Patents Assigned to LSP Technologies Inc.
  • Patent number: 8156811
    Abstract: A diagnostic means to enable real-time inspection of bonded structures. The disclosed apparatus detects bond failure stress waves on-axis from the front side (beam application side). Pi-box and pi-rail EMAT gauges can be used with the disclosed apparatus. An inductively coupled EMAT may also be employed. An improved means to remotely deliver an interrogating laser beam to a surface is provided. The process head may utilize a water column or a water film. The water film process head may include the use of either a single water film or two spaced apart water films. The disclosed apparatus can be used with bonded composite structures, bonded structures using various materials, and to determine the dynamic strength of unbonded solid materials. The apparatus may also be used in other applications that require remote flexible delivery of a localized stress wave to a material and/or diagnosis of the resultant stress waves.
    Type: Grant
    Filed: September 15, 2005
    Date of Patent: April 17, 2012
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Craig T. Walters
  • Patent number: 8132460
    Abstract: Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: March 13, 2012
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Jeff L. Dulaney
  • Publication number: 20110132886
    Abstract: The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.
    Type: Application
    Filed: December 7, 2010
    Publication date: June 9, 2011
    Applicant: LSP Technologies, Inc.
    Inventors: Richard D. Tenaglia, Jeff L. Dulaney, David F. Lahrman
  • Publication number: 20110126605
    Abstract: A bend bar is available for use in a quality control test for testing for a consistency of residual stress effects in a particular material using a given a laser peening process. The bar is composed of the particular material to be tested and has a bar length and a bar thickness. The particular material has a characteristic maximum stress penetration depth for compressive residual stresses that can be formed in using the given laser peening process. The bar thickness is chosen so as to be at least twice the characteristic maximum stress penetration depth. The bar has a test surface that extends parallel to the bar length and perpendicular to the bar thickness. After forming a spot pattern on the test surface using the given laser peening process, the deflection generated in the bar due to the compressive residual stresses induced by laser peening can then be measured and used as a quality control measurement.
    Type: Application
    Filed: February 8, 2011
    Publication date: June 2, 2011
    Applicant: LSP Technologies, Inc.
    Inventors: Richard D. Tenaglia, Allan H. Clauer, Jeff L. Dulaney, David F. Lahrman, Steve Toller
  • Patent number: 7906745
    Abstract: A bend bar is available for use in a quality control test for testing for a consistency of residual stress effects in a particular material using a given a laser peening process. The bar is composed of the particular material to be tested and has a bar length and a bar thickness. The particular material has a characteristic maximum stress penetration depth for compressive residual stresses that can be formed in using the given laser peening process. The bar thickness is chosen so as to be at least twice the characteristic maximum stress penetration depth. The bar has a test surface that extends parallel to the bar length and perpendicular to the bar thickness. After forming a spot pattern on the test surface using the given laser peening process, the deflection generated in the bar due to the compressive residual stresses induced by laser peening can then be measured and used as a quality control measurement.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: March 15, 2011
    Assignee: LSP Technologies, Inc.
    Inventors: Richard D. Tenaglia, Allan H. Clauer, Jeff L. Dulaney, David F. Lahrman, Steve Toller
  • Patent number: 7868268
    Abstract: The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: January 11, 2011
    Assignee: LSP Technologies, Inc.
    Inventors: Richard D. Tenaglia, Jeff L. Dulaney, David F. Lahrman
  • Patent number: 7861573
    Abstract: Laser shock methods and systems are disclosed for evaluating impact resistance of materials, and for simulating and evaluating threshold conditions where damage may occur.
    Type: Grant
    Filed: November 28, 2007
    Date of Patent: January 4, 2011
    Assignee: LSP Technologies, Inc.
    Inventor: Richard D. Tenaglia
  • Patent number: 7775122
    Abstract: Tape overlays for use in laser bond inspection are provided, as well as laser bond inspection systems and methods utilizing tape overlays.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: August 17, 2010
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, David W. Sokol, Craig T. Walters
  • Patent number: 7776165
    Abstract: A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: August 17, 2010
    Assignee: LSP Technologies, Inc.
    Inventors: Jeff L. Dulaney, Steven M. Toller, Allan H. Clauer
  • Patent number: 7770454
    Abstract: A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: August 10, 2010
    Assignee: LSP Technologies, Inc.
    Inventors: David W. Sokol, Craig T. Walters, Jeff L. Dulaney, Steven M. Toller
  • Patent number: 7752953
    Abstract: A system for neutralizing a buried mine includes a laser that is configured to generate laser energy that communicates through the covering ground material and accesses the mine in a manner sufficient to neutralize the mine. Neutralization can occur by deflagration or detonation. The laser includes a solid-state lasing medium that is run substantially uncooled during the lasing run. Namely, the lasing medium is operated without cooling until the lasing medium reaches a temperature where thermal population in a lower laser level begins to significantly lower inversion density. Following completion of the lasing run, the lasing medium is cooled at a rate limited only by a thermal stress fracture level of the lasing medium. Operation of the laser in this manner permits the laser to deliver high-irradiance, high-repetition rate pulses according to a burst mode operation that successfully accomplishes neutralization in a desired time period.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: July 13, 2010
    Assignee: LSP Technologies, Inc.
    Inventors: David W. Sokol, Jeff L. Dulaney, Craig T. Walters
  • Patent number: 7735377
    Abstract: Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: June 15, 2010
    Assignees: LSP Technologies, Inc., The Boeing Company
    Inventors: David W. Sokol, Craig T. Walters, Steven M. Toller, Richard H. Bossi, Kevin R. Housen
  • Patent number: 7509876
    Abstract: Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: March 31, 2009
    Assignees: LSP Technologies, Inc., The Boeing Company
    Inventors: David W. Sokol, Craig T. Walters, Kevin R. Houson, Richard H. Bossi, Steven M. Toller
  • Patent number: 7470335
    Abstract: A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece.
    Type: Grant
    Filed: December 27, 2004
    Date of Patent: December 30, 2008
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Allan H. Clauer, Jeff L. Dulaney
  • Patent number: 7321105
    Abstract: A laser peening apparatus is available for laser peening a hidden surface of a workpiece, the hidden surface not being line-of-sight accessible to laser energy for treatment thereof. The apparatus includes a pulsed laser system and a laser directing unit. The pulsed laser system is configured for generating the laser energy used for laser peening. The laser directing unit operatively receives and channels the laser energy generated by the pulsed laser system. The laser directing unit includes a laser transmission end and is capable of variably and selectively positioning that laser transmission end. The laser directing unit is thereby configured for variably and selectively directing laser energy upon the hidden surface via the laser transmission end.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: January 22, 2008
    Assignee: LSP Technologies, Inc.
    Inventors: Allan H. Clauer, Jeff L. Dulaney, David F. Lahrmann, David Sokol
  • Patent number: 7268317
    Abstract: The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.
    Type: Grant
    Filed: September 2, 2003
    Date of Patent: September 11, 2007
    Assignee: LSP Technologies, Inc.
    Inventors: Richard D. Tenaglia, Jeff L. Dulaney, David F. Lahrman
  • Patent number: 6875953
    Abstract: Various laser shock processing methods are provided to establish selective compressive residual stress distribution profiles within a workpiece. An asymmetrical stress distribution profile may be formed through the thickness of a thin section of a gas turbine engine airfoil. One method involves simultaneously irradiating a workpiece with a set of laser beams to form a corresponding set of adjacent non-overlapping laser shock peened surfaces, enabling the shockwaves to encounter one another. Additionally, opposite sides of the workpiece may be irradiated at different times to form opposing laser shock peened surfaces, enabling the shockwaves to meet at a location apart from the mid-plane. Furthermore, opposite sides of the workpiece may be irradiated simultaneously using laser beams having different pulse lengths to form opposing laser shock peened surfaces. Moreover, opposite sides of the workpiece may be irradiated simultaneously to form a set of laterally offset laser shock peened surfaces.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: April 5, 2005
    Assignee: LSP Technologies, Inc.
    Inventors: Allan H. Clauer, David F. Lahrman, Jeff L. Dulaney, Steven M. Toller
  • Patent number: 6867390
    Abstract: The present invention enables the processing head to locate itself precisely on the surface of the structure being processed, and to then reposition itself correctly for the next laser spot. Further, the present invention will complete processing a laser peened area, the area including a multiplicity of spots arranged in a specific pattern, and correctly laser peen each spot in the area under control of a controller including control linkages with the laser. The invention further provides an automated laser peening processing head encompassing spatial position sensing and locating means, as well as programmed spatial positioning, application of overlay materials, verification of proper overlay condition and positioning, and notification of the laser to pulse the surface of the structure.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: March 15, 2005
    Assignee: LSP Technologies, Inc
    Inventors: Allan H. Clauer, Jeff L. Dulaney, David F. Lahrman
  • Patent number: 6852179
    Abstract: A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: February 8, 2005
    Assignee: LSP Technologies Inc.
    Inventors: Steven M. Toller, Allan H. Clauer, Jeff L. Dulaney
  • Patent number: RE43176
    Abstract: The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: February 14, 2012
    Assignee: LSP Technologies, Inc.
    Inventors: Richard D. Tenaglia, Jeff L. Dulaney, David F. Lahrman