Abstract: The present invention relates to a process for the synthesis of Vortioxetine (I) or a pharmaceutically acceptable salt thereof. This process is accomplished by using a catalytic system consisting of a copper salt and an organic ligand, which can promote the formation of both C—N and C—S bond in one-pot, giving rise to an efficient, simple and industrially viable synthetic route for Vortioxetine.

Abstract: A rotary hook includes a bobbin case housing a lower thread bobbin, an inner rotary hook and an outer rotary hook. A needle drop hole is provided in an upper front surface of the inner rotary hook, and a recess is formed therein at a position deviated from the needle drop hole in a rotating direction of the outer rotary hook. The recess opens forward and upward and has a rear wall. The bobbin case provides with a thread take-up member for directing a lower thread, paid out from the lower thread bobbin, toward the recess. The lower thread paid out from the lower thread bobbin is passed through the recess via the thread take-up member and then directed to a needle hole of a needle plate provided above. With this arrangement, it is possible to structurally avoid occurrence of a hitch stitch caused by the lower thread.

Abstract: A compensating mechanism includes a base unit, a transmission unit, an adjusting cap and a rotation setting unit. The base unit includes a grooved portion that includes a first groove and a second groove communicated with the first groove. The second groove includes a first end and a second end opposite to the first end. The first end is connected to the first groove. The first end and the second end have a height difference therebetween in an axial direction of the base unit. The transmission unit is disposed on the base unit. The adjusting cap is connected to the transmission unit. The adjusting cap drives the transmission unit to rotate when the adjusting cap is rotated. The rotation setting unit includes a movable element that is movably disposed on the transmission unit to be connected to the grooved element or to be separated from the grooved element.

Abstract: An insulation monitoring method and system for a traction battery and an apparatus are proposed to solve the problem of how to accurately predict a risk of insulation deterioration of the traction battery before the insulation deterioration occurs on the traction battery, so as to provide an early warning about failures in the traction battery. In this method, data statistics on a large amount of insulation resistance values within a long period of time are collected, and whether the traction battery has the risk of insulation deterioration is determined by analysis based on a data statistical result; and if the traction battery has the risk of insulation deterioration, alarm information is output. In this method, based on data statistical analysis performed on the large amount of insulation resistance values within a long period of time, insulation deterioration can be predicted before the insulation deterioration occurs on the traction battery.

Abstract: A detection chip, a using method for the same, and a reaction system. The detection chip includes a first substrate, a micro-cavity defining layer, and a heating electrode. The micro-cavity defining layer is on the first substrate and defines a plurality of micro-reaction chambers. The heating electrode is on the first substrate and is closer to the first substrate than the micro-cavity defining layer, and is configured to heat a plurality of micro-reaction chambers. The orthographic projection of the plurality of micro-reaction chambers on the first substrate is within the orthographic projection of the heating electrode on the first substrate.

Abstract: A method for processing a heat exchanger includes: providing a heat exchange, in which a bent section of one heat exchange tube in the heat exchanger is at least partially in contact with a bent section of another heat exchange tube adjacent to it in a length direction of the first tube; placing the pushing member, such that the pushing member is at least partially in contact with a bent section of at least one heat exchange tube; moving the pushing member, and/or moving the heat exchange tube to enable the bent section to rotate by a predetermined angle or move by a predetermined distance relative to a first section connected with it, such that the bent section of one heat exchange tube is not in contact with the bent section of the other heat exchange tube adjacent to it in the length direction of the first tube.

Abstract: A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.

Abstract: A method for preparing a self-supporting substrate includes: preparing a thin film base structure including a first substrate layer, a thin film layer and a second substrate layer stacked in sequence; removing the first substrate layer from the thin film layer; continuing to grow a material the same as that of the thin film layer on a side of the thin film layer far away from the second substrate layer to prepare a thick film layer; and removing the second substrate layer from the thick film layer and remaining the thick film layer. In the method, a thin film may be grown on a substrate that has a larger diameter, and a thinness of the thin film will not cause the thin film and/or the substrate to crack. Therefore, a thin film that has a large diameter may be obtained so as to obtain a large-sized self-supporting thick film substrate.

Abstract: A wall mounted dishwasher incorporates storage into an exterior door of the dishwasher to facilitate user access to utensils stored in the dishwasher. The exterior door may be hinged and configured to rotate about a substantially vertical axis, and one or more spray devices and/or one or more fluid collection pans may be integrated into the exterior door.

Abstract: A sound reproducing apparatus is disclosed. The sound reproducing apparatus includes a signal processing unit, a first transducer, and a second transducer. The signal processing unit is configured to receive a sound signal and divide the sound signal into a first frequency component and a second frequency component. The first frequency component is at least partially different from the second frequency component, and the signal processing unit includes a delay unit configured to delay the second frequency band component. The first transducer is configured to convert the first frequency component from the signal processing unit into airborne sound. The second transducer is configured to convert the second frequency component from the delay unit into bone conduction sound.

Abstract: A listen before talk LBT subband division method, apparatus, device, and medium are provided. The method includes: obtaining first information, where the first information includes information about frequency domain starting and ending positions of a target, and the target includes a carrier or a bandwidth part BWP; and dividing the target into LBT subbands based on the information about the frequency domain starting and ending positions.

Abstract: A picture loading method includes an electronic device that obtains a first picture file. The first picture file includes a format field and a data field. The format field indicates a source format of the first picture file, and the data field includes pixel data of the first picture file. The electronic device determines, based on the source format of the first picture file, a rendering operation corresponding to the first picture file and renders the first picture file on a display.

Abstract: Disclosed is a method of manufacturing an insulating sheet, comprising: forming at least a groove on a flat sheet; a first cutting step for cutting a side surface of the groove by irradiating a laser beam to a side surface of the sheet; a second cutting step for cutting the insulating sheet to completely separate the groove from the insulating sheet by irradiating a laser beam from above the groove having the side surface cut; a tape attaching step for attaching a tape to an outer surface of the insulating sheet; and a bending step for bending one end portion of the surface of the insulating sheet having the tape attached toward a place where the tape is attached. It is possible to mass-produce the insulating sheets having a three-dimensional shape, regarded as being difficult to manufacture with a mold.

Abstract: A chip package structure is provided. The chip package structure includes a first semiconductor die bonded over an interposer substrate and a warpage release layer structure. The chip package structure also includes a first organic material layer covering an upper surface of the first semiconductor die; and a first metal layer covering an upper surface of the first organic material layer. The first metal layer has a planar shape that is the same as a planar shape of the first semiconductor die, as viewed in a top-view perspective.

Abstract: In a method of manufacturing a semiconductor device, a first fin structure, a second fin structure, a first wall fin structure and a second wall fin structure are formed over a substrate. The first and second fin structures are disposed between the first and second wall fin structures, and lower portions of the first and second fin structures and the first and second wall fin structures are embedded in the isolation insulating layer and upper portions thereof are exposed from the isolation insulating layer. A sidewall spacer layer is formed on sidewalls of the first and second fin structures. Source/drain regions of the first and second fin structures are recessed. An epitaxial source/drain structure is formed over the recessed first and second fin structures. A width W1 of the first and second fin structures is smaller than a thickness W2 of the sidewall spacer layer.

Abstract: Disclosed in embodiments of the present disclosure are a capacitive MEMS microphone, a microphone unit and an electronic device. The capacitive MEMS microphone includes: a back electrode plate; a diaphragm; and a spacer for separating the back electrode plate from the diaphragm, wherein in a state where an operating bias is applied, a ratio of a static effective displacement of the diaphragm relative to a flat position to a thickness of the diaphragm is greater than or equal to 0.5.