors: David Sokol, Jeff Dulaney, Allan Clauer
  • Patent number: 9227268
    Abstract: Methods, systems, and apparatuses are disclosed for improving fatigue strength and damage tolerance of metal materials. For example, a system is provided for laser shock peening a metal material, the system comprising: a momentum trap material; a laser; an actuator, capable of pressing the momentum trap material into intimate contact with a first side of the metal material; and an advancer, capable of advancing the momentum trap material relative to the first side of the metal material.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: January 5, 2016
    Assignee: LSP Technologies, Inc.
    Inventors: Nickolas K. McCoy, Jeff L. Dulaney, Steven M. Toller
  • Patent number: 9201017
    Abstract: Methods, systems, and apparatuses are disclosed for using Photon Doppler Velocimetry for laser bond inspection.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: December 1, 2015
    Assignee: LSP Technologies, Inc.
    Inventors: David F. Lahrman, Richard D. Tenaglia
  • Patent number: 9144861
    Abstract: Methods, systems, and apparatuses are disclosed for laser peening hidden surfaces. In one embodiment, a laser processing pen is provided, the laser processing pen comprising: an elongated member, comprising: a laser pulse entry portion; a laser pulse exit portion, wherein the laser pulse exit portion includes at least one optical lens; and at least one tape guide capable of channeling at least a non-adhesive tape overlay in proximity of the laser pulse exit portion.
    Type: Grant
    Filed: June 3, 2012
    Date of Patent: September 29, 2015
    Assignee: LSP Technologies, Inc.
    Inventors: David W. Sokol, Jeff L. Dulaney, Nickolas K. McCoy
  • Patent number: 8785814
    Abstract: Systems and methods for the protection of optics are provided. In one example embodiment, a laser processing system is provided, the laser processing system comprising a laser source and an optic. The laser processing system may further comprise at least one of a liquid delivery mechanism configured to deposit liquid on the optic and an evacuation mechanism.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: July 22, 2014
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Ronald L. Johnson
  • Patent number: 8156811
    Abstract: A diagnostic means to enable real-time inspection of bonded structures. The disclosed apparatus detects bond failure stress waves on-axis from the front side (beam application side). Pi-box and pi-rail EMAT gauges can be used with the disclosed apparatus. An inductively coupled EMAT may also be employed. An improved means to remotely deliver an interrogating laser beam to a surface is provided. The process head may utilize a water column or a water film. The water film process head may include the use of either a single water film or two spaced apart water films. The disclosed apparatus can be used with bonded composite structures, bonded structures using various materials, and to determine the dynamic strength of unbonded solid materials. The apparatus may also be used in other applications that require remote flexible delivery of a localized stress wave to a material and/or diagnosis of the resultant stress waves.
    Type: Grant
    Filed: September 15, 2005
    Date of Patent: April 17, 2012
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Craig T. Walters
  • Patent number: 8132460
    Abstract: Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: March 13, 2012
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Jeff L. Dulaney
  • Publication number: 20110132886
    Abstract: The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.
    Type: Application
    Filed: December 7, 2010
    Publication date: June 9, 2011
    Applicant: LSP Technologies, Inc.
    Inventors: Richard D. Tenaglia, Jeff L. Dulaney, David F. Lahrman
  • Publication number: 20110126605
    Abstract: A bend bar is available for use in a quality control test for testing for a consistency of residual stress effects in a particular material using a given a laser peening process. The bar is composed of the particular material to be tested and has a bar length and a bar thickness. The particular material has a characteristic maximum stress penetration depth for compressive residual stresses that can be formed in using the given laser peening process. The bar thickness is chosen so as to be at least twice the characteristic maximum stress penetration depth. The bar has a test surface that extends parallel to the bar length and perpendicular to the bar thickness. After forming a spot pattern on the test surface using the given laser peening process, the deflection generated in the bar due to the compressive residual stresses induced by laser peening can then be measured and used as a quality control measurement.
    Type: Application
    Filed: February 8, 2011
    Publication date: June 2, 2011
    Applicant: LSP Technologies, Inc.
    Inventors: Richard D. Tenaglia, Allan H. Clauer, Jeff L. Dulaney, David F. Lahrman, Steve Toller
  • Patent number: RE43176
    Abstract: The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: February 14, 2012
    Assignee: LSP Technologies, Inc.
    Inventors: Richard D. Tenaglia, Jeff L. Dulaney, David F. Lahrman