Abstract: A semiconductor device including a semiconductor chip, an insulating circuit board having a circuit pattern formed on an insulating plate, a case including a frame part having an opening that is substantially rectangular in a plan view of the semiconductor device, inner wall surfaces of the frame part at the opening forming a storage part to store the insulating circuit board, and a printed circuit board which has a flat plate shape and which protrudes from one of the inner wall surfaces of the frame part toward the storage part. The semiconductor device further includes a sealing material filled in the storage part, to thereby seal the semiconductor chip and the printed circuit board. A front surface of the sealing material forms a sealing surface, and in a thickness direction of the semiconductor chip, the sealing surface is higher around the printed circuit board than around the semiconductor chip.

Abstract: The present invention provides an image encoding method and an image decoding method. An image decoding method according to the present invention, for decoding an image by decoder-side motion information derivation, comprises the steps of: checking, from among a plurality of motion information derivation types, the motion information derivation type applied to the current block: and deriving motion information of the current block according to the checked motion information derivation type, wherein different motion information compensation techniques are applicable according to the motion information derivation type.

Abstract: Disclosed is a loudspeaker, including: a casing, a driving unit, and a vibration unit. The driving unit is fixed to the casing and is drivingly connected with the vibration unit. The driving unit includes a plurality of driving beams, each of the plurality of driving beams includes a fixed region and an overhanging region. Each of the plurality of driving beams is connected with the casing through its fixed region, and each of the plurality of driving beams is connected with the vibration unit through its overhanging region.

Abstract: The present invention relates to a method for inspecting a welding quality of an electrode tab-electrode lead welded portion of a pouch-type lithium secondary battery, and the method includes: recognizing welding traces of the welded portion by a vision inspection device; measuring a size of each of the recognized welding traces; and determining whether the welded portion has been weakly welded, excessively welded or normally welded by comparing the measured size with a reference value.

Abstract: In a system including a plurality of in-vehicle networks, information regarding the network configuration of function units connected to different types of transmission paths can be easily used. A relay device includes: an acquisition unit configured to acquire second function unit information of the function unit connected to the second transmission path, the second function unit information being function unit information that includes information regarding a network configuration of a layer of a lower order than an application layer; and a conversion unit configured to perform a conversion process of converting the second function unit information acquired by the acquisition unit into information that is able to be registered into a database of one or a plurality of pieces of first function unit information being function unit information of one or a plurality of the function units each connected to a corresponding first transmission path.

Abstract: A method of communication of a user equipment (UE), including: receiving, by the UE, a first information, the first information corresponds to a precoding applied to a transmission; receiving, by the UE, the transmission based on the first information, when the transmission is downlink transmission; or performing, by the UE, the transmission based on the first information, when the transmission is uplink transmission. A UE, a bases station (BS) and a method of communication of a BS are also provided.

Abstract: An imaging lens includes sequentially a first lens group, a second lens group having a positive refractive power, an aperture stop, a third lens group having a positive refractive power, and a fourth lens group. The first lens group includes, sequentially from the object side to the image side, a positive lens having a convex surface facing the object side, and a negative lens having a concave surface facing the image side. The second lens group includes a negative lens disposed closest to the object side and having a concave surface facing the object side, and a positive lens disposed closer than the negative lens to the image side and having a convex surface facing the object side. The third lens group includes a positive lens having a convex surface facing the image side, and a negative lens. The fourth lens group includes a negative lens having a concave surface.

Abstract: The disclosure relates to a method and apparatus by which a transmission terminal allocates resources in a vehicle-to-everything (V2X) system.

Abstract: A manufacturing method of an antimicrobial and adhesion-proof titanium tableware having a contact portion for contacting foods, food ingredients, drinking water, beverages, or body parts of a user. The manufacturing method includes a preparation step implemented by using a titanium substrate to produce a tableware preform; a preparation step implemented by using a titanium substrate to produce a tableware preform; a surface treatment step implemented by washing a surface of the tableware preform and removing a primary oxidation layer on the surface of the tableware preform; and an oxidation step which includes: placing the tableware preform in a vacuum calcination furnace, heating the tableware preform to reach a temperature ranging from 700° C. to 850° C., and introducing oxygen for allowing one part of the surface of the tableware preform corresponding to the contact portion to be exposed to the oxygen for 3 hours to 12 hours.

Abstract: A method, system, and circuit for providing a bandgap voltage reference are provided. In an example, the method includes producing a first bandgap curve based at least in part on a first circuit, a second circuit, an operational amplifier, and one or more feedback resistors, where the first circuit corresponds to a first voltage that is complementary to absolute temperature (CTAT) and the second circuit corresponds to a second voltage that is proportional to absolute temperature (PTAT). The method also includes providing a temperature independent compensation to the first bandgap curve based at least in part on a bandgap device, a biasing circuit, and a resistor; providing a non-temperature compensation to the first bandgap curve based at least in part on an adjustable divider circuit; and generating a resulting bandgap curve from the first bandgap curve.

Abstract: This disclosure discloses a method for detecting link failure of a sidelink and a terminal. The method includes: transmitting target information through a sidelink, where the target information includes a first reference signal or a data packet; and determining, if a transmission status of the target information meets a preset criterion, that no link failure occurs on the sidelink, and determining, if otherwise, that link failure occurs on the sidelink.

Abstract: A semiconductor device structure includes a source/drain (S/D) feature comprising a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface. The structure also includes a first silicide layer in contact with the first surface of the S/D feature, a second silicide layer opposing the first silicide layer and in contact with the second surface of the S/D feature, a front side S/D contact in contact with the first silicide layer, a back side S/D contact in contact with the second silicide layer, a semiconductor channel layer comprising a sidewall in contact with the sidewall of the source/drain feature, a gate dielectric layer surrounding exposed surfaces of the semiconductor layer, an interlayer dielectric (ILD) disposed adjacent to the gate dielectric layer, and a liner disposed between and in contact with the ILD and the gate dielectric layer.

Abstract: A storage system includes one or more storage nodes each having a non-volatile storage device, a storage controller, and a volatile memory, in which the storage device includes a plurality of base image storage areas including at least a first base image storage area and a second base image storage area as areas for storing entire predetermined information stored in the memory as a base image, and the storage controller starts processing to store a next base image in the second base image storage area when the base image storage with respect to the first base image storage area is complete, and reads out the storage-completed base image and restores the image to the memory in a case where the predetermined information is lost from the memory.

Abstract: A controller that controls a dump truck in such a manner that the dump truck travels on a travelling route and stops at a loading specified position is provided in the dump truck. The controller computes, from travelling route data, a front-rear direction (a first stop direction) of the dump truck in a case in which the dump truck has travelled on the travelling route and stopped at the loading specified position, and corrects the travelling route to compute a post-correction travelling route including the loading specified position as an end point in such a manner that an excavator is located on an extension line of the front-rear direction (a second stop direction) of the dump truck in a case in which the dump truck has travelled on the post-correction travelling route and stopped at the loading specified position, on the basis of the computed first stop direction, position data of the loading specified position, and swing center position data of the excavator.

Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

Abstract: An electronic device includes: (i) a first chiplet including a first seal ring, which is disposed in metal layers embedded between a first surface of the first chiplet, and a first substrate of the first chiplet, (ii) a second chiplet including a second seal ring, which is disposed in metal layers embedded between a second surface of the second chiplet, and a second substrate of the second chiplet, and (iii) a third seal ring, which surrounds the first and second chiplets and is disposed in a dielectric substrate extrinsic to the metal layers and overlaying the first and second surfaces of the first and second chiplets.